Simultaneously ultrafast and robust two-dimensional flash memory devices based on phase-engineered edge contacts.

Yu, Jun; Wang, Han; Zhuge, Fuwei; Chen, Zirui; Hu, Man; Xu, Xiang; He, Yuhui; Ma, Ying; Miao, Xiangshui; Zhai, Tianyou

Yu, Jun; Wang, Han; Zhuge, Fuwei; Chen, Zirui; Hu, Man; Xu, Xiang; He, Yuhui; Ma, Ying; Miao, Xiangshui; Zhai, Tianyou.

Afiliación

Yu J; State Key Laboratory of Materials Processing and Die and Mould Technology, School of Material Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China.
Wang H; State Key Laboratory of Materials Processing and Die and Mould Technology, School of Material Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China.
Zhuge F; State Key Laboratory of Materials Processing and Die and Mould Technology, School of Material Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China. zhugefw@hust.edu.cn.
Chen Z; Hubei Yangtze Memory Laboratory; School of Integrated circuits, Huazhong University of Science and Technology, Wuhan, 430074, China.
Hu M; State Key Laboratory of Materials Processing and Die and Mould Technology, School of Material Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China.
Xu X; State Key Laboratory of Materials Processing and Die and Mould Technology, School of Material Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China.
He Y; Hubei Yangtze Memory Laboratory; School of Integrated circuits, Huazhong University of Science and Technology, Wuhan, 430074, China.
Ma Y; State Key Laboratory of Materials Processing and Die and Mould Technology, School of Material Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China. yingma@hust.edu.cn.
Miao X; Hubei Yangtze Memory Laboratory; School of Integrated circuits, Huazhong University of Science and Technology, Wuhan, 430074, China.
Zhai T; State Key Laboratory of Materials Processing and Die and Mould Technology, School of Material Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China. zhaity@hust.edu.cn.

Nat Commun ; 14(1): 5662, 2023 Sep 13.

Article en En | MEDLINE | ID: mdl-37704609

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Texto completo: 1 Bases de datos: MEDLINE Idioma: En Revista: Nat Commun Asunto de la revista: BIOLOGIA / CIENCIA Año: 2023 Tipo del documento: Article País de afiliación: China

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