3D Self-Assembled Microelectronic Devices: Concepts, Materials, Applications.

Karnaushenko, Daniil; Kang, Tong; Bandari, Vineeth K; Zhu, Feng; Schmidt, Oliver G.

Afiliação

Karnaushenko D; Institute for Integrative Nanosciences, Leibniz IFW Dresden, Dresden, 01069, Germany.
Kang T; Institute for Integrative Nanosciences, Leibniz IFW Dresden, Dresden, 01069, Germany.
Bandari VK; Institute for Integrative Nanosciences, Leibniz IFW Dresden, Dresden, 01069, Germany.
Zhu F; Material Systems for Nanoelectronics, Chemnitz University of Technology, Chemnitz, 09107, Germany.
Schmidt OG; Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN), Rosenbergstraße 6, TU Chemnitz, Chemnitz, 09126, Germany.

Adv Mater ; 32(15): e1902994, 2020 Apr.

Article em En | MEDLINE | ID: mdl-31512308