Segmentation of void defects in X-ray images of chip solder joints based on PCB-DeepLabV3 algorithm.

Defects within chip solder joints are usually inspected visually for defects using X-ray imaging to obtain images. The phenomenon of voids inside solder joints is one of the most likely types of defects in the soldering process, and accurate detection of voids becomes difficult due to their irregular shapes, varying sizes, and defocused edges. To address this problem, an X-ray void image segmentation algorithm based on improved PCB-DeepLabV3 is proposed. Firstly, to meet the demand for lightweight and easy deployment in industrial scenarios, mobilenetv2 is used as the feature extraction backbone network of the PCB-DeepLabV3 model; then, Attentional multi-scale two-space pyramid pooling network (AMTPNet) is designed to optimize the shallow feature edges and to improve the ability to capture detailed information; finally, image cropping and cleaning methods are designed to enhance the training dataset, and the improved PCB-DeepLabV3 is applied to the training dataset. The improved PCB-DeepLabV3 model is used to segment the void regions within the solder joints and compared with the classical semantic segmentation models such as Unet, SegNet, PSPNet, and DeeplabV3. The proposed new method enables the solder joint void inspection to get rid of the traditional way of visual inspection, realize intelligent upgrading, and effectively improve the problem of difficult segmentation of the target virtual edges, to obtain the inspection results with higher accuracy.

Design of intelligent inspection system for solder paste printing defects based on improved YOLOX.

Aiming at the current SPI (solder paste inspection) system for printing solder paste similar defects detection accuracy is not high, the system intelligence degree is low and so on, design a for the solder paste similar defects and combined with phase modulation profile measurement technique and improve the YOLOX intelligent detection system. The core of the system is the improved YOLOX depth model based on s-mosica and kt-iou algorithms proposed in this paper. The experimental results show that the proposed s-mosica and kt-iou algorithms can effectively improve the detection accuracy of printed solder paste, and when combined with the YOLOX model, the best 90.33% detection accuracy is obtained, which is better than the detection performance of the existing algorithms in the same scenario, and it provides an effective and feasible reference program for the design of the SPI high-precision intelligent detection system.