Laser-driven noncontact bubble transfer printing via a hydrogel composite stamp.

Transfer printing that enables heterogeneous integration of materials into spatially organized, functional arrangements is essential for developing unconventional electronic systems. Here, we report a laser-driven noncontact bubble transfer printing via a hydrogel composite stamp, which features a circular reservoir filled with hydrogel inside a stamp body and encapsulated by a laser absorption layer and an adhesion layer. This composite structure of stamp provides a reversible thermal controlled adhesion in a rapid manner through the liquid-gas phase transition of water in the hydrogel. The ultrasoft nature of hydrogel minimizes the influence of preload on the pick-up performance, which offers a strong interfacial adhesion under a small preload for a reliable damage-free pick-up. The strong light-matter interaction at the interface induces a liquid-gas phase transition to form a bulge on the stamp surface, which eliminates the interfacial adhesion for a successful noncontact printing. Demonstrations of noncontact transfer printing of microscale Si platelets onto various challenging nonadhesive surfaces (e.g., glass, key, wrench, steel sphere, dry petal, droplet) in two-dimensional or three-dimensional layouts illustrate the unusual capabilities for deterministic assembly to develop unconventional electronic systems such as flexible inorganic electronics, curved electronics, and micro-LED display.

Rapid Fabrication of High-Resolution Flexible Electronics via Nanoparticle Self-Assembly and Transfer Printing.

Printed electronic technology serves as a key component in flexible electronics and wearable devices, yet achieving compatibility with both high resolution and high efficiency remains a significant challenge. Here, we propose a rapid fabrication method of high-resolution nanoparticle microelectronics via self-assembly and transfer printing. The tension gradient-electrostatic attraction composite-induced nanoparticle self-assembly strategy is constructed, which can significantly enhance the self-assembly efficiency, stability, and coverage by leveraging the meniscus Marangoni effect and the electric double-layer effect. The close-packed nanoparticle self-assembly layer can be rapidly formed on microstructure surfaces over a large area. Inspired by ink printing, a transfer printing strategy is further proposed to transform the self-assembly layer into conformal micropatterns. Large-area, high-resolution (2 µm), and ultrathin (1 µm) nanoparticle microelectronics can be stably fabricated, yielding a significant improvement over fluid printing methods. The unique deformability, recoverability, and scalability of nanoparticle microelectronics are revealed, providing promising opportunities for various academic and real applications.

Soap Film Transfer Printing for Ultrathin Electronics.

Flexible and stretchable electronics have attractive applications inaccessible to conventional rigid electronics. However, the mainstream transfer printing techniques have challenges for electronic films in terms of thickness and size and limitations for target substrates in terms of curvature, depth, and interfacial adhesion. Here a facile, damage-free, and contamination-free soap film transfer printing technique is reported that enables the wrinkle-free transfer of ultrathin electronic films, precise alignment in a transparent manner, and conformal and adhesion-independent printing onto various substrates, including those too topographically and adhesively challenging by existing methods. In principle, not only the pattern, resolution, and thickness of transferred films, but also the curvature, depth, and adhesion of target substrates are unlimited, while the size of transferred films can be as high as meter-scale. To demonstrate the capabilities of soap film transfer printing, pre-fabricated ultrathin electronics with multiple patterns, single micron resolution, sub-micron thickness, and centimeter size are conformably integrated onto the ultrathin web, ultra-soft cotton, DVD-R disk with the minimum radius of curvature of 131 nm, interior cavity of Klein bottle and dandelion with ultralow adhesion. The printed ultrathin sensors show superior conformabilities and robust adhesion, leading to engineering opportunities including electrocardiogram (ECG) signal acquisition and temperature measurement in aqueous environments.

Silicon-based transient electronics: principles, devices and applications.

