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Tough-interface-enabled stretchable electronics using non-stretchable polymer semiconductors and conductors.
Kang, Jiheong; Mun, Jaewan; Zheng, Yu; Koizumi, Masato; Matsuhisa, Naoji; Wu, Hung-Chin; Chen, Shucheng; Tok, Jeffrey B-H; Lee, Gae Hwang; Jin, Lihua; Bao, Zhenan.
Affiliation
  • Kang J; Department of Chemical Engineering, Stanford University, Stanford, CA, USA.
  • Mun J; Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.
  • Zheng Y; Department of Chemical Engineering, Stanford University, Stanford, CA, USA.
  • Koizumi M; Department of Chemical Engineering, Stanford University, Stanford, CA, USA.
  • Matsuhisa N; Department of Mechanical and Aerospace Engineering, University of California, Los Angeles, CA, USA.
  • Wu HC; Department of Chemical Engineering, Stanford University, Stanford, CA, USA.
  • Chen S; Department of Chemical Engineering, Stanford University, Stanford, CA, USA.
  • Tok JB; Department of Chemical Engineering, Stanford University, Stanford, CA, USA.
  • Lee GH; Department of Chemical Engineering, Stanford University, Stanford, CA, USA.
  • Jin L; Samsung Advanced Institute of Technology Yeongtong-gu, Suwon-si, South Korea.
  • Bao Z; Department of Mechanical and Aerospace Engineering, University of California, Los Angeles, CA, USA. lihuajin@seas.ucla.edu.
Nat Nanotechnol ; 17(12): 1265-1271, 2022 Dec.
Article in En | MEDLINE | ID: mdl-36357793
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Full text: 1 Database: MEDLINE Language: En Journal: Nat Nanotechnol Year: 2022 Type: Article Affiliation country: United States
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Full text: 1 Database: MEDLINE Language: En Journal: Nat Nanotechnol Year: 2022 Type: Article Affiliation country: United States