A portable magnetic electrochemical sensor for highly efficient Pb(II) detection based on bimetal composites from Fe-on-Co-MOF.

The practical, sensitive, and real-time detection of heavy metal ions is an essential and difficult problem. This study presents the design of a unique magnetic electrochemical detection system that can achieve real-time field detection. To enhance the electrochemical performance of the sensor, Fe2O3@C-800, Co/CoO@/C-600, and CoFe2O4@C-600 magnetic composites were synthesized using three MOFs precursors by the solvothermal method. And the morphology structure and electrochemical properties of as-prepared magnetic composites were researched by X-ray diffraction (XRD), Scanning electron microscopy (SEM), and X-ray photoelectron spectroscopy (XPS), vibrating sample magnetometer (VSM), specific surface area and porosity analyzer (BET) and differential pulse voltammetry (DPV). The results shown that these composites improve conductivity and stability while preserving the MOFs basic frame structure. Compared with the monometallic MOFs-derived composites, the synergistic effect of the bimetallic composite CoFe2O4@C-600 can significantly enhance the electrochemical performance of the sensor. The linear range for the detection of lead ions was 0.001-60 µM, and the detection limit was 0.0043 µM with a sensitivity of 22.22 µA µM·cm-2 by differential pulse voltammetry. The sensor has good selectivity, stability, reproducibility and can be used for actual sample testing.

Enhanced leaching of manganese from low-grade pyrolusite using ball milling and electric field.

In this study, electric field and ball milling were used to leach Mn2+ from low-grade pyrolusite (LGP). The effects of current density, reaction time, reaction temperature, ball-to-powder weight ratio, and ball milling time on the leaching efficiency of Mn2+ from LGP as well as the leaching mechanism were systematically studied. The results showed that the combined use of electric field and ball milling enhanced the leaching of Mn2+ from LGP. The leaching efficiency of Mn2+ reached 97.79% under the optimum conditions of LGP-to-pyrite mass ratio of 1:0.18, current density of 30 mA/cm2, LGP-to-H2SO4 mass ratio of 1:0.4, liquid-to-solid ratio of 5:1, ball-to-powder weight ratio of 1:1, ball milling time of 2 h, temperature of 80 °C, and leaching duration of 120 min. This value was 25.95% higher than that attained without ball milling and 41.45% higher than that attained when neither ball milling nor electric field was employed. Pyrite was fully oxidized to generate additional SO42- and Fe3+, and was further hydrolyzed to form jarosite (KFe3(SO4)2(OH)6) and hydronium jarosite (Fe3(SO4)2(OH)5·2H2O) via ball milling and electric field application. Moreover, the electric field changed the surface charge distribution of the mineral particles and promoted collisions between them as well as the collapse of the crystal lattice, further improving the leaching efficiency of Mn2+ from LGP. This study provided a new method for leaching Mn from LGP.

A low cost of phosphate-based binder for Mn2+ and NH4+-N simultaneous stabilization in electrolytic manganese residue.

Electrolytic manganese residue (EMR) is a solid waste remained in filters after using sulfuric acid to leaching manganese carbonate ore. EMR contains high concentration of soluble manganese (Mn2+) and ammonia nitrogen (NH4+-N), which seriously pollutes the environment. In this study, a low cost of phosphate based binder for Mn2+ and NH4+-N stabilization in EMR by low grade-MgO (LG-MgO) and superphosphate was studied. The effects of different types of stabilizing agent on the concentrations of NH4+-N and Mn2+, the pH of the EMR leaching solution, stabilizing mechanisms of NH4+-N and Mn2+, leaching test and economic analysis were investigated. The results shown that the pH of the EMR leaching solution was 8.07, and the concentration of Mn2+ was 1.58 mg/L, both of which met the integrated wastewater discharge standard (GB8978-1996), as well as the concentration of NH4+-N decreased from 523.46 mg/L to 32 mg/L, when 4.5 wt.% LG-MgO and 8 wt.% superphosphate dosage were simultaneously used for the stabilization of EMR for 50 d Mn2+ and NH4+-N were mainly stabilized by Mn3(PO4)2·2H2O, MnOOH, Mn3O4, Mn(H2PO4)2·2H2O and NH4MgPO4·6H2O. Economic evaluation revealed that the treatment cost of EMR was $ 11.89/t. This study provides a low-cost materials for NH4+-N and Mn2+ stabilization in EMR.

