A nano-micro dual-scale particulate-reinforced copper matrix composite with high strength, high electrical conductivity and superior wear resistance.

Due to the contradiction between mechanical properties and electrical conductivity, it is not easy to fabricate materials with both high strength and good wear resistance with favourable electrical conductivity for the application of electrical materials. In addition, strength and wear resistance do not always present a uniform growth trend at the same time. Herein, a novel copper matrix composite reinforced by in situ synthesized ZrB2 microparticles and nano Cu5Zr precipitates is successfully prepared by a casting method and sequential heat treatments. The Cu/dual-scale particulate composite possesses a desired trade-off of strength, electrical conductivity and wear resistance. ZrB2 microparticles form from Zr and B elements in copper melts, and nanoscale Cu5Zr precipitates form in the matrix after solid solution and aging treatments. The ZrB2 microparticles, nano Cu5Zr precipitates, and well-bonded interfaces contribute to a high tensile strength of 591 MPa and superior wear resistance, with a relative electrical conductivity of 83.7% International Annealed Copper Standard.

A promising structure for fabricating high strength and high electrical conductivity copper alloys.

To address the trade-off between strength and electrical conductivity, we propose a strategy: introducing precipitated particles into a structure composed of deformation twins. A Cu-0.3%Zr alloy was designed to verify our strategy. Zirconium was dissolved into a copper matrix by solution treatment prior to cryorolling and precipitated in the form of Cu5Zr from copper matrix via a subsequent aging treatment. The microstructure evolutions of the processed samples were investigated by transmission electron microscopy and X-ray diffraction analysis, and the mechanical and physical behaviours were evaluated through tensile and electrical conductivity tests. The results demonstrated that superior tensile strength (602.04 MPa) and electrical conductivity (81.4% IACS) was achieved. This strategy provides a new route for balancing the strength and electrical conductivity of copper alloys, which can be developed for large-scale industrial application.