A novel 96.5Sn3Cu0.5Mn nanosolder with enhanced wettability applied to nanosoldering of WO<sub>3</sub> nanomaterial.

Zhang, Xuan; Zhang, Hong; Zheng, Xiujun; Walls, Michael; Peng, Yong

A novel 96.5Sn3Cu0.5Mn nanosolder with enhanced wettability applied to nanosoldering of WO₃ nanomaterial.

Zhang, Xuan; Zhang, Hong; Zheng, Xiujun; Walls, Michael; Peng, Yong.

Afiliación

Zhang X; Key Laboratory of Magnetism and Magnetic Materials of the Ministry of Education, School of Physical Science and Technology and Electron Microscopy Centre of Lanzhou University, Lanzhou University, Lanzhou 730000, People's Republic of China. Laboratoire de Physique des Solides Bldg. 510, CNRS, Université Paris-Sud, Orsay Cedex, 91405, France.

Nanotechnology ; 30(19): 195302, 2019 May 10.

Article en En | MEDLINE | ID: mdl-30699404

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Texto completo: 1 Bases de datos: MEDLINE Idioma: En Revista: Nanotechnology Año: 2019 Tipo del documento: Article País de afiliación: Francia