A new electrochemical method for simultaneous removal of Mn2+and NH4+-N in wastewater with Cu plate as cathode.

In this study, a new electrochemical method was used to simultaneously efficient removal of Mn2+ and NH4+-N in wastewater with Cu plate as cathode. The effects of various reaction parameters on the concentrations of Mn2+, NH4+-N and by-products (NO3--N and NO2--N, free chlorine and residual chlorine), as well as the removal mechanism were investigated. The results showed that the removal efficiencies of Mn2+ and NH4+-N were 99.1% and 92.9%, and the concentrations of NO3--N, NO2--N, free chlorine and residue chlorine were 0.73 mg/L, 0.15 mg/L, 0.13 mg/L and 0.63 mg/L reacting for 3 h at room temperature, respectively, when the current density was 10 mA/cm2, the mass ratio of ClO- and Cl- was 1:1, the initial pH was 9. The concentrations of Mn2+, NH4+-N and by-products in wastewater met the integrated wastewater discharge standard (GB8978-1996). In addition, spherical manganese oxide was deposited on the anode plate, and spherical manganese oxide collapsed over electrolysis time. Manganese was mainly removed in the form of MnO, Mn(OH)2 and MnO2. NH4+-N was mainly oxidized to N2. Economic evalution revealed that the treatment cost was 2.93 $/m3.

Enhanced electrokinetic remediation of manganese and ammonia nitrogen from electrolytic manganese residue using pulsed electric field in different enhancement agents.

Electrolytic manganese residue (EMR) is a solid waste generated in the process of producing electrolytic metal manganese and contains a lot of manganese and ammonia nitrogen. In this study, electrokinetic remediation (EK) of manganese and ammonia nitrogen from EMR were carried out by using pulse electric field (PE) in different agents, and sodium dodecyl benzene sulfonate (SDBS), citric acid (CA) and ethylene diamine tetraacetic acid (EDTA) were used as enhancement agents. The removal behavior of ammonia nitrogen and manganese under direct current field (DC) and PE, and the relationship between manganese fractionation and transport behavior, as well as the energy consumption were investigated. The results demonstrated that the removal efficiency of ammonia nitrogen and manganese using PE were higher than DC. SDBS, EDTA and CA could enhance electroosmosis and electromigration, and the sequence of enhancement agent effects were CA, SDBS, EDTA, distilled water. The highest removal efficiency of manganese and ammonia nitrogen were 94.74% and 88.20%, and the effective removal amount of manganese and ammonia nitrogen was 23.93 and 1.48 mg·wh-1, when CA and SDBS+CA was used as the enhancement agents, respectively. Moreover, electromigration was the main removal mechanism of manganese and ammonia nitrogen in the EK process.

Simultaneous optimizing removal of manganese and ammonia nitrogen from electrolytic metal manganese residue leachate using chemical equilibrium model.

