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Investigation of Warpage for Multi-Die Fan-Out Wafer-Level Packaging Process.
Chen, Chuan; Su, Meiying; Ma, Rui; Zhou, Yunyan; Li, Jun; Cao, Liqiang.
Afiliación
  • Chen C; Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China.
  • Su M; Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China.
  • Ma R; Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China.
  • Zhou Y; Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China.
  • Li J; Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China.
  • Cao L; Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China.
Materials (Basel) ; 15(5)2022 Feb 23.
Article en En | MEDLINE | ID: mdl-35268913
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Texto completo: 1 Banco de datos: MEDLINE Tipo de estudio: Prognostic_studies Idioma: En Año: 2022 Tipo del documento: Article
Texto completo
Imprimir
XML
PubMed Links
Buscar en Google

Texto completo: 1 Banco de datos: MEDLINE Tipo de estudio: Prognostic_studies Idioma: En Año: 2022 Tipo del documento: Article