Highly Anisotropic Thermally Conductive Dielectric Polymer/Boron Nitride Nanotube Composites for Directional Heat Dissipation.

An ideal dielectric material for microelectronic devices requires a combination of high anisotropic thermal conductivity and low dielectric constant (ɛ') and loss (tan δ). Polymer composites of boron nitride nanotubes (BNNTs), which offer excellent thermal and dielectric properties, show promise for developing these dielectric polymer composites. Herein, a simple method for fabricating polymer/BNNT composites with high directional thermal conductivity and excellent dielectric properties is presented. The nanocomposites with directionally aligned BNNTs are fabricated through melt-compounding and in situ fibrillation, followed by sintering the fibrous nanocomposites. The fabricated nanocomposites show a significant enhancement in thermal properties, with an in-plane thermal conductivity (K‖) of 1.8 Wm-1K-1-a 450% increase-yielding a high anisotropy ratio (K‖/K⊥) of 36, a 1700% improvement over isotropic samples containing only 7.2 vol% BNNT. These samples exhibit a 120% faster in-plane heat dissipation compared to the through-plane within 2 s. Additionally, they display low ɛ' of ≈3.2 and extremely low tan δ of ≈0.014 at 1 kHz. These results indicate that this method provides a new avenue for designing and creating polymer composites with enhanced directional heat dissipation properties along with high K‖, suitable for thermal management applications in electronic packaging, thermal interface materials, and passive cooling systems.

Insight into the Directional Thermal Transport of Hexagonal Boron Nitride Composites.

Ideal dielectric materials for microelectronic devices should have high directionally tailored thermoconductivity with low dielectric constant and loss. Hexagonal boron nitride (hBN) with excellent thermal and dielectric properties shows a promise for the fabrication of thermoconductive dielectric polymer composites. Herein, a simple method for the fabrication of lightweight polymer/hBN composites with high directionally tailored thermoconductivity and excellent dielectric properties is presented. The solid polymer/hBN composites are manufactured by melt-compounding and injection molding. The porous composites are successfully manufactured in an injection molding process through supercritical fluid (SCF) foaming. X-ray tomography provides direct visualization of the internal microstructure and hBN orientation, leading to an in-depth understanding of the directionally dependent thermoconductivity of the polymer/hBN composite. Shear-induced orientation of hBN platelets in the solid HDPE/hBN composites leads to a significant anisotropic thermal conductivity. The solid HDPE/23.2 vol % hBN composites show an in-plane thermoconductivity as high as 10.1 W m-1 K-1, whereas the through-plane thermoconductivity is limited to 0.28 W m-1 K-1. However, the generation of a porous structure via SCF foaming imparts in situ exfoliation, random orientation, and interconnectivity of hBN platelets within the polymer matrix. This results in highly isotropic thermoconductivity with higher bulk thermal conductivity in the lightweight porous composites as compared to their solid counterparts. Furthermore, the electrically insulating composites developed in this study exhibit low dielectric constant and ultralow dielectric loss. Thus, this study presents a simple fabrication method to develop lightweight dielectric materials with tailored thermal conductivity for modern electronics.

Enhanced Electrical and Electromagnetic Interference Shielding Properties of Polymer-Graphene Nanoplatelet Composites Fabricated via Supercritical-Fluid Treatment and Physical Foaming.

Lightweight high-density polyethylene (HDPE)-graphene nanoplatelet (GnP) composite foams were fabricated via a supercritical-fluid (SCF) treatment and physical foaming in an injection-molding process. We demonstrated that the introduction of a microcellular structure can substantially increase the electrical conductivity and can decrease the percolation threshold of the polymer-GnP composites. The nanocomposite foams had a significantly higher electrical conductivity, a higher dielectric constant, a higher electromagnetic interference (EMI) shielding effectiveness (SE), and a lower percolation threshold compared to their regular injection-molded counterparts. The SCF treatment and foaming exfoliated the GnPs in situ during the fabrication process. This process also changed the GnP's flow-induced arrangement by reducing the melt viscosity and cellular growth. Moreover, the generation of a cellular structure rearranged the GnPs to be mainly perpendicular to the radial direction of the bubble growth. This enhanced the GnP's interconnectivity and produced a unique GnP arrangement around the cells. Therefore, the through-plane conductivity increased up to a maximum of 9 orders of magnitude and the percolation threshold decreased by up to 62%. The lightweight injection-molded nanocomposite foams of 9.8 vol % GnP exhibited a real permittivity of ε' = 106.4, which was superior to that of their regular injection-molded (ε' = 6.2). A maximum K-band EMI SE of 31.6 dB was achieved in HDPE-19 vol % GnP composite foams, which was 45% higher than that of the solid counterpart. In addition, the physical foaming reduced the density of the HDPE-GnP foams by up to 26%. Therefore, the fabricated polymer-GnP nanocomposite foams in this study pointed toward the further development of lightweight and conductive polymer-GnP composites with tailored properties.