The Enzymatic Doped/Undoped Poly-Silicon Nanowire Sensor for Glucose Concentration Measurement.

In this work, enzymatic doped/undoped poly-silicon nanowire sensors with different lengths were fabricated using a top-down technique to measure glucose concentration. The sensitivity and resolution of these sensors correlate well with the dopant property and length of nanowire. Experimental results indicate that the resolution is proportional to the nanowire length and dopant concentration. However, the sensitivity is inversely proportional to the nanowire length. The optimum resolution can be better than 0.02 mg/dL for a doped type sensor with length of 3.5 µm. Furthermore, the proposed sensor was demonstrated for 30 applications with similar current-time response and showed good repeatability.

Enzymatic Glucose Fiber Sensor for Glucose Concentration Measurement with a Heterodyne Interferometry.

In this study, we developed a glucose fiber sensor incorporating heterodyne interferometry to measure the phase difference produced by the chemical reaction between glucose and glucose oxidase (GOx). Both theoretical and experimental results showed that the amount of phase variation is inversely proportional to glucose concentration. The proposed method provided a linear measurement range of the glucose concentration from 10 mg/dL to 550 mg/dL. The experimental results indicated that the sensitivity is proportional to the length of the enzymatic glucose sensor, and the optimum resolution can be obtained at a sensor length of 3 cm. The optimum resolution of the proposed method is better than 0.6 mg/dL. Moreover, the proposed sensor demonstrates good repeatability and reliability. The average relative standard deviation (RSD) is better than 10% and satisfied the minimum requirement for point-of-care devices.

Design and fabrication of a downlight luminaire with a dual frusto-conical reflector.

A design method and corresponding fabrication procedures are proposed for a dual frusto-conical reflector of a downlight luminaire. The profile of the dual frusto-conical reflector consists of two flat-slant reflective surfaces with slightly different slopes. The optimum dual frusto-conical reflector can be obtained with the proposed design method. The finished product of the dual frusto-conical reflector is fabricated by a 3D printer and followed by surface polishing and reflection paint spraying. The measurement results show that luminaires exhibited 70% optimum illuminance confined within an illumination area of 1.8m2, and the optimum illumination intensity is at 252 lux. The optimum efficiency of the proposed luminaire can reach 158 lm/W for normal-white light-emitting diode (LED) and 119 lm/W for warm-white LED, respectively.

Fabrication and Characterization of a Micro Methanol Sensor Using the CMOS-MEMS Technique.

A methanol microsensor integrated with a micro heater manufactured using the complementary metal oxide semiconductor (CMOS)-microelectromechanical system (MEMS) technique was presented. The sensor has a capability of detecting low concentration methanol gas. Structure of the sensor is composed of interdigitated electrodes, a sensitive film and a heater. The heater located under the interdigitated electrodes is utilized to provide a working temperature to the sensitive film. The sensitive film prepared by the sol-gel method is tin dioxide doped cadmium sulfide, which is deposited on the interdigitated electrodes. To obtain the suspended structure and deposit the sensitive film, the sensor needs a post-CMOS process to etch the sacrificial silicon dioxide layer and silicon substrate. The methanol senor is a resistive type. A readout circuit converts the resistance variation of the sensor into the output voltage. The experimental results show that the methanol sensor has a sensitivity of 0.18 V/ppm.

Sol-gel zinc oxide humidity sensors integrated with a ring oscillator circuit on-a-chip.

The study develops an integrated humidity microsensor fabricated using the commercial 0.18 µm complementary metal oxide semiconductor (CMOS) process. The integrated humidity sensor consists of a humidity sensor and a ring oscillator circuit on-a-chip. The humidity sensor is composed of a sensitive film and branch interdigitated electrodes. The sensitive film is zinc oxide prepared by sol-gel method. After completion of the CMOS process, the sensor requires a post-process to remove the sacrificial oxide layer and to coat the zinc oxide film on the interdigitated electrodes. The capacitance of the sensor changes when the sensitive film adsorbs water vapor. The circuit is used to convert the capacitance of the humidity sensor into the oscillation frequency output. Experimental results show that the output frequency of the sensor changes from 84.3 to 73.4 MHz at 30 °C as the humidity increases 40 to 90%RH.

Modeling and manufacturing of a micromachined magnetic sensor using the CMOS process without any post-process.

The modeling and fabrication of a magnetic microsensor based on a magneto-transistor were presented. The magnetic sensor is fabricated by the commercial 0.18 mm complementary metal oxide semiconductor (CMOS) process without any post-process. The finite element method (FEM) software Sentaurus TCAD is utilized to analyze the electrical properties and carriers motion path of the magneto-transistor. A readout circuit is used to amplify the voltage difference of the bases into the output voltage. Experiments show that the sensitivity of the magnetic sensor is 354 mV/T at the supply current of 4 mA.

Common-path laser planar encoder.

