RESUMEN
In this article, based on the developed methodology, the stages of designing two designs of high-performance radio-frequency single-pole single-throw microelectromechanical switches are investigated. These radio-frequency microelectromechanical switches are designed to operate at a central resonant frequency of 3.6 GHz and 3.4 GHz, respectively, as well as to work both in mobile communication devices and in the design of the architecture of 5G mobile networks, in particular in arrays of integrated antennas and radio-frequency interface modules. The manufacture and study of two designed structures are researched. For the first manufactured experimental sample in the open state the insertion loss is no more than -0.69 dB and the reflection loss is -28.35 dB, and in the closed state the isolation value is at least -54.77 dB at a central resonant frequency of 3.6 GHz. For the second in the open state the value of the insertion loss is no more than -0.67 dB and the reflection loss is -20.7 dB, and in the closed state the isolation value is not less than -52.13 dB at the central resonant frequency of 3.4 GHz. Both manufactured experimental samples are characterized by high linearity, as well as a small value of contact resistance in the closed state.
RESUMEN
In this article, based on the developed methodology, the stages of designing the sensitive element of a microelectromechanical gyroscope with an open-loop structure are considered. This structure is intended for use in control units for mobile objects such as robots, mobile trolleys, etc. To quickly obtain a ready-made gyroscope, a specialized integrated circuit (SW6111) was selected, for the use of which the electronic part of the sensitive element of the microelectromechanical gyroscope was developed. The mechanical structure was also taken from a simple design. The simulation of the mathematical model was carried out in the MATLAB/Simulink software environment. The mechanical elements and the entire structure were calculated using finite element modeling with ANSYS MultiPhysics CAD tools. The developed sensitive element of the micromechanical gyroscope was manufactured using bulk micromachining technology-silicon-on-insulator-with a structural layer thickness equal to 50 µm. Experimental studies were carried out using a scanning electron microscope and a contact profilometer. Dynamic characteristics were measured using a Polytec MSA-500 microsystem analyzer. The manufactured structure has low topological deviations. Calculations and experiments showed fairly accurate results for the dynamic characteristics, with an error of less than 3% for the first iteration of the design.