Electrolytic metal manganese residue leachate (EMMRL) was produced from long-term deposition of electrolytic metal manganese residue. EMMRL contains huge amount of manganese and ammonia nitrogen which could seriously damage the ecological environment. In this study, a chemical equilibrium model-Visual MINTEQ was used to simultaneously optimize removal of manganese and ammonia nitrogen from EMMRL with chemical precipitation methods. In the laboratory experiment, the effect of different N: P ratios and pH were investigated, and the characterization of the precipitates was characterized by X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FTIR), and scanning electron microscope (SEM). The results showed that over 99.9% manganese and 96.2% ammonia nitrogen were simultaneously removed, respectively, when molar ratio of N:P was 1:1.15 at pH 9.5. Moreover, the experimental results corresponded well with the model outputs with respect to ammonia nitrogen and manganese removal. Manganese was mainly removed in the form of MnHPO4·3H2O and manganite, and ammonia nitrogen was mainly removed in the form of struvite. Economic evaluation indicated the chemical precipitation methods can be applied in the factory when the price of precipitation was higher than 0.295 $/kg.

Topological Insulator-Based van der Waals Heterostructures for Effective Control of Massless and Massive Dirac Fermions.

Three dimensional (3D) topological insulators (TIs) are an important class of materials with applications in electronics, spintronics and quantum computing. With the recent development of truly bulk insulating 3D TIs, it has become possible to realize surface dominated phenomena in electrical transport measurements e.g. the quantum Hall (QH) effect of massless Dirac fermions in topological surface states (TSS). However, to realize more advanced devices and phenomena, there is a need for a platform to tune the TSS or modify them e.g. gap them by proximity with magnetic insulators, in a clean manner. Here we introduce van der Waals (vdW) heterostructures in the form of topological insulator/insulator/graphite to effectively control chemical potential of the TSS. Two types of gate dielectrics, normal insulator hexagonal boron nitride (hBN) and ferromagnetic insulator Cr2Ge2Te6 (CGT) are utilized to tune charge density of TSS in the quaternary TI BiSbTeSe2. hBN/graphite gating in the QH regime shows improved quantization of TSS by suppression of magnetoconductivity of massless Dirac fermions. CGT/graphite gating of massive Dirac fermions in the QH regime yields half-quantized Hall conductance steps and a measure of the Dirac gap. Our work shows the promise of the vdW platform in creating advanced high-quality TI-based devices.

Simultaneous stabilization/solidification of Mn2+ and NH4+-N from electrolytic manganese residue using MgO and different phosphate resource.

This study examined simultaneous stabilization and solidification (S/S) of Mn2+ and NH4+-N from electrolytic manganese residue (EMR) using MgO and different phosphate resource. The characteristics of EMR NH4+-N and Mn2+ S/S behavior, S/S mechanisms, leaching test and economic analysis, were investigated. The results show that the S/S efficiency of Mn2+ and NH4+-N could reach 91.58% and 99.98%, respectively, and the pH value is 8.75 when the molar ratio of Mg:P is 3:1 and the dose of PM (MgO and Na3PO4·12H2O) is 8wt%. In this process, Mn2+ could mainly be stabilized in the forms of Mn(H2PO4)2·2H2O, Mn3(PO4)2·3H2O, Mn(OH)2, and MnOOH, and NH4+-N in the form of NH4MgPO4·6H2O. Economic evaluation indicates that using PM process has a lower cost than HPM and HOM process for the S/S of Mn2+ and NH4+-N from EMR at the same stabilization agent dose. Leaching test values of all the measured metals are within the permitted level for the GB8978-1996 test suggested when the dose of PM, HPM and HOM is 8wt%.

Communication: Calculations of the (2 × 1)-O reconstruction kinetics on Cu(110).

Density functional theory calculations are used to study the elementary processes of the formation of the (2 × 1)-O reconstruction on the Cu(110) surface. The (2 × 1)-O reconstruction requires additional Cu atoms to form Cu-O rows on top of the surface. Both terrace and step sites are considered as the source of Cu adatoms. On terraces, adsorbed oxygen induces the ejection of Cu atoms to form -O-Cu-O- units, leaving Cu vacancies behind. The barrier for subsequent unit growth, however, is prohibitively high. Cu(110) step sites are also considered as a source of Cu atoms. Dissociated oxygen triggers the formation of stable Cu-O chains along the [001] step edges. This process, however, blocks the diffusion of Cu atoms so that it is not a viable mechanism for the (2 × 1)-O reconstruction. Oxygen adsorption on the [11¯0] edges also allows the nucleation of [001] oriented Cu-O rows. The short Cu-O rows act as diffusion channels for Cu atoms that detach from the step, which append to the end of the Cu-O chains. Our calculations of the formation of the (2 × 1)-O phase on Cu(110) provide a mechanistic description of the experimentally observed reconstruction.

