Epoxy Resins With Controllable "Thermally Conductive-Self-Healing" Synergies: a New Material to Meet the Needs of Flexible Electronic Devices.

With the popularization of 5G technology and artificial intelligence, thermally conductive epoxies with self-healing ability will be widely used in flexible electronic materials. Although many compounds containing both performances have been synthesized, there is little systematic theory to explain the coordination mechanism. In this paper, alkyl chains of different lengths were introduced to epoxies to discuss the thermally conductive, the self-healing performance, and the synergistic effect. A series of electronic-grade biphenyl epoxies (4,4'-bis(oxiran-2-ylmethoxy)-1,1'-biphenyl (1), 4,4'-bis(2-(oxiran-2-yl)ethoxy)-1,1'-biphenyl (2), 4,4'-bis(3-(oxiran-2-yl)propoxy)-1,1'-biphenyl (3), and 4,4'-bis(4-(oxiran-2-yl)butoxy)-1,1'-biphenyl (4) were synthesized and characterized. Furthermore, they were cured with decanedioic acid to produce polymers. Results showed that alkyl chains can both affect the two properties, and the epoxies suitable for specific application scenarios can be prepared by adjusting the length of alkyl chains. In terms of thermal conductivity, compound 1 was a most promising material. However, compound 4 was expected to be utilized in flexible electronic devices because of its acceptable thermal conductivity, self-healing ability, transparency, and flexibility.

Polyethylene glycol with dual three-dimensional porous carbon nanotube/diamond: a high thermal conductivity of composite PCM.

Polyethylene glycol (PEG) is widely used as a phase change material (PCM) in thermal energy storage systems due to its high latent heat and chemical stability. However, practical application has been hindered by its low thermal conductivity and leakage issues. Therefore, developing shape-stable high thermal conductivity PCM is of great importance. In this study, new shape-stable composite PCM with high thermal conductivity and leak-prevention capabilities were designed. The porous carbon skeleton of diamond foam (DF) and dual-3D carbon nanotube-diamond foam (CDF) were prepared using the microwave plasma chemical vapor deposition method. The composite materials (DF/PEG and CDF/PEG) were produced by vacuum impregnation with PEG and skeletons. The results showed that CDF/PEG had the highest thermal conductivity, measuring 2.30 W·m-1·K-1, which is 707% higher than that of pure PEG. The employing of 3D networks of CNTs, which can improve the phonon mean free path in DF/PEG (1.79 W·m-1·K-1) while reducing phonon dispersion.The phonon vibration of dual-3D CDF plays an important role in heat transfer. PEG was physically absorbed and well-distributed in CDF, alleviating leakage of liquid PEG. The weight loss of CDF/PEG was only 25% at 70 °C for 120 s. Using CDF is an attractive and efficient strategy to increase the heat transfer of PEG and improve heat storage efficiency, alleviate the problem of poor shape-stability.

Improved Self-Heating in Short-Channel Monolayer WS2 Transistors with High-Thermal Conductivity BeO Dielectrics.

Two-dimensional semiconducting transition metal dichalcogenides (TMDs) enable ultimate channel length scaling of transistor technology due to their atomic-thin body nature, which also brings the challenge of a pronounced self-heating effect inside the ultrathin channel. In particular, high current density under high electric field could lead to negative differential resistance behavior due to self-heating, not only limiting the current carrying capability of the TMDs transistors but also leading to severe reliability issues. Here, we report high-performance monolayer WS2 transistors on a high-thermal-conductivity BeO dielectric with effective suppression of the self-heating effects, eliminating the negative differential resistance behavior at high field, as observed in the case of the HfO2 dielectric. The monolayer CVD WS2 device on BeO with a 50 nm channel length exhibits a record-high on-state current of 325 µA/µm, transconductance (gm) of 150 µS/µm, and a on/off ratio of 1.8 × 108 at Vds = 1 V, far exceeding previous results.

Supramolecular Interactions Lead to Remarkably High Thermal Conductivities in Interpenetrated Two-Dimensional Porous Crystals.

The design of innovative porous crystals with high porosities and large surface areas has garnered a great deal of attention over the past few decades due to their remarkable potential for a variety of applications. However, heat dissipation is key to realizing their potential. We use systematic atomistic simulations to reveal that interpenetrated porous crystals formed from two-dimensional (2D) frameworks possess remarkable thermal conductivities at high porosities in comparison to their three-dimensional (3D) single framework and interpenetrated 3D framework counterparts. In contrast to conventional understanding, higher thermal conductivities are associated with lower atomic densities and higher porosities for porous crystals formed from interpenetrating 2D frameworks. We attribute this to lower phonon-phonon scattering and vibrational hardening from the supramolecular interactions that restrict atomic vibrational amplitudes, facilitating heat conduction. This marks a new regime of materials design combining ultralow mass densities and ultrahigh thermal conductivities in 2D interpenetrated porous crystals.

