Back Injection Molding of Sub-Micron Scale Structures on Roll-to-Roll Extrusion Coated Films.

Xie, Sijia; Werder, Jerome; Schift, Helmut

Xie, Sijia; Werder, Jerome; Schift, Helmut.

Afiliação

Xie S; Laboratory for Micro- and Nanotechnology, Paul Scherrer Institute (PSI), 5232 Villigen, Switzerland.
Werder J; Institute of Polymer Nanotechnology (INKA), FHNW University of Applied Sciences and Arts Northwestern Switzerland, 5210 Windisch, Switzerland.
Schift H; Laboratory for Micro- and Nanotechnology, Paul Scherrer Institute (PSI), 5232 Villigen, Switzerland.

Polymers (Basel) ; 13(9)2021 Apr 27.

Article em En | MEDLINE | ID: mdl-33925405

Palavras-chave

back injection molding; conductive nanoparticle ink; printed flexible electronics; roll-to-roll extrusion coating; thermal bonding

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Texto completo: 1 Bases de dados: MEDLINE Idioma: En Revista: Polymers (Basel) Ano de publicação: 2021 Tipo de documento: Article País de afiliação: Suíça