An Improved STEM/EDX Quantitative Method for Dopant Profiling at the Nanoscale.

In this paper, an improved quantification technique for STEM/EDX measurements of 1D dopant profiles based on the Cliff-Lorimer equation is presented. The technique uses an iterative absorption correction procedure based on density models correlating the local mass density and composition of the specimen. Moreover, a calibration and error estimation procedure based on linear regression and error propagation is proposed in order to estimate the total measurement error in the dopant density. The proposed approach is applied to the measurement of the As profile in a nanodevice test structure. For the calibration, two crystalline Si specimens implanted with different As doses have been used, and the calibration of the Cliff-Lorimer coefficients has been carried out using Rutherford Back Scattering measurements. The As profile measurement has been carried out on an FinFET test structure, showing that quantitative results can be obtained in the nanometer scale and for dopant atomic densities lower than 1%. Using the proposed approach, the measurement error and detection limit for our experimental setup are calculated and the possibility to improve this limit by increasing the observation time is discussed.

ß-Disubstituted Pentacene Derivatives: Thin Film Structural Properties and Four-Probe Field Effect Mobility.

2,9- and 2,10-diphenylpentacene were synthesized by direct C-H borylation of ketal-protected pentacene, followed by halodeboronation, resolution of the dihalo isomers, Suzuki arylation, cleavage of the ketals and decarbonylation in the solid state. They were studied as main active components in organic field effect transistors (OFETs). Diphenyl substitution of pentacene affects the unit cell dimensions only slightly, preserving a face to edge molecular packing in the first layers of thin films evaporated on SiO2 substrates. Both isomers self-assemble into nanoribbons during the thin film growth upon vapor deposition. The similarity between the surface induced phases of the 2,9-isomer and unsubstituted pentacene leads to similar 4-probe hole mobilities, i. e. 0.13 cm2 V-1 s-1 for the former. Whereas 2,9-disubstitution thus does essentially preserve the thin film characteristics of unsubstituted pentacene, 2,10-disubstitution is detrimental to the molecular ordering in the thin films and therefore to the field effect mobility which is only 0.07 cm2 V-1 s-1. The known strong enhancement of field effect mobility observed upon diphenyl substitution of anthracene can thus not be emulated analogously with pentacene.

Large-Scale Monolithic Fabrication of III-V Vertical Nanowires on a Standard Si(100) Microelectronic Substrate.

Vertical III-V nanowires are of great interest for a large number of applications, but their integration still suffers from manufacturing difficulties of these one-dimensional nanostructures on the standard Si(100) microelectronic platform at a large scale. Here, a top-down approach based on the structure of a thin III-V epitaxial layer on Si was proposed to obtain monolithic GaAs or GaSb nanowires as well as GaAs-Si nanowires with an axial heterostructure. Based on a few complementary metal-oxide-semiconductor-compatible fabrication steps, III-V nanowires with a high crystalline quality as well as a uniform diameter (30 nm), morphology, positioning, and orientation were fabricated. In addition, the patterning control of nanowires at the nanoscale was thoroughly characterized by structural and chemical analyses to finely tune the key process parameters. To properly control the morphology of the nanowires during reactive-ion etching (RIE), the balance between the plasma properties and the formation of a protective layer on the nanowire sidewall was studied in detail. Furthermore, high-resolution microscopy analyses were performed to gain a better understanding of the protective layer's composition and to observe the crystalline quality of the nanowires. This approach paves the way for the possible scale-up integration of III-V-based nanowire devices with conventional Si/complementary metal-oxide-semiconductor technology.

A differential Hall effect measurement method with sub-nanometre resolution for active dopant concentration profiling in ultrathin doped Si1-x Ge x and Si layers.

In this paper, we present an enhanced differential Hall effect measurement method (DHE) for ultrathin Si and SiGe layers for the investigation of dopant activation in the surface region with sub-nanometre resolution. In the case of SiGe, which constitutes the most challenging process, we show the reliability of the SC1 chemical solution (NH4OH/H2O2/H2O) with its slow etch rate, stoichiometry conservation and low roughness generation. The reliability of a complete DHE procedure, with an etching step as small as 0.5 nm, is demonstrated on a dedicated 20 nm thick SiGe test structure fabricated by CVD and uniformly doped in situ during growth. The developed method is finally applied to the investigation of dopant activation achieved by advanced annealing methods (including millisecond and nanosecond laser annealing) in two material systems: 6 nm thick SiGeOI and 11 nm thick SOI. In both cases, DHE is shown to be a uniquely sensitive characterisation technique for a detailed investigation of dopant activation in ultrashallow layers, providing sub-nanometre resolution for both dopant concentration and carrier mobility depth profiles.