Low Tortuous, Highly Conductive, and High-Areal-Capacity Battery Electrodes Enabled by Through-thickness Aligned Carbon Fiber Framework.

Thick electrode with high-areal-capacity is a practical and promising strategy to increase the energy density of batteries, but development toward thick electrode is limited by the electrochemical performance, mechanical properties, and manufacturing approaches. In this work, we overcome these limitations and report an ultrathick electrode structure, called fiber-aligned thick or FAT electrode, which offers a novel electrode design and a scalable manufacturing strategy for high-areal-capacity battery electrodes. The FAT electrode uses aligned carbon fibers to construct a through-thickness fiber-aligned electrode structure with features of high electrode material loading, low tortuosity, high electrical and thermal conductivity, and good compression property. The low tortuosity of FAT electrode enables fast electrolyte infusion and rapid electron/ion transport, exhibiting a higher capacity retention and lower charge transfer resistance than conventional slurry-casted thick electrode design.

Constructal Design of an Arrow-Shaped High Thermal Conductivity Channel in a Square Heat Generation Body.

A heat conduction model with an arrow-shaped high thermal conductivity channel (ASHTCC) in a square heat generation body (SHGB) is established in this paper. By taking the minimum maximum temperature difference (MMTD) as the optimization goal, constructal designs of the ASHTCC are conducted based on single, two, and three degrees of freedom optimizations under the condition of fixed ASHTCC material. The outcomes illustrate that the heat conduction performance (HCP) of the SHGB is better when the structure of the ASHTCC tends to be flat. Increasing the thermal conductivity ratio and area fraction of the ASHTCC material can improve the HCP of the SHGB. In the discussed numerical examples, the MMTD obtained by three degrees of freedom optimization are reduced by 8.42% and 4.40%, respectively, compared with those obtained by single and two degrees of freedom optimizations. Therefore, three degrees of freedom optimization can further improve the HCP of the SHGB. Compared the HCPs of the SHGBs with ASHTCC and the T-shaped one, the MMTD of the former is reduced by 13.0%. Thus, the structure of the ASHTCC is proven to be superior to that of the T-shaped one. The optimization results gained in this paper have reference values for the optimal structure designs for the heat dissipations of various electronic devices.

Thermal Properties and Phonon Spectral Characterization of Synthetic Boron Phosphide for High Thermal Conductivity Applications.

Heat dissipation is an increasingly critical technological challenge in modern electronics and photonics as devices continue to shrink to the nanoscale. To address this challenge, high thermal conductivity materials that can efficiently dissipate heat from hot spots and improve device performance are urgently needed. Boron phosphide is a unique high thermal conductivity and refractory material with exceptional chemical inertness, hardness, and high thermal stability, which holds high promises for many practical applications. So far, however, challenges with boron phosphide synthesis and characterization have hampered the understanding of its fundamental properties and potential applications. Here, we describe a systematic thermal transport study based on a synergistic synthesis-experimental-modeling approach: we have chemically synthesized high-quality boron phosphide single crystals and measured their thermal conductivity as a record-high 460 W/mK at room temperature. Through nanoscale ballistic transport, we have, for the first time, mapped the phonon spectra of boron phosphide and experimentally measured its phonon mean free-path spectra with consideration of both natural and isotope-pure abundances. We have also measured the temperature- and size-dependent thermal conductivity and performed corresponding calculations by solving the three-dimensional and spectral-dependent phonon Boltzmann transport equation using the variance-reduced Monte Carlo method. The experimental results are in good agreement with that predicted by multiscale simulations and density functional theory, which together quantify the heat conduction through the phonon mode dependent scattering process. Our finding underscores the promise of boron phosphide as a high thermal conductivity material for a wide range of applications, including thermal management and energy regulation, and provides a detailed, microscopic-level understanding of the phonon spectra and thermal transport mechanisms of boron phosphide. The present study paves the way toward the establishment of a new framework, based on the phonon spectra-material structure relationship, for the rational design of high thermal conductivity materials and nano- to multiscale devices.

Significantly Promoting the Thermal Conductivity and Machinability of Negative Thermal Expansion Alloy via In Situ Precipitation of Copper Networks.