This paper presents a common-path laser planar encoder (CLPE) for displacement measurements in the X- and Y- axes. The CLPE can effectively reduce the environmental disturbance to its lowest level. The experimental results of the CLPE match well with those of HP5529A for both short and long ranges. The CLPE can measure 2D displacement with high resolutions of 0.07 ± 0.021 nm and 0.07 ± 0.023 nm in the X- and Y- axes and also presents high system stabilities of -0.59 ± 0.43 nm/h and -0.63 ± 0.47 nm/h respectively in the X- and Y- axes. The CLPE has promising potential for nanometer resolution and large-range applications.

Heterodyne common-path grating interferometer with Littrow configuration.

This paper presents a heterodyne common-path grating interferometer with Littrow configuration (HCGIL). The HCGIL can effectively overcome environmental disturbance effect and the DC offset and the amplitude variation of the measurement signals. Experimental results match well with the HP5529A results for long-range measurements. Results also show that the estimated measurement resolution is 0.15 ± 0.027 nm. The stability of the HCGIL is -0.41 ± 0.23 nm. Therefore, the HCGIL has potential for subnanometer resolution and long-range applications.

Energy harvesting thermoelectric generators manufactured using the complementary metal oxide semiconductor process.

This paper presents the fabrication and characterization of energy harvesting thermoelectric micro generators using the commercial complementary metal oxide semiconductor (CMOS) process. The micro generator consists of 33 thermocouples in series. Thermocouple materials are p-type and n-type polysilicon since they have a large Seebeck coefficient difference. The output power of the micro generator depends on the temperature difference in the hot and cold parts of the thermocouples. In order to increase this temperature difference, the hot part of the thermocouples is suspended to reduce heat-sinking. The micro generator needs a post-CMOS process to release the suspended structures of hot part, which the post-process includes an anisotropic dry etching to etch the sacrificial oxide layer and an isotropic dry etching to remove the silicon substrate. Experiments show that the output power of the micro generator is 9.4 mW at a temperature difference of 15 K.

Thermoelectric Energy Micro Harvesters with Temperature Sensors Manufactured Utilizing the CMOS-MEMS Technique.

This study develops a TEMH (thermoelectric energy micro harvester) chip utilizing a commercial 0.18 µm CMOS (complementary metal oxide semiconductor) process. The chip contains a TEMH and temperature sensors. The TEMH is established using a series of 54 thermocouples. The use of the temperature sensors monitors the temperature of the thermocouples. One temperature sensor is set near the cold part of the thermocouples, and the other is set near the hot part of the thermocouples. The performance of the TEMH relies on the TD (temperature difference) at the CHP (cold and hot parts) of the thermocouples. The more the TD at the CHP of the thermocouples increases, the higher the output voltage and output power of the TEMH become. To obtain a higher TD, the cold part of the thermocouples is designed as a suspended structure and is combined with cooling sheets to increase heat dissipation. The cooling sheet is constructed of a stack of aluminum layers and is mounted above the cold part of the thermocouple. A finite element method software, ANSYS, is utilized to compute the temperature distribution of the TEMH. The TEMH requires a post-process to obtain the suspended thermocouple structure. The post-process utilizes an RIE (reactive ion etch) to etch the two sacrificial materials, which are silicon dioxide and silicon substrate. The results reveal that the structure of the thermocouples is completely suspended and does not show any injury. The measured results reveal that the output voltage of the TEMH is 32.5 mV when the TD between the CHP of the thermocouples is 4 K. The TEMH has a voltage factor of 8.93 mV/mm2K. When the TD between the CHP of the thermocouples is 4 K, the maximum output power of the TEMH is 4.67 nW. The TEMH has a power factor of 0.31 nW/mm2K2.

A zinc oxide nanorod ammonia microsensor integrated with a readout circuit on-a-chip.

A zinc oxide nanorod ammonia microsensor integrated with a readout circuit on-a-chip fabricated using the commercial 0.35 µm complementary metal oxide semiconductor (CMOS) process was investigated. The structure of the ammonia sensor is composed of a sensitive film and polysilicon electrodes. The ammonia sensor requires a post-process to etch the sacrificial layer, and to coat the sensitive film on the polysilicon electrodes. The sensitive film that is prepared by a hydrothermal method is made of zinc oxide. The sensor resistance changes when the sensitive film adsorbs or desorbs ammonia gas. The readout circuit is used to convert the sensor resistance into the voltage output. Experiments show that the ammonia sensor has a sensitivity of about 1.5 mV/ppm at room temperature.

Cobalt oxide nanosheet and CNT micro carbon monoxide sensor integrated with readout circuit on chip.

