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Three-dimensional electronic microfliers inspired by wind-dispersed seeds.
Kim, Bong Hoon; Li, Kan; Kim, Jin-Tae; Park, Yoonseok; Jang, Hokyung; Wang, Xueju; Xie, Zhaoqian; Won, Sang Min; Yoon, Hong-Joon; Lee, Geumbee; Jang, Woo Jin; Lee, Kun Hyuck; Chung, Ted S; Jung, Yei Hwan; Heo, Seung Yun; Lee, Yechan; Kim, Juyun; Cai, Tengfei; Kim, Yeonha; Prasopsukh, Poom; Yu, Yongjoon; Yu, Xinge; Avila, Raudel; Luan, Haiwen; Song, Honglie; Zhu, Feng; Zhao, Ying; Chen, Lin; Han, Seung Ho; Kim, Jiwoong; Oh, Soong Ju; Lee, Heon; Lee, Chi Hwan; Huang, Yonggang; Chamorro, Leonardo P; Zhang, Yihui; Rogers, John A.
Afiliación
  • Kim BH; Department of Organic Materials and Fiber Engineering, Soongsil University, Seoul, Republic of Korea.
  • Li K; Department of Smart Wearable Engineering, Soongsil University, Seoul, Republic of Korea.
  • Kim JT; Department of Engineering, University of Cambridge, Cambridge, UK.
  • Park Y; State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, People's Republic of China.
  • Jang H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Wang X; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Xie Z; Department of Electrical and Computer Engineering, University of Wisconsin Madison, Madison, WI, USA.
  • Won SM; Department of Materials Science and Engineering, Institute of Materials Science, University of Connecticut, Storrs, CT, USA.
  • Yoon HJ; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.
  • Lee G; Ningbo Institute of Dalian University of Technology, Ningbo, People's Republic of China.
  • Jang WJ; Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea.
  • Lee KH; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Chung TS; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Jung YH; Department of Chemical and Biomolecular Engineering, University of Illinois, Urbana, IL, USA.
  • Heo SY; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Lee Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Kim J; Department of Electronic Engineering, Hanyang University, Seoul, Republic of Korea.
  • Cai T; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Kim Y; Department of Chemical and Biomolecular Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
  • Prasopsukh P; Department of Chemical and Biomolecular Engineering, University of Illinois, Urbana, IL, USA.
  • Yu Y; Department of Mechanical Science and Engineering, University of Illinois, Urbana, IL, USA.
  • Yu X; Department of Chemical and Biomolecular Engineering, University of Illinois, Urbana, IL, USA.
  • Avila R; Department of Mechanical Science and Engineering, University of Illinois, Urbana, IL, USA.
  • Luan H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Song H; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
  • Zhu F; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.
  • Zhao Y; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
  • Chen L; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Han SH; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Kim J; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.
  • Oh SJ; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
  • Lee H; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Lee CH; Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing, People's Republic of China.
  • Huang Y; School of Logistics Engineering, Wuhan University of Technology, Wuhan, People's Republic of China.
  • Chamorro LP; School of Aerospace Engineering and Applied Mechanics, Tongji University, Shanghai, People's Republic of China.
  • Zhang Y; State Key Laboratory for Mechanical Behavior of Materials, School of Material Science and Engineering, Xi'an Jiaotong University, Xi'an, People's Republic of China.
  • Rogers JA; Electronic Convergence Materials and Device Research Center, Korea Electronics Technology Institute, Seongnam, Republic of Korea.
Nature ; 597(7877): 503-510, 2021 09.
Article en En | MEDLINE | ID: mdl-34552257
ABSTRACT
Large, distributed collections of miniaturized, wireless electronic devices1,2 may form the basis of future systems for environmental monitoring3, population surveillance4, disease management5 and other applications that demand coverage over expansive spatial scales. Aerial schemes to distribute the components for such networks are required, and-inspired by wind-dispersed seeds6-we examined passive structures designed for controlled, unpowered flight across natural environments or city settings. Techniques in mechanically guided assembly of three-dimensional (3D) mesostructures7-9 provide access to miniature, 3D fliers optimized for such purposes, in processes that align with the most sophisticated production techniques for electronic, optoelectronic, microfluidic and microelectromechanical technologies. Here we demonstrate a range of 3D macro-, meso- and microscale fliers produced in this manner, including those that incorporate active electronic and colorimetric payloads. Analytical, computational and experimental studies of the aerodynamics of high-performance structures of this type establish a set of fundamental considerations in bio-inspired design, with a focus on 3D fliers that exhibit controlled rotational kinematics and low terminal velocities. An approach that represents these complex 3D structures as discrete numbers of blades captures the essential physics in simple, analytical scaling forms, validated by computational and experimental results. Battery-free, wireless devices and colorimetric sensors for environmental measurements provide simple examples of a wide spectrum of applications of these unusual concepts.
Asunto(s)

Texto completo: 1 Banco de datos: MEDLINE Asunto principal: Semillas / Viento / Biomimética / Equipos y Suministros Eléctricos / Tecnología Inalámbrica / Miniaturización Tipo de estudio: Screening_studies Idioma: En Revista: Nature Año: 2021 Tipo del documento: Article

Texto completo: 1 Banco de datos: MEDLINE Asunto principal: Semillas / Viento / Biomimética / Equipos y Suministros Eléctricos / Tecnología Inalámbrica / Miniaturización Tipo de estudio: Screening_studies Idioma: En Revista: Nature Año: 2021 Tipo del documento: Article