Calculations of oxide formation on low-index Cu surfaces.

Density-functional theory is used to evaluate the mechanism of copper surface oxidation. Reaction pathways of O2 dissociation on the surface and oxidation of the sub-surface are found on the Cu(100), Cu(110), and Cu(111) facets. At low oxygen coverage, all three surfaces dissociate O2 spontaneously. As oxygen accumulates on the surfaces, O2 dissociation becomes more difficult. A bottleneck to further oxidation occurs when the surfaces are saturated with oxygen. The barriers for O2 dissociation on the O-saturated Cu(100)-c(2×2)-0.5 monolayer (ML) and Cu(100) missing-row structures are 0.97 eV and 0.75 eV, respectively; significantly lower than those have been reported previously. Oxidation of Cu(110)-c(6×2), the most stable (110) surface oxide, has a barrier of 0.72 eV. As the reconstructions grow from step edges, clean Cu(110) surfaces can dissociatively adsorb oxygen until the surface Cu atoms are saturated. After slight rearrangements, these surface areas form a "1 ML" oxide structure which has not been reported in the literature. The barrier for further oxidation of this "1 ML" phase is only 0.31 eV. Finally the oxidized Cu(111) surface has a relatively low reaction energy barrier for O2 dissociation, even at high oxygen coverage, and allows for facile oxidation of the subsurface by fast O diffusion through the surface oxide. The kinetic mechanisms found provide a qualitative explanation of the observed oxidation of the low-index Cu surfaces.

Simultaneous stripping recovery of ammonia-nitrogen and precipitation of manganese from electrolytic manganese residue by air under calcium oxide assist.

Leaching tests of electrolytic manganese residue (EMR) indicated that high contents of soluble manganese and ammonia-nitrogen posed a high environmental risk. This work reports the results of simultaneous stripping recovery of ammonia-nitrogen and precipitation of manganese by air under calcium oxide assist. The ammonia-nitrogen stripping rate increased with the dosage of CaO, the air flow rate and the temperature of EMR slurry. Stripped ammonia-nitrogen was absorbed by a solution of sulfuric acid and formed soluble (NH4)2SO4 and (NH4)3H(SO4)3. The major parameters that effected soluble manganese precipitation were the dosage of added CaO and the slurry temperature. Considering these two aspects, the efficient operation conditions should be conducted with 8 wt.% added CaO, 60°C, 800 mL min(-1) air flow rate and 60-min reaction time. Under these conditions 99.99% of the soluble manganese was precipitated as Mn3O4, which was confirmed by XRD and SEM-EDS analyses. In addition, the stripping rate of ammonia-nitrogen was 99.73%. Leaching tests showed the leached toxic substances concentrations of the treated EMR met the integrated wastewater discharge standard of China (GB8978-1996).

Influence of PUB2 on the Leveling Effect of Chip Copper Connection Electroplating: Mechanism and Applications.

