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Three-dimensional electronic microfliers inspired by wind-dispersed seeds.
Kim, Bong Hoon; Li, Kan; Kim, Jin-Tae; Park, Yoonseok; Jang, Hokyung; Wang, Xueju; Xie, Zhaoqian; Won, Sang Min; Yoon, Hong-Joon; Lee, Geumbee; Jang, Woo Jin; Lee, Kun Hyuck; Chung, Ted S; Jung, Yei Hwan; Heo, Seung Yun; Lee, Yechan; Kim, Juyun; Cai, Tengfei; Kim, Yeonha; Prasopsukh, Poom; Yu, Yongjoon; Yu, Xinge; Avila, Raudel; Luan, Haiwen; Song, Honglie; Zhu, Feng; Zhao, Ying; Chen, Lin; Han, Seung Ho; Kim, Jiwoong; Oh, Soong Ju; Lee, Heon; Lee, Chi Hwan; Huang, Yonggang; Chamorro, Leonardo P; Zhang, Yihui; Rogers, John A.
Afiliação
  • Kim BH; Department of Organic Materials and Fiber Engineering, Soongsil University, Seoul, Republic of Korea.
  • Li K; Department of Smart Wearable Engineering, Soongsil University, Seoul, Republic of Korea.
  • Kim JT; Department of Engineering, University of Cambridge, Cambridge, UK.
  • Park Y; State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan, People's Republic of China.
  • Jang H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Wang X; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Xie Z; Department of Electrical and Computer Engineering, University of Wisconsin Madison, Madison, WI, USA.
  • Won SM; Department of Materials Science and Engineering, Institute of Materials Science, University of Connecticut, Storrs, CT, USA.
  • Yoon HJ; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, People's Republic of China.
  • Lee G; Ningbo Institute of Dalian University of Technology, Ningbo, People's Republic of China.
  • Jang WJ; Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea.
  • Lee KH; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Chung TS; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Jung YH; Department of Chemical and Biomolecular Engineering, University of Illinois, Urbana, IL, USA.
  • Heo SY; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Lee Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Kim J; Department of Electronic Engineering, Hanyang University, Seoul, Republic of Korea.
  • Cai T; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Kim Y; Department of Chemical and Biomolecular Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Republic of Korea.
  • Prasopsukh P; Department of Chemical and Biomolecular Engineering, University of Illinois, Urbana, IL, USA.
  • Yu Y; Department of Mechanical Science and Engineering, University of Illinois, Urbana, IL, USA.
  • Yu X; Department of Chemical and Biomolecular Engineering, University of Illinois, Urbana, IL, USA.
  • Avila R; Department of Mechanical Science and Engineering, University of Illinois, Urbana, IL, USA.
  • Luan H; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Song H; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
  • Zhu F; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.
  • Zhao Y; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
  • Chen L; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Han SH; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Kim J; Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL, USA.
  • Oh SJ; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
  • Lee H; Department of Materials Science and Engineering, Northwestern University, Evanston, IL, USA.
  • Lee CH; Applied Mechanics Laboratory, Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing, People's Republic of China.
  • Huang Y; School of Logistics Engineering, Wuhan University of Technology, Wuhan, People's Republic of China.
  • Chamorro LP; School of Aerospace Engineering and Applied Mechanics, Tongji University, Shanghai, People's Republic of China.
  • Zhang Y; State Key Laboratory for Mechanical Behavior of Materials, School of Material Science and Engineering, Xi'an Jiaotong University, Xi'an, People's Republic of China.
  • Rogers JA; Electronic Convergence Materials and Device Research Center, Korea Electronics Technology Institute, Seongnam, Republic of Korea.
Nature ; 597(7877): 503-510, 2021 09.
Article em En | MEDLINE | ID: mdl-34552257
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Texto completo: 1 Bases de dados: MEDLINE Assunto principal: Sementes / Vento / Biomimética / Equipamentos e Provisões Elétricas / Tecnologia sem Fio / Miniaturização Tipo de estudo: Screening_studies Idioma: En Revista: Nature Ano de publicação: 2021 Tipo de documento: Article
Texto completo
Adicionar na Minha BVS
Imprimir
XML
PubMed Links
Buscar no Google

Texto completo: 1 Bases de dados: MEDLINE Assunto principal: Sementes / Vento / Biomimética / Equipamentos e Provisões Elétricas / Tecnologia sem Fio / Miniaturização Tipo de estudo: Screening_studies Idioma: En Revista: Nature Ano de publicação: 2021 Tipo de documento: Article