Selective Decomposition of Waste Rubber from the Shoe Industry by the Combination of Thermal Process and Mechanical Grinding.

A major challenge in waste rubber (WR) industry is achieving a high sol fraction and high molecular weight of recycled rubber at the same time. Herein, the WR from the shoe industry was thermo-mechanically ground via the torque rheometer. The effect of grinding temperature and filling rate were systematically investigated. The particle size distribution, structure evolution, and morphology of the recycled rubber were explored by laser particle size analyzer, Fourier transform infrared spectroscopy (FTIR), sol fraction analysis, gel permeation chromatography (GPC), differential scanning calorimeter (DSC), and scanning electron microscope (SEM). The results indicate that the thermo-mechanical method could reduce the particle size of WR. Moreover, the particle size distribution of WR after being ground can be described by Rosin's equation. The oxidation reaction occurs during thermal-mechanical grinding. With the increase of the grinding temperature and filling rate, the sol fraction of the recycled WR increases. It is also found that a high sol fraction (43.7%) and high molecular weight (35,284 g/mol) of reclaimed rubber could be achieved at 80 °C with a filling rate of 85%. Moreover, the obtained recycled rubber compound with SBR show a similar vulcanization characteristics to pure SBR. Our selective decomposition of waste rubber strategy opens up a new way for upgrading WR in shoe industry.

Elongational Flow Field Processed Ultrahigh Molecular Weight Polyethylene/Polypropylene Blends with Distinct Interlayer Phase for Enhanced Tribological Properties.

Herein, we produced a series of ultrahigh molecular weight polyethylene/polypropylene (UHMWPE/PP) blends by elongational-flow-field dominated eccentric rotor extruder (ERE) and shear-flow-field dominated twin screw extruder (TSE) respectively and presented a detailed comparative study on microstructures and tribological properties of UHMWPE/PP by different processing modes. Compared with the shear flow field in TSE, the elongational flow field in ERE facilitates the dispersion of PP in the UHMWPE matrix and promotes the interdiffusion of UHMWPE and PP molecular chains. For the first time, we discovered the presence of the interlayer phase in blends with different processing modes by using Raman mapping inspection. The elongational flow field introduces strong interaction to enable excellent compatibility of UHMWPE and PP and induces more pronounced interlayer phase with respect to the shear flow field, eventually endowing UHMWPE/PP with improved wear resistance. The optimized UHMWPE/PP (85/15) blend processed by ERE displayed higher tensile strength (25.3 MPa), higher elongation at break (341.77%) and lower wear loss of ERE-85/15 (1.5 mg) compared to the blend created by TSE. By systematically investigating the microstructures and mechanical properties of blends, we found that with increased content of PP, the wear mechanism of blends varies from abrasive wear, fatigue wear, to adhesion wear as the dominant mechanism for two processing modes.

Enhancement of Electromagnetic Interference Shielding Performance and Wear Resistance of the UHMWPE/PP Blend by Constructing a Segregated Hybrid Conductive Carbon Black-Polymer Network.

The low-percolation-threshold conductive networking structure is indispensable for the high performance and functionalization of conductive polymer composites (CPCs). In this work, conductive carbon black (CCB)-reinforced ultrahigh-molecular-weight polyethylene (UHMWPE)/polypropylene (PP) blend with tunable electrical conductivity and good mechanical properties was prepared using a high-speed mechanical mixing method and a compression-molded process. An interconnecting segregated hybrid CCB-polymer network is formed in electrically conductive UHMWPE/PP/CCB (UPC) composites. The UPC composites possess a dense conductive pathway at a low percolation threshold of 0.48 phr. The composite with 3 phr CCB gives an electrical conductivity value of 1.67 × 10-3 S/cm, 12 orders of magnitude higher than that of the polymeric matrix, suggesting that CCB improves both the electrical conductivity and electromagnetic interference shielding effectiveness (EMI SE) of the composite at the loading fraction over its percolation threshold. The composite with 15 phr CCB presents an absorption-dominated electromagnetic interference shielding effectiveness (EMI SE) as high as 27.29 dB at the X-band. The composite also presents higher tribological properties, mechanical properties, and thermal stability compared to the UP blend. This effort provides a simple and effective way for the mass fabrication of CPC materials with excellent performance.