Recent advances in materials science, device designs and advanced fabrication technologies have enabled the rapid development of transient electronics, which represents a class of devices or systems that their functionalities and constitutions can be partially/completely degraded via chemical reaction or physical disintegration over a stable operation. Therefore, numerous potentials, including zero/reduced waste electronics, bioresorbable electronic implants, hardware security, and others, are expected. In particular, transient electronics with biocompatible and bioresorbable properties could completely eliminate the secondary retrieval surgical procedure after their in-body operation, thus offering significant potentials for biomedical applications. In terms of material strategies for the manufacturing of transient electronics, silicon nanomembranes (SiNMs) are of great interest because of their good physical/chemical properties, modest mechanical flexibility (depending on their dimensions), robust and outstanding device performances, and state-of-the-art manufacturing technologies. As a result, continuous efforts have been made to develop silicon-based transient electronics, mainly focusing on designing manufacturing strategies, fabricating various devices with different functionalities, investigating degradation or failure mechanisms, and exploring their applications. In this review, we will summarize the recent progresses of silicon-based transient electronics, with an emphasis on the manufacturing of SiNMs, devices, as well as their applications. After a brief introduction, strategies and basics for utilizing SiNMs for transient electronics will be discussed. Then, various silicon-based transient electronic devices with different functionalities are described. After that, several examples regarding on the applications, with an emphasis on the biomedical engineering, of silicon-based transient electronics are presented. Finally, summary and perspectives on transient electronics are exhibited.

Transfer-printed, tandem microscale light-emitting diodes for full-color displays.

Inorganic semiconductor-based microscale light-emitting diodes (micro-LEDs) have been widely considered the key solution to next-generation, ubiquitous lighting and display systems, with their efficiency, brightness, contrast, stability, and dynamic response superior to liquid crystal or organic-based counterparts. However, the reduction of micro-LED sizes leads to the deteriorated device performance and increased difficulties in manufacturing. Here, we report a tandem device scheme based on stacked red, green, and blue (RGB) micro-LEDs, for the realization of full-color lighting and displays. Thin-film micro-LEDs (size ∼100 µm, thickness ∼5 µm) based on III-V compound semiconductors are vertically assembled via epitaxial liftoff and transfer printing. A thin-film dielectric-based optical filter serves as a wavelength-selective interface for performance enhancement. Furthermore, we prototype arrays of tandem RGB micro-LEDs and demonstrate display capabilities. These materials and device strategies provide a viable path to advanced lighting and display systems.

Highly Durable Janus Fabrics Based on Transfer Prints for Personal Moisture Management.

Janus fabrics with moisture management ability have great potential for improving both physiological and psychological comfort of human body. However, current methods for creating Janus fabrics are typically complex, environmentally unfriendly, and costly. More importantly, the prepared Janus fabrics have demonstrated insufficient mechanical properties and poor fastness, rendering them unsuitable for practical applications. Here, this work proposes a method for constructing Janus fabrics through thermal transfer printing of hydrophobic transfer prints onto a superhydrophilic cotton fabric, followed by creation of a conical micropore array on the fabric surface. The as-prepared Janus fabrics exhibit excellent unidirectional liquid transport capacity, capable of transporting 50 µL water completely in 11.6 s in the positive direction. Attributed to the durable property of the transfer prints, the Janus fabrics are capable of withstanding over 900 friction cycles and 250 home laundry cycles, which is a great advance in this research field. Additionally, the fabrication process has no detrimental effect on the fabric's breathability, elasticity, and flexibility. Furthermore, the Janus fabric can maintain human body temperature 3.6 °C cooler than that worn with cotton fabric. The fabrication method can provide useful insights for the design and creation of durable Janus fabrics to maximize personal comfort.

Reactive Disperse Dyes Bearing Various Blocked Isocyanate Groups for Digital Textile Printing Ink.

Wastewater management is of considerable economic and environmental importance for the dyeing industry. Digital textile printing (DTP), which is based on sublimation transfer and does not generate wastewater, is currently being explored as an inkjet-based method of printing colorants onto fabric. It finds wide industrial applications with most poly(ethylene terephthalate) (PET) and nylon fibers. However, for additional industrial applications, it is necessary to use natural fibers, such as cotton. Therefore, to expand the applicability of DTP, it is essential to develop a novel reactive disperse dye that can interact with the fabric. In this study, we introduced a blocked isocyanate functional group into the dye to enhance binding to the fabric. The effect of sublimation transfer on fabrics as a function of temperature was compared using the newly synthesized reactive disperse dyes with different blocking groups based on pyrazole derivatives, such as pyrazole (Py), di-methylpyrazole (DMPy), and di-tert-butylpyrazole (DtBPy). Fabrics coated with the new reactive disperse dyes, including PET, nylon, and cotton, were printed at 190 °C, 200 °C, and 210 °C using thermal transfer equipment. In the case of the synthesized DHP-A dye on cotton at 210 °C, the color strength was 2.1, which was higher than that of commercial dyes and other synthesized dyes, such as DMP-A and DTP-A. The fastness values of the synthesized DHP-A were measured on cotton, and it was found that the washing and light fastness values on cotton are higher than those of commercial dyes. This study confirmed the possibility of introducing isocyanate groups into reactive disperse dyes.