The study presents a micro carbon monoxide (CO) sensor integrated with a readout circuit-on-a-chip manufactured by the commercial 0.35 µm complementary metal oxide semiconductor (CMOS) process and a post-process. The sensing film of the sensor is a composite cobalt oxide nanosheet and carbon nanotube (CoOOH/CNT) film that is prepared by a precipitation-oxidation method. The structure of the CO sensor is composed of a polysilicon resistor and a sensing film. The sensor, which is of a resistive type, changes its resistance when the sensing film adsorbs or desorbs CO gas. The readout circuit is used to convert the sensor resistance into the voltage output. The post-processing of the sensor includes etching the sacrificial layers and coating the sensing film. The advantages of the sensor include room temperature operation, short response/recovery times and easy post-processing. Experimental results show that the sensitivity of the CO sensor is about 0.19 mV/ppm, and the response and recovery times are 23 s and 34 s for 200 ppm CO, respectively.

Fabrication of Wireless Micro Pressure Sensor Using the CMOS Process.

In this study, we fabricated a wireless micro FET (field effect transistor) pressure sensor based on the commercial CMOS (complementary metal oxide semiconductor) process and a post-process. The wireless micro pressure sensor is composed of a FET pressure sensor, an oscillator, an amplifier and an antenna. The oscillator is adopted to generate an ac signal, and the amplifier is used to amplify the sensing signal of the pressure sensor. The antenna is utilized to transmit the output voltage of the pressure sensor to a receiver. The pressure sensor is constructed by 16 sensing cells in parallel. Each sensing cell contains an MOS (metal oxide semiconductor) and a suspended membrane, which the gate of the MOS is the suspended membrane. The post-process employs etchants to etch the sacrificial layers in the pressure sensor for releasing the suspended membranes, and a LPCVD (low pressure chemical vapor deposition) parylene is adopted to seal the etch holes in the pressure. Experimental results show that the pressure sensor has a sensitivity of 0.08 mV/kPa in the pressure range of 0-500 kPa and a wireless transmission distance of 10 cm.

Manufacture of a Polyaniline Nanofiber Ammonia Sensor Integrated with a Readout Circuit Using the CMOS-MEMS Technique.

This study presents the fabrication of a polyaniline nanofiber ammonia sensor integrated with a readout circuit on a chip using the commercial 0.35 µm complementary metal oxide semiconductor (CMOS) process and a post-process. The micro ammonia sensor consists of a sensing resistor and an ammonia sensing film. Polyaniline prepared by a chemical polymerization method was adopted as the ammonia sensing film. The fabrication of the ammonia sensor needs a post-process to etch the sacrificial layers and to expose the sensing resistor, and then the ammonia sensing film is coated on the sensing resistor. The ammonia sensor, which is of resistive type, changes its resistance when the sensing film adsorbs or desorbs ammonia gas. A readout circuit is employed to convert the resistance of the ammonia sensor into the voltage output. Experimental results show that the sensitivity of the ammonia sensor is about 0.88 mV/ppm at room temperature.

Manufacture of Micromirror Arrays Using a CMOS-MEMS Technique.

In this study we used the commercial 0.35 µm CMOS (complementary metal oxide semiconductor) process and simple maskless post-processing to fabricate an array of micromirrors exhibiting high natural frequency. The micromirrors were manufactured from aluminum; the sacrificial layer was silicon dioxide. Because we fabricated the micromirror arrays using the standard CMOS process, they have the potential to be integrated with circuitry on a chip. For post-processing we used an etchant to remove the sacrificial layer and thereby suspend the micromirrors. The micromirror array contained a circular membrane and four fixed beams set symmetrically around and below the circular mirror; these four fan-shaped electrodes controlled the tilting of the micromirror. A MEMS (microelectromechanical system) motion analysis system and a confocal 3D-surface topography were used to characterize the properties and configuration of the micromirror array. Each micromirror could be rotated in four independent directions. Experimentally, we found that the micromirror had a tilting angle of about 2.55° when applying a driving voltage of 40 V. The natural frequency of the micromirrors was 59.1 kHz.

Laser linear encoder with both high fabrication and head-to-scale tolerances.

We introduce a new configuration for the optical head of a newly developed diffractive laser encoder system. This configuration has a high manufacturing tolerance and a high head-to-scale alignment tolerance, both of which can enhance the wider potential applicability of this newly designed laser encoder. The measurement principles of the encoder are discussed and detailed. We optimized the grating shape and analyzed the impact of the optical components and their arrangement on the measurement error. The head-to-scale alignment tolerance and the arrangement of components in the encoder were also determined. Finally, the measurement performance was evaluated and analyzed. Under nonenvironmentally controlled conditions, the measurement accuracy was found to be 37.3 nm with a standard deviation of 25.4 nm.

Design and construction of linear laser encoders that possess high tolerance of mechanical runout.

A linearly diffracted laser encoder that has high tolerance of head-to-scale misalignment and a high signal-to-noise ratio is described. The preservation of parallelism between the incident and the diffracted beams, which can be attributed to a built-in folded 1x telescope, allows for the high alignment tolerance. It can be shown that, by coupling this newly developed circular polarization interferometer configuration with grating scale geometry optimization, one can eliminate the problems associated with signal distortion that arise from various efficiencies of the p- and the s-polarized light beams and obtain a high signal-to-noise ratio. Both theoretical and experimental results are presented to confirm the improved results and performance.