Highly-stable silver nanobelts joined via diffusion-free attachment.

Silver nanobelts are demonstrated here to undergo inter-particle joining at relatively low temperatures of less than 180 °C. For surface-coated networks of nanobelts this joining reduced the network sheet resistance by 95%. The joining mechanism appears to be non-diffusional oriented attachment, caused by the thermal reactivation of the halted oriented attachment mechanism that occurred originally at room temperature during the rapid nanobelt synthesis. This self-assembly mechanism was explored by in situ electrical and calorimetric experiments, and supported by electron microscopy. Unlike pentagonal silver nanowires, silver nanobelts do not rely on diffusional instability to achieve workably low joining temperatures. The oriented attachment displayed by nanobelts represents a new approach to achieving valuable reductions in network resistance, disentangled from the instability and diffusion-driven failure by nanoparticle degradation displayed by competing silver nanoparticles.

Miniature environmental chambers for temperature humidity bias testing of microelectronics.

Environmental chambers are commonly used for reliability testing of microelectronics and other products and materials. These chambers are large, expensive, and limit electrical connectivity to devices under test. In this paper, we present a collection of ten small, low-cost environmental chambers, with humidity control based on mixtures of water and glycerol placed inside the chambers. We demonstrate relative humidities from 44% to 90%, at temperatures from 30 to 85 °C, enabling industry-standard testing at 85% humidity and 85 °C. The division of samples between ten separate chambers allows different conditions to be applied to each sample, in order to quickly characterize the effects of the environment on device reliability, enabling extrapolation to estimate lifetimes in working conditions.