Analysis of Microstrip Line with Asymmetric Arch Type Cross-Sectional Structure Using Micro Pattern Transfer Printing Method.

This paper presents the manufacturing procedure and electrical properties of a microstrip line on flexible printed circuit boards (FPCBs) fabricated using the micro pattern transfer printing (MPTP) method for millimeter wave band application. The MPTP method presented herein is compared to the conventional FPCB process based on the degree of insertion loss as it pertains to the cross-sectional shape of the formed microstrip line. Electromagnetic field simulations were performed to confirm that the cross-sectional arch shape fabricated by the MPTP process reduces insertion loss in the high-frequency band. Based on the simulation, the microstrip transmission line was optimized to a width of 217 µm and a length of 30 cm, fabricated on a 50 µm thick poly-cyclohexylene dimethylene terephthalate (PCT) substrate to measure the insertion loss. The insertion loss fabricated using the MPTP method is measured as 0.37 dB/cm at 10 GHz, while the conventional FPCB is measured as 0.66 dB/cm. Through the analysis, it was confirmed that the FPCBs manufactured by the MPTP process show lower insertion loss compared to the conventional FPCBs.

A reusable wet-transfer printing technique for manufacturing of flexible silver nanowire film-based electrodes.

To explore a simple and efficient way to fabricate thin film electrodes on flexible substrates is highly desired because of its high promising application in optoelectronics. Transfer printing technique plays a key role in the fabrication of flexible electrodes from conventional substrates to flexible substrates. Unfortunately, a simple, room temperature, environmental-friendly and reusable transfer printing technique still remains challenging. Here we demonstrated a novel water-based wet-transfer printing technique that is simple, room temperature, environmental-friendly and reusable by taking advantage of the adjustment of the intermolecular hydrogen bonding between thin film and substrates. This effective and practical transfer technique may provide an effective route to develop electronic flexible devices with high performance.

Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics.

Transfer printing of thin-film nanoelectronics from their fabrication wafer commonly requires chemical etching on the sacrifice of wafer but is also limited by defects with a low yield. Here, we introduce a wafer-recyclable, environment-friendly transfer printing process that enables the wafer-scale separation of high-performance thin-film nanoelectronics from their fabrication wafer in a defect-free manner that enables multiple reuses of the wafer. The interfacial delamination is enabled through a controllable cracking phenomenon in a water environment at room temperature. The physically liberated thin-film nanoelectronics can be then pasted onto arbitrary places of interest, thereby endowing the particular surface with desirable add-on electronic features. Systematic experimental, theoretical, and computational studies reveal the underlying mechanics mechanism and guide manufacturability for the transfer printing process in terms of scalability, controllability, and reproducibility.

Characterization, Selection, and Microassembly of Nanowire Laser Systems.

Semiconductor nanowire (NW) lasers are a promising technology for the realization of coherent optical sources with ultrasmall footprint. To fully realize their potential in on-chip photonic systems, scalable methods are required for dealing with large populations of inhomogeneous devices that are typically randomly distributed on host substrates. In this work two complementary, high-throughput techniques are combined: the characterization of nanowire laser populations using automated optical microscopy, and a high-accuracy transfer-printing process with automatic device spatial registration and transfer. Here, a population of NW lasers is characterized, binned by threshold energy density, and subsequently printed in arrays onto a secondary substrate. Statistical analysis of the transferred and control devices shows that the transfer process does not incur measurable laser damage, and the threshold binning can be maintained. Analysis on the threshold and mode spectra of the device populations proves the potential for using NW lasers for integrated systems fabrication.

Hydroxypropyl Cellulose Adhesives for Transfer Printing of Carbon Nanotubes and Metallic Nanostructures.

Transfer printing is one of the key nanofabrication techniques for the large-scale manufacturing of complex device architectures. It provides a cost-effective and high-throughput route for the integration of independently processed materials into spatially tailored architectures. Furthermore, this method enables the fabrication of flexible and curvilinear devices, paving the way for the fabrication of a new generation of technologies for optics, electronics, and biomedicine. In this work, hydroxypropyl cellulose (HPC) membranes are used as water soluble adhesives for transfer printing processes with improved performance and versatility compared to conventional silicone alternatives. The high-water solubility and excellent mechanical properties of HPC facilitate transfer printing with high yield for both metal and carbon nanotubes (CNTs) inks. In the case of metal inks, crack-free stripping of silver films and the simple fabrication of Moiré Plasmonic architectures of different geometries are demonstrated. Furthermore, HPC membranes are used to transfer print carbon nanotube films with different thicknesses and up to 77% transparency in the visible and near infrared region with potential applications as transparent conductive substrates. Finally, the use of prepatterned HPC membranes enables nanoscale patterning of CNT with feature resolution down to 1 µm.

