RESUMO
Humans are undergoing a fateful transformation focusing on artificial intelligence, quantum information technology, virtual reality, etc., which is inseparable from intelligent nano-micro devices. However, the booming of "Big Data" brings about an even greater challenge by growing electromagnetic radiation. Herein, an innovative flexible multifunctional microsensor is proposed, opening up a new horizon for intelligent devices. It integrates "non-crosstalk" multiple perception and green electromagnetic interference shielding only in one pixel, with satisfactory sensitivity and fast information feedback. Importantly, beneficial by deep insight into the variable-temperature electromagnetic response, the microsensor tactfully transforms the urgent threat of electromagnetic radiation into "wealth," further integrating self-power. This result will refresh researchers' realization of next-generation devices, ushering in a new direction for aerospace engineering, remote sensing, communications, medical treatment, biomimetic robot, prosthetics, etc.
RESUMO
This study simulates thermal conductivity via a carrier scattering mechanism and the related parameters are obtained based on first principles for intrinsic and doped silicon carbide (SiC) over a temperature range of 300-1450 K. The theoretical analysis results show that the thermal conductivity decreases with increasing temperature along each orientation for both cubic SiC (3C-SiC) and doped SiC. Compared with traditional calculations, the thermal conductivity of doped SiC is larger than that of intrinsic SiC in the high-temperature region. In particular, the n-type thermal conductivity is higher than the p-type thermal conductivity because of the scattering probability between electrons and the ionization impurity increasing with the temperature. Our studies are important to a further understanding of thermal transportation.