Multiscale architectures boosting thermoelectric performance of copper sulfide compound.

Chen, Xin-Qi; Fan, Sheng-Jie; Han, Chao; Wu, Tian; Wang, Lian-Jun; Jiang, Wan; Dai, Wei; Yang, Jian-Ping

Chen, Xin-Qi; Fan, Sheng-Jie; Han, Chao; Wu, Tian; Wang, Lian-Jun; Jiang, Wan; Dai, Wei; Yang, Jian-Ping.

Affiliation

Chen XQ; School of Physics and Mechanical and Electrical Engineering, Hubei Engineering Technology Research Center of Environmental Purification Materials, Institute of Materials Research and Engineering, Hubei University of Education, Wuhan, 430205 China.
Fan SJ; State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620 China.
Han C; Institute for Superconducting and Electronic Materials, University of Wollongong, North Wollongong, NSW 2500 Australia.
Wu T; School of Physics and Mechanical and Electrical Engineering, Hubei Engineering Technology Research Center of Environmental Purification Materials, Institute of Materials Research and Engineering, Hubei University of Education, Wuhan, 430205 China.
Wang LJ; State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620 China.
Jiang W; State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620 China.
Dai W; School of Physics and Mechanical and Electrical Engineering, Hubei Engineering Technology Research Center of Environmental Purification Materials, Institute of Materials Research and Engineering, Hubei University of Education, Wuhan, 430205 China.
Yang JP; State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, College of Materials Science and Engineering, Donghua University, Shanghai, 201620 China.

Rare Metals ; 40(8): 2017-2025, 2021.

Article in En | MEDLINE | ID: mdl-33679100