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Advances on Thermally Conductive Epoxy-Based Composites as Electronic Packaging Underfill Materials-A Review.
Wen, Yingfeng; Chen, Chao; Ye, Yunsheng; Xue, Zhigang; Liu, Hongyuan; Zhou, Xingping; Zhang, Yun; Li, Dequn; Xie, Xiaolin; Mai, Yiu-Wing.
Afiliação
  • Wen Y; State Key Laboratory of Materials Processing and Die & Mold Technology, School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China.
  • Chen C; State Key Laboratory of Materials Processing and Die & Mold Technology, School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China.
  • Ye Y; Ministry-of-Education Key Laboratory for Green Preparation and Application of Functional Materials, Faculty of Materials Science and Engineering, Hubei University, Wuhan, 430062, China.
  • Xue Z; State Key Laboratory of Materials Processing and Die & Mold Technology, School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China.
  • Liu H; State Key Laboratory of Materials Processing and Die & Mold Technology, School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China.
  • Zhou X; Centre for Advanced Materials Technology (CAMT), School of Aerospace, Mechanical and Mechatronic Engineering J07, The University of Sydney, Sydney, NSW, 2006, Australia.
  • Zhang Y; State Key Laboratory of Materials Processing and Die & Mold Technology, School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China.
  • Li D; School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China.
  • Xie X; School of Materials Science and Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China.
  • Mai YW; State Key Laboratory of Materials Processing and Die & Mold Technology, School of Chemistry and Chemical Engineering, Huazhong University of Science and Technology, Wuhan, 430074, China.
Adv Mater ; 34(52): e2201023, 2022 Dec.
Article em En | MEDLINE | ID: mdl-35581925
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Texto completo: 1 Bases de dados: MEDLINE Idioma: En Revista: Adv Mater Assunto da revista: BIOFISICA / QUIMICA Ano de publicação: 2022 Tipo de documento: Article País de afiliação: China
Texto completo
Adicionar na Minha BVS
Imprimir
XML
PubMed Links
Buscar no Google

Texto completo: 1 Bases de dados: MEDLINE Idioma: En Revista: Adv Mater Assunto da revista: BIOFISICA / QUIMICA Ano de publicação: 2022 Tipo de documento: Article País de afiliação: China