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A Performance-testing Platform for a Conduction Micropump with an FR-4 Copper-clad Electrode Plate.
Feng, Junyuan; Wan, Zhenping; Feng, Chen; Wen, Wanyu; Tang, Yong.
Afiliación
  • Feng J; School of Mechanical and Automotive Engineering, South China University of Technology.
  • Wan Z; School of Mechanical and Automotive Engineering, South China University of Technology; zhpwan@scut.edu.cn.
  • Feng C; School of Mechanical and Automotive Engineering, South China University of Technology.
  • Wen W; School of Mechanical and Automotive Engineering, South China University of Technology.
  • Tang Y; School of Mechanical and Automotive Engineering, South China University of Technology.
J Vis Exp ; (128)2017 10 09.
Article en En | MEDLINE | ID: mdl-29053681
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Texto completo: 1 Banco de datos: MEDLINE Asunto principal: Cobre / Sistemas Microelectromecánicos Idioma: En Revista: J Vis Exp Año: 2017 Tipo del documento: Article
Texto completo
Imprimir
XML
PubMed Links
Buscar en Google

Texto completo: 1 Banco de datos: MEDLINE Asunto principal: Cobre / Sistemas Microelectromecánicos Idioma: En Revista: J Vis Exp Año: 2017 Tipo del documento: Article