RESUMEN
The effect of the dual-etch surface roughening method consisting of dry etching and wet etching on the enhancement of light extraction of vertical light emitting diodes (VLEDs) is investigated. The surface of a VLED was roughened by dry etching using SiO2 spheres as the mask while a KOH solution was used for wet etching. After the surface of the VLED was roughened by the dual-etch method, the luminous efficiency of the VLED increased due to the formation of uniform, nano-scale cone shapes and the decreased flat area ratio of the total GaN surface. The VLED roughened by dual etching showed about 9.3% higher emitted luminous efficiency than the VLED roughened using wet etching.
RESUMEN
RF pulsed plasma characteristics of inductively coupled plasma (ICP) sources operated with internal linear type antennas for the next generation display processing were investigated. By applying the rf pulse mode in the ICP source, with decreasing the rf pulse duty percentage, the average electron temperature was decreased and the plasma non-uniformity was improved with decreasing the rf pulse duty percentage. In the case of plasma uniformity, for the same time average rf power of 3 kW to the ICP source, the plasma non-uniformity was improved from 8.4% at 100% of rf duty percentage to 6.4% at 60% of rf duty percentage due to the increased diffusion of the plasma during the pulse-off time. When SiO2 was etched using CF4, the etch rate uniformity was also improved due to the improvement of plasma uniformity.