Numerical Calculation of Apparent Contact Angles on the Hierarchical Surface with Array Microstructures by Wire Electrical Discharge Machining.

It is necessary to theoretically research wettability in superhydrophobic surface fabrication. Here, a numerical calculation approach is proposed for determining the contact angle of the water droplets on array micropillars by wire electrical discharge machining (WEDM). A hierarchical model is employed for these array microstructures, including mechanical analysis for a water droplet placed on a smooth array and wettability evaluation on the morphology of the WEDM surface. On pillars, equations are listed to solve the apparent contact angle according to force balance of gravity, tension, and pressure. As for the WEDM morphology, temperature simulation and measurement are carried out, and then the effect of roughness on surface wettability is studied. Constructed formulas predict the contact angle, and then the effect of geometric dimensions is obtained. In order to verify the assumption, array micropillars with different cross-profiles are prepared using high-speed WEDM on the Al alloy surface. Through the results of contact angle determination, the numerical calculation is carried out. This theoretical prediction is beneficial for improving the fabrication of the superhydrophobic surface by WEDM.

Micro Electrochemical Machining of Array Micro-Grooves Using In-Situ Disk Electrode Fabricated by Micro-WEDM.

This paper develops an array micro-grooves manufacturing method using micro electrochemical machining (ECM) with disk electrode, which is prepared by in-situ micro wire electrical discharge machining (WEDM). This technology focuses on the difficulty of array structure manufacture in micro-electro-mechanical systems (MEMS). A micro-ECM system is built based on the micro-WEDM machine to achieve high precision processing of the array micro-grooves. Since micro-WEDM has good performance in high precision machining of the rotating structure, single and multi-edge disk electrodes can be fabricated in-situ using graphite. The as-prepared disk tool electrode is directly used for micro-electrochemical milling of the array micro-grooves without disassembling away from the device, which avoids the positioning error caused by the re-clamping of the disk electrode. With the advantages of high surface quality and no electrode loss, micro-ECM improves the manufacture performance of the micro-parts. Through wire path optimization, the shape accuracy of the disk edge is improved. After the research of the micro-ECM parameters, the process is improved, and finally, the high precision array micro-grooves are obtained. This method combines the advantages of micro-WEDM and disk electrode micro-ECM milling, and it is convenient for large-scale manufacture of array micro-structures on micro-parts and MEMS.