RESUMO
In this work, we present metalenses (MLs) designed to enhance the luminous intensity of incoherent light-emitting diodes (LEDs) within the detection angles of 0° and 10°. The detection angle of 0° refers to the center of the LED. Because the light emitted from LEDs is incoherent and expressed as a surface light source, they are numerically described as a set of point sources and calculated using incoherent summation. The titanium dioxide (TiO2) and amorphous silicon (a-Si) nanohole meta-atoms are designed; however, the full 2π phase coverage is not reached. Nevertheless, because the phase modulation at the edge of the ML is important, an ML is successfully designed. The typical phase profile of the ML enhances the luminous intensity at the center, and the phase profile is modified to increase the luminous intensity in the target detection angle region. Far field simulations are conducted to calculate the luminous intensity after 25 m of propagation. We demonstrate an enhancement of the luminous intensity at the center by 8551% and 2115% using TiO2 and a-Si MLs, respectively. Meanwhile, the TiO2 and a-Si MLs with the modified phase profiles enhance the luminous intensity within the detection angle of 10° by 263% and 30%, respectively.
RESUMO
In this study, two kinds of copper micro-patterned surfaces with different heights were fabricated by using a powder injection molding (PIM) process. The micro-pattern's size was 100 µm, and the gap size was 50 µm. The short micro-pattern's height was 100 µm, and the height of the tall one was 380 µm. A copper powder and wax-polymer-based binder system was used to fabricate the micro-patterned surfaces. The critical heat flux (CHF) and heat transfer coefficient (HTC) during pool-boiling tests were measured with the micro-patterned surfaces and a reference plain copper surface. The CHF of short and tall micro-patterned surfaces were 1434 and 1444 kW/m², respectively, and the plain copper surface's CHF was 1191 kW/m². The HTC of the plain copper surface and the PIM surface with short and tall micro-patterned surfaces were similar in value up to a heat flux 1000 kW/m². Beyond that value, the plain surface quickly reached its CHF, while the HTC of the short micro-patterned surface achieved higher values than that of the tall micro-patterned surface. At CHF, the maximum values of HTC for the short micro-pattern, tall micro-pattern, and the plain copper surface were 68, 58, and 57 kW/m² K.