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Structural Electronic Skin for Conformal Tactile Sensing.
Li, Sen; Huang, Jiantao; Wang, Meilan; Deng, Ka; Guo, Chenhui; Li, Bin; Cheng, Yu; Sun, Hongyan; Ye, Hong; Pan, Tingrui; Chang, Yu.
Afiliação
  • Li S; School of Biomedical Engineering, University of Science and Technology of China, Hefei, 230026, China.
  • Huang J; Center for Intelligent Medical Equipment and Devices, Suzhou Institute for Advanced Research, University of Science and Technology of China, Suzhou, 215123, China.
  • Wang M; Bionic Sensing and Intelligence Center (BSIC), Institute of Biomedical and Health Engineering, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, Guangdong, 518055, China.
  • Deng K; School of Engineering, Hangzhou Normal University, Hangzhou, Zhejiang, 311121, China.
  • Guo C; Bionic Sensing and Intelligence Center (BSIC), Institute of Biomedical and Health Engineering, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, Guangdong, 518055, China.
  • Li B; Bionic Sensing and Intelligence Center (BSIC), Institute of Biomedical and Health Engineering, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, Guangdong, 518055, China.
  • Cheng Y; Bionic Sensing and Intelligence Center (BSIC), Institute of Biomedical and Health Engineering, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, Guangdong, 518055, China.
  • Sun H; Bionic Sensing and Intelligence Center (BSIC), Institute of Biomedical and Health Engineering, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, Guangdong, 518055, China.
  • Ye H; Bionic Sensing and Intelligence Center (BSIC), Institute of Biomedical and Health Engineering, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, Guangdong, 518055, China.
  • Pan T; Bionic Sensing and Intelligence Center (BSIC), Institute of Biomedical and Health Engineering, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, Guangdong, 518055, China.
  • Chang Y; Bionic Sensing and Intelligence Center (BSIC), Institute of Biomedical and Health Engineering, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen, Guangdong, 518055, China.
Adv Sci (Weinh) ; 10(33): e2304106, 2023 11.
Article em En | MEDLINE | ID: mdl-37737619
ABSTRACT
The conformal integration of the electronic skin on the non-developable surface is in great demand for the comprehensive tactile sensing of robotics and prosthetics. However, the current techniques still encounter obstacles in achieving conformal integration of film-like electronic skin on non-developable surfaces with substantial curvatures for contact pressure detection and tactile mapping. In this paper, by utilizing the 3D printing technology to prepare the 3D electrode array in the structural component following its surface curvature, and covering it with a molded functional shell to form the pressure sensitive iontronic interface, a device is proposed to achieve high-sensitive pressure detection and high-fidelity tactile mapping on a complicated non-developable surface, called structural electronic skin (SES). The SES is prepared in a 3D printed fingertip with 46 tactile sensing units distributed on its curved surface, achieving the integration of both structural and tactile functions in a single component. By integrating the smart fingertip into a dexterous hand, a series of demonstrations are presented to show the dead-zone free pressure detection and tactile mapping with high sensitivity, for instance, 2D pulse wave monitoring and robotic injection in a medical robot, object recognition and compliant control in a smart prosthesis.
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Texto completo: 1 Bases de dados: MEDLINE Assunto principal: Membros Artificiais / Robótica / Dispositivos Eletrônicos Vestíveis Idioma: En Revista: Adv Sci (Weinh) Ano de publicação: 2023 Tipo de documento: Article País de afiliação: China

Texto completo: 1 Bases de dados: MEDLINE Assunto principal: Membros Artificiais / Robótica / Dispositivos Eletrônicos Vestíveis Idioma: En Revista: Adv Sci (Weinh) Ano de publicação: 2023 Tipo de documento: Article País de afiliação: China