Reliable low-temperature die attach process using Ag/Sn/Ag sandwich structure for high-temperature semiconductor devices.

Choi, Jinseok; Choi, Gab Soo; An, Sung Jin.

Afiliación

Choi J; Department of Advanced Materials Science and Engineering, Kumoh National Institute of technology, 61 Daehak-ro, Gumi-si, Gyeongsangbuk-do, 39177, Korea.
Choi GS; Fab process engineering department, KEC, 41 Suchul-daero, Gumi-si, Gyeongsangbuk-do, 39256, Korea.
An SJ; Department of Advanced Materials Science and Engineering, Kumoh National Institute of technology, 61 Daehak-ro, Gumi-si, Gyeongsangbuk-do, 39177, Korea. sungjinan@kumoh.ac.kr.

Sci Rep ; 9(1): 555, 2019 Jan 24.

Article en En | MEDLINE | ID: mdl-30679736

Texto completo: 1 Banco de datos: MEDLINE Idioma: En Año: 2019 Tipo del documento: Article

Texto completo: 1 Banco de datos: MEDLINE Idioma: En Año: 2019 Tipo del documento: Article