The self-annealing phenomenon of electrodeposited nano-twin copper with high defect density.
Front Chem
; 10: 1056596, 2022.
Article
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| MEDLINE
| ID: mdl-36505750
ABSTRACT
Electroplated copper was prepared under typical conditions and a high defect density to study the effect of the defects on its self-annealing phenomenon. Two conditions, grain growth and stress relaxation during self-annealing, were analyzed with electron backscattered diffraction and a high-resolution X-ray diffractometer. Abnormal grain growth was observed in both conditions; however, the grown crystal orientation differed. The direction and relative rate at which abnormal grain growth proceeds were specified through textured orientation, and the self-annealing mechanism was studied by observing the residual stress changes over time in the films using the sin2Ψ method.
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MEDLINE
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En
Revista:
Front Chem
Año:
2022
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Article
País de afiliación:
Corea del Sur