Multiscale ordered architecture in bismuth telluride alloys for miniature thermoelectric coolers.

Liu, Qiulin; Lu, Yandong; Zhu, Hangtian; Qian, Xin; Yang, Ronggui; Zhao, Huaizhou

Liu, Qiulin; Lu, Yandong; Zhu, Hangtian; Qian, Xin; Yang, Ronggui; Zhao, Huaizhou.

Afiliação

Liu Q; Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China; School of Physical Sciences, University of Chinese Academy of Sciences, Beijing 100049, China.
Lu Y; Optical Access Network Hardware Development Department, Huawei Technologies Co., Ltd., Shenzhen 226236, China.
Zhu H; Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China.
Qian X; School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.
Yang R; School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan 430074, China. Electronic address: ronggui@hust.edu.cn.
Zhao H; Beijing National Laboratory for Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China. Electronic address: hzhao@iphy.ac.cn.

Sci Bull (Beijing) ; 69(3): 295-298, 2024 Feb 15.

Article em En | MEDLINE | ID: mdl-38123431

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Sci Bull (Beijing) Ano de publicação: 2024 Tipo de documento: Article País de afiliação: China

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