Rapid advancements in electronic devices yield an urgent demand for high-performance electronic packaging materials with high thermal conductivity, low thermal expansion, and great mechanical properties. However, it is a great challenge for current design philosophies to fulfill all the requirements simultaneously. Here, an effective strategy is proposed for significantly promoting the thermal conductivity and machinability of negative thermal expansion alloy (Zr,Nb)Fe2 through eutectic precipitation of copper networks. The eutectic dual-phase alloy exhibits an isotropic chips-matched thermal expansion coefficient and a thermal conductivity enhancement exceeding 200% compared with (Zr,Nb)Fe2, along with an ultimate compressive strength of 550 MPa. The addition of copper reorganizes the composition of (Zr,Nb)Fe2, which smooths the magnetic transition and shifts it toward higher temperature, resulting in linear low thermal expansion in a wide temperature range. The highly fine eutectic copper lamellae construct high thermal conductivity networks within (Zr,Nb)Fe2, serving as highways for heat transfer electrons and phonons. The in situ forming of eutectic copper lamellae also facilitates the mechanical properties by enhancing interfacial bonding and bearing additional stress after yielding of (Zr,Nb)Fe2. This work provides a novel strategy for promoting thermal conductivity and mechanical properties of negative thermal expansion alloys via eutectic precipitation of copper networks.

Dual-Effect Coupling for Superior Dielectric and Thermal Conductivity of Polyimide Composite Films Featuring "Crystal-Like Phase" Structure.

To match the increasing miniaturization and integration of electronic devices, higher requirements are put on the dielectric and thermal properties of the dielectrics to overcome the problems of delayed signal transmission and heat accumulation. Here, a 3D  porous thermal conductivity network is successfully constructed inside the polyimide (PI) matrix by the combination of ionic liquids (IL) and calcium fluoride (CaF2 ) nanofillers, motivated by the bubble-hole forming orientation force. Benefiting from the 3D thermal network formed by IL as a porogenic template and "crystal-like phase" structures induced by CaF2 - polyamide acid charge transfer, IL-10 vol% CaF2 /PI porous film exhibits a low permittivity of 2.14 and a thermal conductivity of 7.22 W m-1 K-1 . This design strategy breaks the bottleneck that low permittivity and high thermal conductivity in microelectronic systems are difficult to be jointly controlled, and provides a feasible solution for the development of intelligent microelectronics.

Scalable Compliant Graphene Fiber-Based Thermal Interface Material with Metal-Level Thermal Conductivity via Dual-Field Synergistic Alignment Engineering.

High-performance thermal interface materials (TIMs) are highly desired for high-power electronic devices to accelerate heat dissipation. However, the inherent trade-off conflict between achieving high thermal conductivity and excellent compliance of filler-enhanced TIMs results in the unsatisfactory interfacial heat transfer efficiency of existing TIM solutions. Here, we report the graphene fiber (GF)-based elastic TIM with metal-level thermal conductivity via mechanical-electric dual-field synergistic alignment engineering. Compared with state-of-the-art carbon fiber (CF), GF features both superb high thermal conductivity of ∼1200 W m-1 K-1 and outstanding flexibility. Under dual-field synergistic alignment regulation, GFs are vertically aligned with excellent orientation (0.88) and high array density (33.5 mg cm-2), forming continuous thermally conductive pathways. Even at a low filler content of ∼17 wt %, GF-based TIM demonstrates extraordinarily high through-plane thermal conductivity of up to 82.4 W m-1 K-1, exceeding most CF-based TIMs and even comparable to commonly used soft indium foil. Benefiting from the low stiffness of GF, GF-based TIM shows a lower compressive modulus down to 0.57 MPa, an excellent resilience rate of 95% after compressive cycles, and diminished contact thermal resistance as low as 7.4 K mm2 W-1. Our results provide a superb paradigm for the directed assembly of thermally conductive and flexible GFs to achieve scalable and high-performance TIMs, overcoming the long-standing bottleneck of mechanical-thermal mismatch in TIM design.

The Microstructure and Thermal Conductive Behavior of Three-Dimensional Carbon/Carbon Composites with Ultrahigh Thermal Conductivity.

