Enabling High-Performance Pressure and Proximity Dual-Mode Sensing with EGaIn/Ag/ZnO Egg-Shell Ternary Composite Particles.

Zhang, Jinhao; Wang, Xin; Yang, Zhiwei; Wang, Jian; Cao, Jiacheng; Chen, Qian; Yu, Shilong; Zhang, Jian; Guo, Tianwen; Li, Hai; Huang, Xiao

Zhang, Jinhao; Wang, Xin; Yang, Zhiwei; Wang, Jian; Cao, Jiacheng; Chen, Qian; Yu, Shilong; Zhang, Jian; Guo, Tianwen; Li, Hai; Huang, Xiao.

Afiliação

Zhang J; Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, China.
Wang X; Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, China.
Yang Z; Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, China.
Wang J; Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, China.
Cao J; Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an 710072, China.
Chen Q; Frontiers Science Center for Flexible Electronics, Xi'an Institute of Flexible Electronics (IFE) and Xi'an Institute of Biomedical Materials & Engineering, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an 710072, China.
Yu S; Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, China.
Zhang J; Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, China.
Guo T; College of Computer and Information Engineering, Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, China.
Li H; Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, China.
Huang X; Institute of Advanced Materials (IAM), School of Flexible Electronics (Future Technologies), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (NanjingTech), 30 South Puzhu Road, Nanjing 211816, China.