The copper connectivity technique is essential for achieving electrical interconnection in wafer level packaging (WLP), system in packaging (SiP), and 3D packaging. The essential processing material for copper connectivity is a copper sulfate electroplating solution in which organic additives play a crucial role in the regularity of copper electrodeposition. In this study, electrochemical tests, X-ray diffraction, 3D profiling, and scanning electron microscopy were used to investigate the leveling effect and mechanism of polyquaternary ammonium urea-containing polymer (PUB2) in the process of copper electrodeposition on-chip copper connections. PUB2 has excellent polarization ability on the target surface, remains unaffected by the sulfur additive SPS and poly(ethylene glycol), and displays a strong ability to regulate the copper deposition rate of through-holes and surface wiring. The waviness of the wafer surface wiring was reduced from 130 to approximately 70 nm after optimizing the PUB2 concentration, and the surface roughness was reduced from 10 to approximately 7 nm. The coating was dispersed evenly, and the rate of through-hole filling was improved by 57%. This study not only examined PUB2 leveling performance and mechanisms but also devised a research method and system for electroplating additives to facilitate the development and application of new electroplating additives.

Recyclable and Efficient Recovery of Ca and S from Phosphogypsum by Using Multistep Precipitation.

The resource utilization of phosphogypsum (PG) is the key to promote the green development of the phosphorus chemical industry. The natural environment and public safety are significantly threatened by the enormous volume of PG storage. In this study, Ca and S were successfully recovered from the PG via a multistep precipitation in the NaOH-BaCO3 system. The alkali solution can be recycled five times, with a first recovery ratio of about 97.9%, and the decomposition ratio of PG remained above 70% after five cycles. In addition, the recovery ratios of Ca and S in PG are 99.9 and 82.5%, respectively. The product of BaSO4 can be used as a weighting agent for oil and natural gas drilling mud. The BaSO4 can also be used as wave-absorbing materials, and its reflection loss value reaches 97.8% of the analytical purity BaSO4. This work provides a new idea for the efficient recycling of Ca and S in PG with an outstanding application prospect.

Electroplated Copper Additives for Advanced Packaging: A Review.

Acid copper electroplating stands as a core technology in advanced packaging processes, facilitating the realization of metal interconnects, bumps, vias, and substrate wiring between transistors. The deposition quality of copper interconnect materials has a crucial impact on the final performance of chips, directly influencing their yield, reliability, and stability. In this intricate process, additives play a pivotal role in regulating the deposition quality and behavior of metal copper. This mini-review comprehensively summarizes the recent research progress in the field of electroplating copper additives for advanced packaging, both domestically and internationally, delving into the types and mechanisms of various additive molecules, including accelerators, inhibitors, and leveling agents. Through in-depth research on these additives, we gain a profound understanding of their specific roles in the electroplating process and the intricate interaction mechanisms among them, providing theoretical support for optimizing the electroplating process. Furthermore, this mini-review also delves into a thorough analysis of the current issues and challenges facing acid copper electroplating, exploring the key factors that constrain the further development of electroplating copper technology. Based on this analysis, we propose several potential solutions and research directions, offering crucial references for the development and application of electroplating copper additives in advanced packaging. In conclusion, this mini-review aims to provide a comprehensive perspective and profound understanding of the development and application of electroplating copper additives through a review and analysis of recent research progress, ultimately aiming to promote the further advancement of advanced packaging technology.

Prediction and Effect Verification of Thiamine as a Leveling Agent in Chip Wafer Electroplating.

Thiamine, a nitrogen-containing heterocyclic compound, is explored for the first time as a novel leveling agent in this study. Based on the density functional theory (DFT) calculations and molecular dynamics (MD) simulations of the adsorption process of thiamine and the commonly used leveling agent JGB, the average values of the binding energies after equilibrium of thiamine and JGB are similar, which indicates that the thiamine molecules have strong bonding ability with the surface of copper and can be adsorbed tightly on the surface of copper. By cyclic voltammetry (CV) curve, thiamine was found to inhibit copper deposition and the inhibition effect was stronger than JGB. The chrono potential curve (CP) test found that the potential difference △η = 87 > 50 mV at high and low speeds of thiamine, which indicates that thiamine has the potential to be used as a leveling agent. Electrochemical impedance spectroscopy (EIS) testing found that thiamine inhibited copper precipitation by inhibiting the reactions of Cu2+ → Cu+ and Cu+ → Cu. According to electroplating experiments, thiamine has a leveling effect on wafer electroplating and can be used as a leveling agent because the copper layer on the wafer obtained by adding it has a smoother surface compared to the copper layer obtained without adding it. It was found that wafer electroplating does not require PEG, and only adding 55 mg/L Cl-, 6 mg/L SPS, and 4 mg/L thiamine as additives can achieve a good filling effect.