Materials and processing approaches for foundry-compatible transient electronics.

Foundry-based routes to transient silicon electronic devices have the potential to serve as the manufacturing basis for "green" electronic devices, biodegradable implants, hardware secure data storage systems, and unrecoverable remote devices. This article introduces materials and processing approaches that enable state-of-the-art silicon complementary metal-oxide-semiconductor (CMOS) foundries to be leveraged for high-performance, water-soluble forms of electronics. The key elements are (i) collections of biodegradable electronic materials (e.g., silicon, tungsten, silicon nitride, silicon dioxide) and device architectures that are compatible with manufacturing procedures currently used in the integrated circuit industry, (ii) release schemes and transfer printing methods for integration of multiple ultrathin components formed in this way onto biodegradable polymer substrates, and (iii) planarization and metallization techniques to yield interconnected and fully functional systems. Various CMOS devices and circuit elements created in this fashion and detailed measurements of their electrical characteristics highlight the capabilities. Accelerated dissolution studies in aqueous environments reveal the chemical kinetics associated with the underlying transient behaviors. The results demonstrate the technical feasibility for using foundry-based routes to sophisticated forms of transient electronic devices, with functional capabilities and cost structures that could support diverse applications in the biomedical, military, industrial, and consumer industries.

Hydrogel-Templated Transfer-Printing of Conductive Nanonetworks for Wearable Sensors on Topographic Flexible Substrates.

Transfer-printing enables the assembly of functional nanomaterials on unconventional substrates with a desired layout in a controllable manner. However, transfer-printing to substrates with complex surfaces remains a challenge. Herein, we show that hydrogels serve as effective template material platforms for the assembly and transfer-printing of conductive nanonetwork patterns for flexible sensors on various topographic surfaces in a very simple yet versatile manner. The non-adherence, nanoporous structure, and molding capability of the hydrophilic hydrogel enable the assembly of conductive nanonetwork patterns on the hydrogel surface and transfer of the nanonetworks onto various flexible and topographic substrates. Flexible strain sensors and pressure sensors that monitor finger motions and arterial pulses are successfully demonstrated using the hydrogel-templated approach. The rich chemistry of polymeric networks, facile molding capability, and biocompatibility of hydrogels could be further combined with additive technology for hydrogels and electronic materials for emerging four-dimensional functional materials and soft bioelectronics.

Deterministic Nanoassembly of Quasi-Three-Dimensional Plasmonic Nanoarrays with Arbitrary Substrate Materials and Structures.

Guided manipulation of light through periodic nanoarrays of three-dimensional (3D) metal-dielectric patterns provides remarkable opportunities to harness light in a way that cannot be obtained with conventional optics yet its practical implementation remains hindered by a lack of effective methodology. Here we report a novel 3D nanoassembly method that enables deterministic integration of quasi-3D plasmonic nanoarrays with a foreign substrate composed of arbitrary materials and structures. This method is versatile to arrange a variety of types of metal-dielectric composite nanoarrays in lateral and vertical configurations, providing a route to generate heterogeneous material compositions, complex device layouts, and tailored functionalities. Experimental, computational, and theoretical studies reveal the essential design features of this approach and, taken together with implementation of automated equipment, provide a technical guidance for large-scale manufacturability. Pilot assembly of specifically engineered quasi-3D plasmonic nanoarrays with a model hybrid pixel detector for deterministic enhancement of the detection performances demonstrates the utility of this method.

Spatial Manipulation and Integration of Supramolecular Filaments on Hydrogel Substrates towards Advanced Soft Devices.

Supramolecular assemblies are promising building blocks for the fabrication of functional soft devices for high-tech applications. However, there is a lack of effective methods for large-scale manipulation and integration of nano-sized supramolecular structures on soft substrate. Now, functional soft devices composed of micellar filaments and hydrogels can be created through a versatile approach involving guided dewetting, transfer-printing, and laser-assisted patterning. Such an approach enables unprecedented control over the location and alignment of the micellar filaments on hydrogel substrates. As examples, freely suspended micellar fishnets immobilized on hydrogels are formed, showing the capability of trapping and releasing micro-objects and the piconewton force sensitivity. By incorporating responsive moieties into hydrogels, shape-morphing actuators with micelle-controlled rolling directionality are constructed.

