RESUMO
The development of materials with efficient heat dissipation capability has become essential for next-generation integrated electronics and flexible smart devices. Here, a 3D hybridized carbon film with graphene nanowrinkles and microhinge structures by a simple solution dip-coating technique using graphene oxide (GO) on polyimide (PI) skeletons, followed by high-temperature annealing, is constructed. Such a design provides this graphitized GO/PI (g-GO/PI) film with superflexibility and ultrahigh thermal conductivity in the through-plane (150 ± 7 W m-1 K-1 ) and in-plane (1428 ± 64 W m-1 K-1 ) directions. Its superior thermal management capability compared with aluminum foil is also revealed by proving its benefit as a thermal interface material. More importantly, by coupling the hypermetallic thermal conductivity in two directions, a novel type of carbon film origami heat sink is proposed and demonstrated, outperforming copper foil in terms of heat extraction and heat transfer for high-power devices. The hypermetallic heat dissipation performance of g-GO/PI carbon film not only shows its promising application as an emerging thermal management material, but also provides a facile and feasible route for the design of next-generation heat dissipation components for high-power flexible smart devices.
RESUMO
The low specific capacitance and energy density of carbon electrode has extremely limited the wide application of supercapacitors. For developing a high-performance carbon electrode using a simple and effective method, a fishnet-like, N-doped porous carbon (FNPC) film is prepared by calcining the KOH-activated polyindole precoated on carbon cloths. The FNPC film is tightly anchored on carbon cloths without any binder. The FNPC film with 3.8 at% N content exhibits a fairly high specific capacitance of 416 F g-1 at 1.0 A g-1. Moreover, the assembled button-type cell with two FNPC film electrodes shows a high energy density of 16.4 Wh kg-1, a high power density of 67.4 kW kg-1, and long-term cyclic stability of 92% of the initial capacitance after 10 000 cycles at 10 A g-1. The high performances mainly came from the integration of pseudocapacitance and electrical double-layer capacitance behavior, wettability, fishnet-like nanostructure, as well as the low interfacial resistivity. This strategy provides a practical, uncomplicated, and low-cost design of binder-free flexible carbon materials electrode for high-performance supercapacitors.
RESUMO
Large area molecular junctions were fabricated on electron-beam deposited carbon (eC) surfaces with molecular layers in the range of 2-5.5 nm between conducting, amorphous carbon contacts. Incorporating eC as an interconnect between Au and the molecular layer improves substrate roughness, prevents electromigration and uses well-known electrochemistry to form a covalent C-C bond to the molecular layer. Au/eC/anthraquinone/eC/Au junctions were fabricated on Si/SiOx with high yield and reproducibility and were unchanged by 10(7) current-voltage cycles and temperatures between 80 and 450 K. Au/eC/AQ/eC/Au devices fabricated on plastic films were unchanged by 10(7) current density vs bias voltage (J-V) cycles and repeated bending of the entire assembled junction. The low sheet resistance of Au/eC substrates permitted junctions with sufficiently transparent electrodes to conduct Raman or UV-vis absorption spectroscopy in either reflection or transmission geometries. Lithographic patterning of Au/eC substrates permitted wafer-scale integration yielding 500 devices on 20 chips on a 100 mm diameter wafer. Collectively, eC on Au provides a platform for fabrication and operation of chemically stable, optically and electrically functional molecules on rigid or flexible materials. The relative ease of processing and the robustness of molecular junctions incorporating eC layers should help address the challenge of economic fabrication of practical, flexible molecular junctions for a potentially wide range of applications.