Molecular Dynamics Simulation on Solidification Microstructure and Tensile Properties of Cu/SiC Composites.

Yan, Wanjun; Lu, Yuhang; Gao, Tinghong; Wang, Junjie; Tang, Xin; Wang, Nan

Yan, Wanjun; Lu, Yuhang; Gao, Tinghong; Wang, Junjie; Tang, Xin; Wang, Nan.

Afiliação

Yan W; College of Electronics and Information Engineering, Anshun University, Anshun 561000, China.
Lu Y; College of Electronics and Information Engineering, Anshun University, Anshun 561000, China.
Gao T; Institute of Advanced Optoelectronic Materials and Technology, College of Big Data and Information Engineering, Guizhou University, Guiyang 550025, China.
Wang J; Institute of Advanced Optoelectronic Materials and Technology, College of Big Data and Information Engineering, Guizhou University, Guiyang 550025, China.
Tang X; College of Electronics and Information Engineering, Anshun University, Anshun 561000, China.
Wang N; Institute of Advanced Optoelectronic Materials and Technology, College of Big Data and Information Engineering, Guizhou University, Guiyang 550025, China.

Molecules ; 29(10)2024 May 09.

Article em En | MEDLINE | ID: mdl-38792092

Palavras-chave

Cu/SiC composites; mechanical properties; molecular dynamics; rapid solidification

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Texto completo: 1 Coleções: 01-internacional Base de dados: MEDLINE Idioma: En Revista: Molecules Assunto da revista: BIOLOGIA Ano de publicação: 2024 Tipo de documento: Article País de afiliação: China

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