RESUMEN
Grain weight, grain number per panicle, and the number of panicles are the three factors that determine rice (Oryza sativa L.) yield. Of these, grain weight, which not only directly determines rice yield but also influences appearance and quality, is often considered the most important for rice production. Here, we describe OsNF-YC1, a member of the NF-Y transcription factor family that regulates rice grain size. OsNF-YC1 knockout plants (osnf-yc1), obtained using CRISPR-Cas9 technology, showed reduced grain weight due to reduced width and thickness, with no change in grain length, leading to a slenderer grain shape. Downregulation of OsNF-YC1 using RNA interference resulted in similar grain phenotypes as osnf-yc1. OsNF-YC1 affects grain formation by regulating both cell proliferation and cell expansion. OsNF-YC1 localizes in both the nucleus and cytoplasm, has transcriptional activation activity at both the N-terminus and C-terminus, and is highly expressed in young panicles. OsNF-YC1 interacts with OsMADS1 both in vivo and in vitro. Further analysis showed that the histone-like structural CBFD-NFYB-HMF domain of OsNF-YC1 conserved in the OsNF-YC transcription factor family can directly interact with the MADS-box domain of OsMADS1 to enhance its transcriptional activation activity. This interaction positively regulates the expression of OsMADS55, the direct downstream target of OsMADS1. Therefore, this paper reveals a potential grain size regulation pathway controlled by an OsNF-YC1-OsMADS1-OsMADS55 module in rice.
RESUMEN
Cu-Ni-Si alloys are widely used in lead frames and vacuum devices due to their high electrical conductivity and strength. In this paper, a Cu-Ni-Co-Si-Cr-(Ce) alloy was prepared by vacuum induction melting. Hot compression tests of the Cu-Ni-Co-Si-Cr and Cu-Ni-Co-Si-Cr-Ce alloys were carried out using a Gleeble-1500 simulator at 500-900 °C deformation temperatures and 0.001-10 s-1 strain rates. The texture change was analyzed by electron backscatter diffraction. The <110> fiber component dominated the texture after compression, and the texture intensity was reduced during recrystallization. Moreover, the average misorientation angle φ for Cu-Ni-Co-Si-Cr-Ce (11°) was lower than that of Cu-Ni-Co-Si-Cr (16°) under the same conditions. Processing maps were developed to determine the optimal processing window. The microstructure and precipitates of the Cu-Ni-Co-Si-Cr and Cu-Ni-Co-Si-Cr-Ce alloys were also analyzed. The average grain size of the Cu-Ni-Co-Si-Cr-Ce alloy (48 µm) was finer than that of the Cu-Ni-Co-Si-Cr alloy (80 µm). The average size of precipitates in the Cu-Ni-Co-Si-Cr alloy was 73 nm, while that of the Cu-Ni-Co-Si-Cr-Ce alloy was 27 nm. The addition of Ce delayed the occurrence of dynamic recrystallization.