Carbon-based composite materials, denoted as C/C composites and possessing high thermal conductivity, were synthesized utilizing a three-dimensional (3D) preform methodology. This involved the orthogonal weaving of mesophase pitch-based fibers in an X (Y) direction derived from low-temperature carbonization, and commercial PAN-based carbon fibers in a Z direction. The 3D preforms were saturated with mesophase pitch in their raw state through a hot-pressing process, which was executed under relatively low pressure at a predetermined temperature. Further densification was achieved by successive stages of mesophase pitch impregnation (MPI), followed by impregnation with coal pitch under high pressure (IPI). The microstructure and thermal conductivity of the C/C composites were systematically examined using a suite of analytical techniques, including Scanning Electron Microscopy (SEM), X-ray Diffraction (XRD), and PLM, amongst others. The findings suggest that the volumetric fraction of fibers and the directional alignment of the mesophase pitch molecules can be enhanced via hot pressing. The high graphitization degree of the mesophase pitch matrix results in an increased microcrystalline size and thus improved thermal conductivity of the C/C composite. Conversely, the orientation of the medium-temperature coal pitch matrix is relatively low, which compensates for the structural inadequacies of the composite material, albeit contributing minimally to the thermal conductivity of the resultant C/C composites. Following several stages of impregnation with mesophase pitch and subsequent impregnation with medium-temperature coal pitch, the 3D C/C composites yielded a density of 1.83 and 2.02 g/cm3. The thermal conductivity in the X (Y) direction was found to be 358 and 400 W/(m·K), respectively.

Significantly Improve the Thermal Conductivity and Dielectric Performance of Epoxy Composite by Introducing Boron Nitride and POSS.

Dielectric materials with superb thermal and electrical properties are highly desired for high-voltage electrical equipment and advanced electronics. Here, we propose a novel strategy to improve the performance of epoxy composites by employing boron nitride nanosheets (BNNSs) and γ-glycidyl ether oxypropyl sesimoxane (G-POSS) as functional fillers. The resultant ternary epoxy composites exhibit high electrical resistivity (1.63 × 1013 Ω·cm) and low dielectric loss (<0.01) due to the ultra-low dielectric constants of cage-structure of G-POSS. In addition, a high thermal conductivity of 0.3969 W·m-1·K-1 is achieved for the epoxy composites, which is 114.66% higher than that of pure epoxy resin. This can be attributed to the high aspect ratio and excellent thermally conductive characteristics of BNNSs, promoting phonon propagation in the composites. Moreover, the epoxy composite simultaneously possesses remarkable dynamic mechanical properties and thermal stability. It is believed that this work provides a universal strategy for designing and fabricating multifunctional composites using a combination of different functional fillers.

Modeling the impact of high thermal conductivity paper on the performance and life of power transformers.

Degradation of insulation paper is a key contributor to the failure of power transformers. Insulation degradation accelerates at elevated temperatures, which highlights the potential for better thermal management to prolong life. While several studies have analyzed the benefits of high thermal conductivity oil for reducing temperatures inside a transformer, this study is an initial assessment of the benefits of high thermal conductivity paper on transformer life. Blending particulates with cellulosic fibers offers a pathway for high thermal conductivity paper (with good dielectric properties), which can reduce internal temperatures. Presently, life extensions that can be achieved by the use of such thermally conducting papers were estimated, with the thermal conductivity of the paper being the key parameter under study. The analytical-numerical thermal model used in this study was validated against experimental measurements in a distribution transformer, adding confidence to the utility of the model. This model was then used to provide estimates of hot-spot temperature reduction resulting from the use of papers with higher thermal conductivity than baseline. Transformer life was predicted conventionally by tracking the degree of polymerization of paper over time, based on an Arrhenius model. Results indicate that increasing the thermal conductivity of paper from 0.2 W/mK (baseline) to 1 W/mK reduces the hot spot temperature by 10 °C. While degradation significantly depends on the moisture and oxygen content, the model shows that such a temperature reduction can increase life for all conditions, by as much as a factor of three.

Remarkably enhanced thermal properties of tobacco granules with high-thermal-conductivity nanoparticles.

Heated tobacco products (HTPs) are a novel type of cigarette that have received extensive attention. The tobacco plug could be made from tobacco granules (TGs), which are heated but not burned during the inhalation process. Thermal conductivity is an important property to evaluate the speed of heating TGs to meet the critical temperature for generating aerosol. Nevertheless, thermal physics properties of TGs is rarely reported. In this study, the thermophysical performance for the tobacco granules is systematically studied. An effective strategy of raising the thermal conductivity of TGs by introducing a small amount of nanoparticles of high-thermal-conductivity-materials (HTCMs, copper, silver, and graphene) is proposed, which not only results in a 35% improvement in the thermal conductivity but also reduces the maximum temperature for generating aerosol. In addition, introducing Cu and Ag particles in the TGs are favorable for improving the antibacterial effect. This method is worth promoting for enhancing the thermal conductivity of other plant-derived heated products.