Ultrathin, transferred layers of thermally grown silicon dioxide as biofluid barriers for biointegrated flexible electronic systems.

Materials that can serve as long-lived barriers to biofluids are essential to the development of any type of chronic electronic implant. Devices such as cardiac pacemakers and cochlear implants use bulk metal or ceramic packages as hermetic enclosures for the electronics. Emerging classes of flexible, biointegrated electronic systems demand similar levels of isolation from biofluids but with thin, compliant films that can simultaneously serve as biointerfaces for sensing and/or actuation while in contact with the soft, curved, and moving surfaces of target organs. This paper introduces a solution to this materials challenge that combines (i) ultrathin, pristine layers of silicon dioxide (SiO2) thermally grown on device-grade silicon wafers, and (ii) processing schemes that allow integration of these materials onto flexible electronic platforms. Accelerated lifetime tests suggest robust barrier characteristics on timescales that approach 70 y, in layers that are sufficiently thin (less than 1 µm) to avoid significant compromises in mechanical flexibility or in electrical interface fidelity. Detailed studies of temperature- and thickness-dependent electrical and physical properties reveal the key characteristics. Molecular simulations highlight essential aspects of the chemistry that governs interactions between the SiO2 and surrounding water. Examples of use with passive and active components in high-performance flexible electronic devices suggest broad utility in advanced chronic implants.

Transfer Printing Technology as a Straightforward Method to Fabricate Chemical Sensors Based on Tin Dioxide Nanowires.

Metal oxide multi-nanowire-based chemical gas sensors were manufactured by a fast and simple transfer printing technology. A two-step method employing spray pyrolysis deposition and a thermal annealing process was used for SnO 2 nanowires fabrication. A polydimethylsiloxane stamp was used to transfer the SnO 2 nanowires on two different gas sensing devices-Si-based substrates and microhotplate-based platform chips. Both contained a metallic inter-digital electrode structure (IDES), on which the SnO 2 nanowires were transferred for realization of multi-NW gas sensor devices. The gas sensor devices show a very high response towards H 2 S down to the 10 ppb range. Furthermore, a good response towards CO has been achieved, where in particular the microhotplate-based devices exhibit almost no cross sensitivity to humidity.

Magnetically Responsive Elastomer-Silicon Hybrid Surfaces for Fluid and Light Manipulation.

Stimuli-responsive surfaces with tunable fluidic and optical properties utilizing switchable surface topography are of significant interest for both scientific and engineering research. This work presents a surface involving silicon scales on a magnetically responsive elastomer micropillar array, which enables fluid and light manipulation. To integrate microfabricated silicon scales with ferromagnetic elastomer micropillars, transfer printing-based deterministic assembly is adopted. The functional properties of the surface are completely dictated by the scales with optimized lithographic patterns while the micropillar array is magnetically actuated with large-range, instantaneous, and reversible deformation. Multiple functions, such as tunable wetting, droplet manipulation, tunable optical transmission, and structural coloration, are designed, characterized, and analyzed by incorporating a wide range of scales (e.g., bare silicon, black silicon, photonic crystal scales) in both in-plane and out-of-plane configurations.

Flexible Film Bulk Acoustic Wave Filters toward Radiofrequency Wireless Communication.

This paper presents a flexible radiofrequency filter with a central frequency of 2.4 GHz based on film bulk acoustic wave resonators (FBARs). The flexible filter consists of five air-gap type FBARs, each comprised of an aluminum nitride piezoelectric thin film sandwiched between two thin-film electrodes. By transfer printing the inorganic film structure from a silicon wafer to an ultrathin polyimide substrate, high electrical performance and mechanical flexibility are achieved. The filter has a peak insertion loss of -1.14 dB, a 3 dB bandwidth of 107 MHz, and a temperature coefficient of frequency of -27 ppm °C-1 . The passband and roll-off characteristics of the flexible filter are comparable with silicon-based commercial products. No electrical performance degradation and mechanical failure occur under bending tests with a bending radius of 2.5 mm or after 100 bending cycles. The flexible FBAR filters are believed to be promising candidates for future flexible wireless communication systems.