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Effect of grain size on thermal transport in post-annealed antimony telluride thin films.
Park, No-Won; Lee, Won-Yong; Hong, Ji-Eun; Park, Tae-Hyun; Yoon, Soon-Gil; Im, Hyunsik; Kim, Hyung Sang; Lee, Sang-Kwon.
Afiliación
  • Park NW; Department of Physics, Chung-Ang University, Seoul, 156-756 Republic of Korea.
  • Lee WY; Department of Physics, Chung-Ang University, Seoul, 156-756 Republic of Korea.
  • Hong JE; Department of Materials Engineering, Chungnam National University, Daejeon, 305-764 Republic of Korea.
  • Park TH; Department of Physics, Chung-Ang University, Seoul, 156-756 Republic of Korea.
  • Yoon SG; Department of Materials Engineering, Chungnam National University, Daejeon, 305-764 Republic of Korea.
  • Im H; Department of Semiconductor Science and Physics, Dongguk University, Seoul, 100-715 Republic of Korea.
  • Kim HS; Department of Semiconductor Science and Physics, Dongguk University, Seoul, 100-715 Republic of Korea.
  • Lee SK; Department of Physics, Chung-Ang University, Seoul, 156-756 Republic of Korea.
Nanoscale Res Lett ; 10: 20, 2015.
Article en En | MEDLINE | ID: mdl-25852318
The effects of grain size and strain on the temperature-dependent thermal transport of antimony telluride (Sb2Te3) thin films, controlled using post-annealing temperatures of 200°C to 350°C, were investigated using the 3-omega method. The measured total thermal conductivities of 400-nm-thick thin films annealed at temperatures of 200°C, 250°C, 300°C, 320°C, and 350°C were determined to be 2.0 to 3.7 W/m · K in the 20 to 300 K temperature range. We found that the film grain size, rather than the strain, had the most prominent effect on the reduction of the total thermal conductivity. To confirm the effect of grain size on temperature-dependent thermal transport in the thin films, the experimental results were analyzed using a modified Callaway model approach.
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Texto completo: 1 Bases de datos: MEDLINE Idioma: En Revista: Nanoscale Res Lett Año: 2015 Tipo del documento: Article

Texto completo: 1 Bases de datos: MEDLINE Idioma: En Revista: Nanoscale Res Lett Año: 2015 Tipo del documento: Article