High Performance Epoxy Composites Containing Nanofiller Modified by Plasma Bubbles.

The thermal conductivity of polymer materials is a fundamental parameter in the field of high-voltage electrical insulation. When the operating frequency and power for electrical equipment or electronic devices increase significantly, the internal heat will increase dramatically, and the accumulation of heat will further lead to insulation failure and serious damage of the whole system. The addition of filler with high thermal conductivity into polymer is a common solution. However, the interfacial thermal resistance between filler and bulk materials is the major obstacle to improve thermal conductivity. Herein, in order to reduce the interfacial thermal resistance, nanofillers are modified by plasma technology. The surface modification of nano-Al2O3 is carried out using plasma bubbles with three atmospheres (Ar, Ar+O2, air) as well as coupling agent. The situation of surface grafting before and after the modification is characterized using FTIR, XPS, and SEM. The effect of the mechanism of modification on the thermal conductivity and reaction pathway is investigated. The results showed that the thermal conductivity after plasma modification is increased significantly. Especially, the thermal conductivity is increased by 35% for the sample modified by Ar+O2 atmosphere. This results because more hydroxyl is introduced on the filler surface by the plasma bubbles, which enhance the interface compatibility between filler and epoxy. In addition, surface insulation performance for the modified samples also is enhanced by 14%. This is associated with the change of surface resistance and trap distribution. These results provide potential support for the development of fabrication for high performance epoxy composites.

Mechanical and Thermal Properties of the High Thermal Conductivity Steel (HTCS) Additively Manufactured via Powder-Fed Direct Energy Deposition.

High thermal conductivity steel (HTCS-150) is deposited onto non-heat-treated AISI H13 (N-H13) via powder-fed direct energy deposition (DED) based on the response surface methodology (RSM) to enhance the mechanical properties and thermal conductivity of N-H13, which is generally used as a hot-work tool steel. The main process parameters of the powder-fed DED are priorly optimized to minimize defects in the deposited regions and, therefore, to obtain homogeneous material properties. The deposited HTCS-150 is comprehensively evaluated through hardness, tensile, and wear tests at the different temperatures of 25, 200, 400, 600, and 800 °C. Compared to conventionally heat-treated (quenched and tempered) H13 (HT-H13), the hardness of the additively manufactured HTCS-150 slightly increases at 25 °C, whereas it does not show any significant difference above 200 °C. However, the HTCS-150 deposited on N-H13 shows a lower ultimate tensile strength and elongation than HT-H13 at all tested temperatures, and the deposition of the HTCS-150 on N-H13 enhances the ultimate tensile strength of N-H13. While the HTCS-150 does not show a significant difference in the wear rate below 400 °C compared to HT-H13, it shows a lower wear rate above 600 °C. The HTCS-150 reveals a higher thermal conductivity than the HT-H13 below 600 °C, whereas the behavior is reversed at 800 °C. The results suggest that the HTCS-150 additively manufactured via powder-fed direct energy deposition can enhance the mechanical and thermal properties of N-H13, including hardness, tensile strength, wear resistance, and thermal conductivity in a wide range of temperatures, often superior to those of HT-H13.

Oriented High Thermal Conductivity Solid-Solid Phase Change Materials for Mid-Temperature Solar-Thermal Energy Storage.

As the global energy crisis intensifies, the development of solar energy has become a vital area of focus for many nations. The utilization of phase change materials (PCMs) for photothermal energy storage in the medium temperature range holds great potential for various applications, but their conventional forms face several challenges. For instance, the longitudinal thermal conductivity of photothermal PCMs is inadequate for effective heat storage on the photothermal conversion surface, and there is a risk of leakage due to repeated solid-liquid phase transitions. Here, we report a solid-solid phase change material, tris(hydroxymethyl)aminomethane (TRIS), which has a phase change temperature of 132 °C in the medium temperature range, enabling high-grade and stable solar energy storage. To overcome the low thermal conductivity problem, we propose a large-scale production of oriented high thermal conductivity composites by compressing a mixture of TRIS and expanded graphite (EG) using the pressure induction method to create in-plane highly thermally conductive channels. Remarkably, the resulting phase change composites (PCCs) exhibit a directional thermal conductivity of 21.3 W/(m·K). Furthermore, the high phase change temperature (132 °C) and large phase change entropy (213.47 J/g) enable a large-capacity high-grade thermal energy to be used. The developed PCCs, when combined with selected photo-absorbers, exhibit efficient integration of solar-thermal conversion and storage. Additionally, we also demonstrated a solar-thermoelectric generator device with an energy output of 93.1 W/m2, which is close to the power of photovoltaic systems. Overall, this work provides a technological route to the large-scale fabrication of mid-temperature solar energy storage materials with high thermal conductivity, high phase change enthalpy, and no risk of leakage, and also offers a potential alternative to photovoltaic technology.

