Manipulating the adhesion of electroless nickel-phosphorus film on silicon wafers by silane compound modification and rapid thermal annealing.

Hsu, Chin-Wei; Wang, Wei-Yen; Wang, Kuan-Ting; Chen, Hou-An; Wei, Tzu-Chien.

Afiliação

Hsu CW; Department of Chemical Engineering, National Tsing Hua University, Hsinchu, 30013, Taiwan.
Wang WY; Department of Chemical Engineering, National Tsing Hua University, Hsinchu, 30013, Taiwan.
Wang KT; Department of Chemical Engineering, National Tsing Hua University, Hsinchu, 30013, Taiwan.
Chen HA; Department of Chemical Engineering, National Tsing Hua University, Hsinchu, 30013, Taiwan.
Wei TC; Department of Chemical Engineering, National Tsing Hua University, Hsinchu, 30013, Taiwan. tcwei@mx.nthu.edu.tw.

Sci Rep ; 7(1): 9656, 2017 08 29.

Article em En | MEDLINE | ID: mdl-28851883

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2017 Tipo de documento: Article

Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2017 Tipo de documento: Article