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An Analog-Front ROIC with On-Chip Non-Uniformity Compensation for Diode-Based Infrared Image Sensors.
Ye, Mao; Zhao, Gongyuan; Li, Yao; Zhao, Yiqiang.
Afiliación
  • Ye M; Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology, Tianjin University, Tianjin 300072, China. mao_ye@tju.edu.cn.
  • Zhao G; Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology, Tianjin University, Tianjin 300072, China. zhaoad@tju.edu.cn.
  • Li Y; Tianjin Infrared Imaging Technology Engineering Center, Tianjin University, Tianjin 300072, China. zhaoad@tju.edu.cn.
  • Zhao Y; Tianjin Key Laboratory of Imaging and Sensing Microelectronic Technology, Tianjin University, Tianjin 300072, China. liyao@tju.edu.cn.
Sensors (Basel) ; 19(2)2019 Jan 13.
Article en En | MEDLINE | ID: mdl-30642125
ABSTRACT
This paper proposes a CMOS front-end readout-integrated circuit (ROIC) with on-chip non-uniformity compensation technique for a diode-based uncooled infrared image sensor. Two techniques are adopted to achieve on-chip non-uniformity compensation a reference dummy metal line is introduced to alleviate the dominant non-uniformity with IR-drop presented in large pixel array, and a current splitting architecture-based variable current source for diode bias is proposed to compensate other residual non-uniformity. A differential integrator is chosen as the main amplifier of readout circuit for its superior noise performance. For low power design, a pulse-powered row buffer is designed in this work. The proposed ROIC for 384 × 288 diode-based detector array is fabricated with a 0.35- µ m CMOS process. It occupies an area of 4.4 mm × 15 mm, and the power consumption is 180 mW. The measured result shows that with the proposed on-chip non-uniformity compensation, the output voltage variation is greatly reduced from 2.5 V to 60 mV.
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Texto completo: 1 Bases de datos: MEDLINE Idioma: En Revista: Sensors (Basel) Año: 2019 Tipo del documento: Article País de afiliación: China

Texto completo: 1 Bases de datos: MEDLINE Idioma: En Revista: Sensors (Basel) Año: 2019 Tipo del documento: Article País de afiliación: China