Leaching of phosphate ores with lower dissolution of metallic impurities: the dual role of sodium oleate.

In this work, we report the use of surfactants to improve the performance of phosphate ore leaching while reducing the concentration of metallic impurities in the leaching solution. Based on the zeta potential analysis, sodium oleate (SOL) is determined as a suitable surfactant because it can change interfacial properties and improve ionic diffusion. This is experimentally demonstrated by the high leaching performance. After that, the reaction conditions on the leaching performance are systematically investigated. Under the optimal experimental conditions (SOL concentration of 10 mg L-1, sulfuric acid concentration of 1.72 mol L-1, leaching temperature of 75 °C, and leaching time of 180 min), a high phosphorus leaching efficiency of 99.51% is achieved. Meanwhile, the leaching solution presents a lower content of metallic impurities. Further measurements performed on the leaching residues indicate that the additive SOL can promote the growth of platy crystals and facilitate PO leaching. Overall, this work demonstrates that the SOL-assisted leaching method allows for highly-efficient utilization of PO and high-purity phosphoric acid production.

Microwave Reactor with Combined Rigid and Flexible Stirring Paddles for Improving Fluid Heating Uniformity in Soft Manganese Ore Leaching Processes.

In order to overcome the apparent limitations of the inhomogeneous nature of large-scale microwave heating of fluids, a microwave reactor with a rigid-flexible combined stirring paddle is used to heat fluids, destabilizing the hot spots present in the microwave heating of fluids process. An integrated multiphysics field simulation model for calculating the microwave heating process with fluid was created for the purpose of clarifying the temperature field dispersion and fluid flow patterns in the reactor. By using the proposed model, the rigid-flexible combined stirring paddle is compared with the conventional single- and double-layer stirring paddle to highlight the benefits of the rigid-flexible combined stirring paddle in improving fluid heating uniformity. It was found experimentally that the leaching rate of soft manganese ore was increased by 7.08 and 5.22% compared to conventional single and double stirred paddles, respectively. In addition, the optimal stirrer parameters were investigated by the response surface method.

Role of Additives: Modified Hemihydrate Phosphogypsum Morphology and Enhanced Filtration Performance of Wet-Process Phosphoric Acid.

The morphology of hemihydrate phosphogypsum crystals is of vital importance in the hemihydrate-dihydrate (HH-DH) wet-process phosphoric acid production for high filtration strength. The morphology of hemihydrate phosphogypsum is commonly needlelike due to the strong acidic crystallization environment, which is unfavorable to the following filtration process. In this study, the crystal habit of hemihydrate phosphogypsum with a large aspect ratio was skillfully modified by additives to achieve a higher filtration strength. d-Glucitol (DG) reduces the theoretical aspect ratio of hemihydrate phosphogypsum crystals from 2.076 to 1.583 by interacting with the (002) face of CaSO4·0.5H2O preferentially, and poly(vinyl alcohol) (PVA) facilitates the aggregation of small grains to gather into a clusterlike structure. The modified morphologies of hemihydrate phosphogypsum have a lower bulk density and a larger porosity of the formed filter cake, which increases the filtration strength up to 45.9% when DG is added. Our work provides an in-depth explanation of the evolution mechanism of hemihydrate phosphogypsum morphology with the additives and its influence on the filtration performance. The improved filtration strength would reduce the water content of hemihydrate phosphogypsum and relieve the storage pressure of the phosphogypsum slag dump, which is meaningful to the clean production and process emission reduction of the phosphorus chemical industry.