RESUMEN
As a promising alternative to the mainstream CoFeB/MgO system with interfacial perpendicular magnetic anisotropy (PMA), L10-FePd and its synthetic antiferromagnet (SAF) structure with large crystalline PMA can support spintronic devices with sufficient thermal stability at sub-5 nm sizes. However, the compatibility requirement of preparing L10-FePd thin films on Si/SiO2 wafers is still unmet. In this paper, we prepare high-quality L10-FePd and its SAF on Si/SiO2 wafers by coating the amorphous SiO2 surface with an MgO(001) seed layer. The prepared L10-FePd single layer and SAF stack are highly (001)-textured, showing strong PMA, low damping, and sizeable interlayer exchange coupling, respectively. Systematic characterizations, including advanced X-ray diffraction measurement and atomic resolution-scanning transmission electron microscopy, are conducted to explain the outstanding performance of L10-FePd layers. A fully-epitaxial growth that starts from MgO seed layer, induces the (001) texture of L10-FePd, and extends through the SAF spacer is observed. This study makes the vision of scalable spintronics more practical.
RESUMEN
As advances in computing technology increase demand for efficient data storage solutions, spintronic magnetic tunnel junction (MTJ)-based magnetic random-access memory (MRAM) devices emerge as promising alternatives to traditional charge-based memory devices. Successful applications of such spintronic devices necessitate understanding not only their ideal working principles but also their breakdown mechanisms. Employing an in situ electrical biasing system, atomic-resolution scanning transmission electron microscopy (STEM) reveals two distinct breakdown mechanisms. Soft breakdown occurs at relatively low electric currents due to electromigration, wherein restructuring of MTJ core layers forms ultrathin regions in the dielectric MgO layer and edge conducting paths, reducing device resistance. Complete breakdown occurs at relatively high electric currents due to a combination of joule heating and electromigration, melting MTJ component layers at temperatures below their bulk melting points. Time-resolved, atomic-scale STEM studies of functional devices provide insight into the evolution of structure and composition during device operation, serving as an innovative experimental approach for a wide variety of electronic devices.
RESUMEN
The conventional computing paradigm struggles to fulfill the rapidly growing demands from emerging applications, especially those for machine intelligence because much of the power and energy is consumed by constant data transfers between logic and memory modules. A new paradigm, called "computational random-access memory (CRAM)," has emerged to address this fundamental limitation. CRAM performs logic operations directly using the memory cells themselves, without having the data ever leave the memory. The energy and performance benefits of CRAM for both conventional and emerging applications have been well established by prior numerical studies. However, there is a lack of experimental demonstration and study of CRAM to evaluate its computational accuracy, which is a realistic and application-critical metric for its technological feasibility and competitiveness. In this work, a CRAM array based on magnetic tunnel junctions (MTJs) is experimentally demonstrated. First, basic memory operations, as well as 2-, 3-, and 5-input logic operations, are studied. Then, a 1-bit full adder with two different designs is demonstrated. Based on the experimental results, a suite of models has been developed to characterize the accuracy of CRAM computation. Scalar addition, multiplication, and matrix multiplication, which are essential building blocks for many conventional and machine intelligence applications, are evaluated and show promising accuracy performance. With the confirmation of MTJ-based CRAM's accuracy, there is a strong case that this technology will have a significant impact on power- and energy-demanding applications of machine intelligence.