Intensive harmonized synapses with amorphous Cu<sub>2</sub>O-based memristors using ultrafine Cu nanoparticle sublayers formed <i>via</i> atomically controlled electrochemical pulse deposition.

Kim, Dong Su; Suh, Hee Won; Cho, Sung Woon; Oh, Shin Young; Lee, Hak Hyeon; Lee, Kun Woong; Choi, Ji Hoon; Cho, Hyung Koun

Intensive harmonized synapses with amorphous Cu₂O-based memristors using ultrafine Cu nanoparticle sublayers formed via atomically controlled electrochemical pulse deposition.

Kim, Dong Su; Suh, Hee Won; Cho, Sung Woon; Oh, Shin Young; Lee, Hak Hyeon; Lee, Kun Woong; Choi, Ji Hoon; Cho, Hyung Koun.

Afiliação

Kim DS; School of Advanced Materials Science and Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon-si, Gyeonggi-do, 16419, Republic of Korea. chohk@skku.edu.
Suh HW; School of Advanced Materials Science and Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon-si, Gyeonggi-do, 16419, Republic of Korea. chohk@skku.edu.
Cho SW; Department of Advanced Components and Materials Engineering, Sunchon National University, 255, Jungang-ro, Sunchon-si, Jeollanam-do, Republic of Korea.
Oh SY; School of Advanced Materials Science and Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon-si, Gyeonggi-do, 16419, Republic of Korea. chohk@skku.edu.
Lee HH; School of Advanced Materials Science and Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon-si, Gyeonggi-do, 16419, Republic of Korea. chohk@skku.edu.
Lee KW; School of Advanced Materials Science and Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon-si, Gyeonggi-do, 16419, Republic of Korea. chohk@skku.edu.
Choi JH; School of Advanced Materials Science and Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon-si, Gyeonggi-do, 16419, Republic of Korea. chohk@skku.edu.
Cho HK; School of Advanced Materials Science and Engineering, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon-si, Gyeonggi-do, 16419, Republic of Korea. chohk@skku.edu.

Mater Horiz ; 10(9): 3382-3392, 2023 Aug 29.

Article em En | MEDLINE | ID: mdl-37439537

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Texto completo: 1 Base de dados: MEDLINE Idioma: En Ano de publicação: 2023 Tipo de documento: Article