Silicon Hybridization for the Preparation of Room-Temperature Curing and High-Temperature-Resistant Epoxy Resin.
Polymers (Basel)
; 16(5)2024 Feb 27.
Article
em En
| MEDLINE
| ID: mdl-38475317
ABSTRACT
Specialized epoxy resin, capable of achieving room-temperature profound curing and sustaining prolonged exposure to high-temperature environments, stands as a pivotal material in modern high-end manufacturing sectors including aerospace, marine equipment fabrication, machinery production, and the electronics industry. Herein, a silicon-hybridized epoxy resin, amenable to room-temperature curing and designed for high-temperature applications, was synthesized using a sol-gel methodology with silicate esters and silane coupling agents serving as silicon sources. Resin characterization indicates a uniform distribution of silicon elements in the obtained silicon hybrid epoxy resin. In comparison to the non-hybridized epoxy resin, notable improvements are observed in room-temperature curing performance, heat resistance, and mechanical strength.
Texto completo:
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Bases de dados:
MEDLINE
Idioma:
En
Revista:
Polymers (Basel)
Ano de publicação:
2024
Tipo de documento:
Article
País de afiliação:
China