Polypyrrole coated carbon nanotube aerogel composite phase change materials with enhanced thermal conductivity, high solar-/electro- thermal energy conversion and storage.

Phase change materials (PCMs) have been widely investigated as promising thermal management materials due to their high thermal storage capacity, satisfactory heat transfer rate and multi-responsive energy conversion and storage characteristics. In this work, a shape-stabilized solar-/electro- responsive thermal energy capture and storage system is proposed involving polypyrrole (PPy)-deposited carbon nanotubes (CNT) heterogeneous porous aerogel as a supporting matrix and the paraffin wax (PW) as a PCM. The composite PCMs obtained via integration of PW into aerogel supports present a relatively high thermal storage density of 160.9 J/g and outstanding phase transition stability even after 100 heating-cooling cycles. Furthermore, great enhancement of thermal conductivity (0.64 W/m-1·K-1, 2.56 times that of PW) is achieved in the composite PCMs by inducing PPy coating as a binder in the gap between CNTs. The mechanism of heat transport enhancement is explored by molecular dynamics simulation. It concludes that the in-situ polymerization of PPy through the vapor deposition method on the CNT aerogels effectively builds additional thermal transfer channels and enhances the heat transport between CNT by coordinating the carbon atom vibration. Herein, this reported stratagem may shed light on preparing composite PCMs with high thermal conductivity and multi-energy utilization functions.

Vitrimeric silicone composite with high thermal conductivity and high repairing efficiency as thermal interface materials.

Thermally conductive composites with self-healing ability can not only solve the heat dissipation problem of integrated electronic devices but also help improve their service life, thereby reducing electronic waste. In this study, a self-repairing thermally conductive composite with good electrical insulation, high thermal conductivity, high healing efficiency, and excellent mechanical strength was designed and prepared using a silicon vitrimer as the matrix and functionalized boron nitride nanosheets (fBNNS) as the thermally conductive filler. The tensile strength of the vitrimers with 10 wt% of octaglycidyl polyhedral oligomeric silsesquioxane (POSS) increased by 2.82 times to 8.4 ± 0.1 MPa with respect to that without POSS. In addition, the composites exhibited excellent thermal conductivity of 1.41 ± 0.05 W/mK with 66 wt% of fBNNS, which is more than 6 times higher than that of undoped elastomers. More importantly, the repair efficiency of undoped vitrimeric silicone can be as high as 98.8 ± 1.1%, which was slightly reduced to over 92.0% by adding 66 wt% of fBNNS. Further, it could recover 99.3% of the thermal conductivity even after 6 healing cycles. The self-healing thermally conductive composites exhibited excellent wettability and good adhesion to different wafers and substrates, demonstrating excellent performance as thermal interface materials for high-power electronic devices.

Design and Preparation of Localized Heat-Resistant Coating.

Localized heat sources, such as flame guns and high-energy lasers, can cause severe damage to conventional materials. In this study, a novel localized heat-resistant coating with a high in-plane thermal conductivity was designed and prepared. Reduced graphene oxide (rGO) effectively improved the in-plane thermal conductivity of the polyvinyl alcohol (PVA) film, while maintaining the thermal insulation of the resin matrix in the through-plane direction. This characteristic of the rGO/PVA film was combined with the thermal insulation of boron-modified phenolic resin (BPF), and the prepared composite coating with two layers of rGO/PVA films effectively lowered the back-surface temperature in the flame ablation test from 151 to 107 °C. In addition, the area of the ablation-affected region of coating was increased to 103.6 cm2 from 31.9 cm2, indicating an excellent heat transfer performance. The layer-by-layer structure could realize the compatibility of high in-plane thermal conductivity and good through-plane thermal insulation. The synergy of these two different characteristics is demonstrated to be the key to improving the localized heat-resistant performance of the composite coating. This study effectively expands the application range of high-conductive film, and the obtained coating could act as a shield against butane flame, high energy lasers, and other localized heat.