Electronic Skin to Feel "Pain": Detecting "Prick" and "Hot" Pain Sensations.

Sim, Minkyung; Lee, Kyung Hwa; Shin, Kwon Sik; Shin, Jeong Hee; Choi, Ji-Woong; Choi, Hongsoo; Moon, Cheil; Kim, Hyun Sik; Cho, Yuljae; Cha, Seung Nam; Jung, Jae Eun; Sohn, Jung Inn; Jang, Jae Eun

Sim, Minkyung; Lee, Kyung Hwa; Shin, Kwon Sik; Shin, Jeong Hee; Choi, Ji-Woong; Choi, Hongsoo; Moon, Cheil; Kim, Hyun Sik; Cho, Yuljae; Cha, Seung Nam; Jung, Jae Eun; Sohn, Jung Inn; Jang, Jae Eun.

Afiliación

Sim M; Department of Information and Communication Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu, Korea.
Lee KH; IMEP-LAHC, Grenoble Institute of Technology(Minatec), Grenoble, France.
Shin KS; Department of Information and Communication Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu, Korea.
Shin JH; Department of Information and Communication Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu, Korea.
Choi JW; Department of Information and Communication Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu, Korea.
Choi H; Department of Robotics Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu, Korea.
Moon C; Department of Brain and Cognitive Sciences, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu, Korea.
Kim HS; Department of Applied Physics and Material Science, California Institute of Technology, Pasadena, California.
Cho Y; Department of Electrical Engineering Science, University of Oxford, Oxford, United Kingdom.
Cha SN; Department of Electrical Engineering Science, University of Oxford, Oxford, United Kingdom.
Jung JE; Department of Chemical Engineering and Material Science, Hongik University, Seoul, Korea.
Sohn JI; Department of Electrical Engineering Science, University of Oxford, Oxford, United Kingdom.
Jang JE; Department of Information and Communication Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), Daegu, Korea.