SiN integrated optical phased arrays for two-dimensional beam steering at a single near-infrared wavelength.

In this work, we present two-dimensional beam steering in the near-infrared using a SiN integrated circuit, containing optical phased arrays. Beam steering was achieved over a range of 17.6° × 3°, at a fixed wavelength of 905 nm. The first dimension was steered via phase differences between the optical phased array channels. The second dimension was accessed by actively switching between various optical phased array sub-devices containing output diffraction gratings with different periods. The characterisation was performed on a wafer-level test station.

30 GHz heterogeneously integrated capacitive InP-on-Si Mach-Zehnder modulators.

We demonstrate high-bandwidth O-band Mach-Zehnder modulators with indium phosphide-on-silicon (InP-on-Si) capacitive phase shifters that are compatible with heterogeneous laser fabrication processes. An electro-optic conversion efficiency of 1.3 V⋅cm and a 3 dB bandwidth of up to 30 GHz was observed for a phase modulator length of 250 µm at a 0 V bias. Open eye patterns were observed at up to 25 Gb/s.

Ultralow-loss tightly confining Si3N4 waveguides and high-Q microresonators.

Efficient nonlinear phenomena in integrated waveguides imply the realization in a nonlinear material of tightly confining waveguides sustaining guided modes with a small effective area with ultra-low propagation losses as well as high-power damage thresholds. However, when the waveguide cross-sectional dimensions keep shrinking, propagation losses and the probability of failure events tend to increase dramatically. In this work, we report both the fabrication and testing of high-confinement, ultralow-loss silicon nitride waveguides and resonators showing average attenuation coefficients as low as ∼3 dB/m across the S-, C-, and L bands for 1.6-µm-width × 800-nm-height dimensions, with intrinsic quality factors approaching ∼107 in the C band. The present technology results in very high cross-wafer device performance uniformities, low thermal susceptibility, and high power damage thresholds. In particular, we developed here an optimized fully subtractive process introducing a novel chemical-physical multistep annealing and encapsulation fabrication method, resulting in high quality Si3N4-based photonic integrated circuits for energy-efficient nonlinear photonics and quantum optics.

SiGe-enhanced Si capacitive modulator integration in a 300 mm silicon photonics platform for low power consumption.

The successful integration of capacitive phase shifters featuring a p-type strained SiGe layer in a 300 mm silicon photonics platform is presented. The phase shift is evaluated with a voltage swing of only 0.9 Vpp, compatible with CMOS technology. A good correlation is shown between the phase shift efficiency from 10 to 60°/mm and the capacitive oxide thickness varying from 15 to 4 nm. Corresponding insertion losses are as low as 3 dB/mm thanks to the development of low loss poly-silicon and to a careful design of the doped layers within the waveguide. The thin SiGe layer brings an additional 20% gain in efficiency due to higher hole efficiency in strained SiGe.

MNOS stack for reliable, low optical loss, Cu based CMOS plasmonic devices.

We study the electro optical properties of a Metal-Nitride-Oxide-Silicon (MNOS) stack for a use in CMOS compatible plasmonic active devices. We show that the insertion of an ultrathin stoichiometric Si(3)N(4) layer in a MOS stack lead to an increase in the electrical reliability of a copper gate MNOS capacitance from 50 to 95% thanks to a diffusion barrier effect, while preserving the low optical losses brought by the use of copper as the plasmon supporting metal. An experimental investigation is undertaken at a wafer scale using some CMOS standard processes of the LETI foundry. Optical transmission measurments conducted in a MNOS channel waveguide configuration coupled to standard silicon photonics circuitry confirms the very low optical losses (0.39 dB.µm(-1)), in good agreement with predictions using ellipsometric optical constants of Cu.

Ten Gbit/s ring resonator silicon modulator based on interdigitated PN junctions.

10 Gbit/s silicon modulator based on carrier depletion in interdigitated PN junctions is experimentally demonstrated. The phase-shifter is integrated in a ring resonator, and high extinction ratio larger than 10 dB is obtained in both TE and TM polarizations. VπLπ of about 2.5 V × cm and optical loss lower than 1 dB are estimated. 10 Gbit/s data transmission is demonstrated with an extinction ratio of 4 dB.

High extinction ratio 10 Gbit/s silicon optical modulator.

High speed and high extinction ratio silicon optical modulator using carrier depletion is experimentally demonstrated. The phase-shifter is a 1.8 mm-long PIPIN diode which is integrated in a Mach Zehnder interferometer. 8.1 dB Extinction Ratio at 10 Gbit/s is obtained simultaneously with optical loss as low as 6 dB.

Efficient directional coupling between silicon and copper plasmonic nanoslot waveguides: toward metal-oxide-silicon nanophotonics.

Coupling plasmonics and silicon photonics is the best way to bridge the size gap between macroscopic optics and nanodevices in general and especially nanoelectronic devices. We report on the realization of key blocks for future plasmonic planar integrated optics, nano-optical couplers, and nanoslot waveguides that are compatible both with the silicon photonics and the CMOS microelectronics. Copper-based devices provide for very efficient optical coupling, unexpectedly low propagation losses and a broadband sub-50 nm optical confinement. The fabrication in a standard frontline microelectronic facilities hints broad possibilities of hybrid opto-electronic very large scale integration.

Characterization of SiN Integrated Optical Phased Arrays on a Wafer-Scale Test Station.

Optical phased arrays (OPAs) can produce low-divergence laser beams and can be used to control the emission angle electronically without the need for moving mechanical parts. This technology is particularly useful for beam steering applications. Here, we focus on OPAs integrated into SiN photonic circuits for a wavelength in the near infrared. A characterization method of such circuits is presented, which allows the output beam of integrated OPAs to be shaped and steered. Furthermore, using a wafer-scale characterization setup, several devices can easily be tested across multiple dies on a wafer. In this way, fabrication variations can be studied, and high-performance devices identified. Typical images of OPA beams are shown, including beams emitted from OPAs with and without a uniform waveguide length, and with varying numbers of channels. In addition, the evolution of output beams during the phase optimization process and beam steering in two dimensions is presented. Finally, a study of the variation in the beam divergence of identical devices is performed with respect to their position on the wafer.