Inhibitory Effect of Elaeagnus umbellata Fractions on Melanogenesis in α-MSH-Stimulated B16-F10 Melanoma Cells.

When skin is exposed to UV radiation, melanocytes produce melanin. Excessive melanin production leads to skin pigmentation, which causes various cosmetic and health problems. Therefore, the development of safe, natural therapeutics that inhibit the production of melanin is necessary. Elaeagnus umbellata (EU) has long been widely used as a folk medicinal plant because of pharmacological properties that include anti-ulcer, antioxidant, and anti-inflammatory properties. In this study, we investigated the antioxidant activity and melanogenesis inhibitory effects of EU fractions in B16-F10 melanoma cells. EU fractions showed a dose-dependent increase in antioxidant activity in radical scavenging activity. In addition, we evaluated the effect of EU fractions on tyrosinase activity and melanogenesis in α-melanocyte-stimulating hormone-induced B16-F10 melanoma cells. EU was noncytotoxic at 12.5-50 µg/mL. EU fractions effectively inhibited tyrosinase activity and melanogenesis, suppressed the phosphorylation of CREB and ERK involved in the melanogenesis pathway, and down-regulated expression of melanogenesis-related proteins. Interestingly, the anti-melanogenesis effect was most effective at a concentration of 50 µg/mL EU, and the effects of the fractions were superior to those of the extract. Therefore, our study suggests that EU has potential as a safe treatment for excessive pigmentation or as a natural ingredient in cosmetics.

Pore-size reduction protocol for SiN membrane nanopore using the thermal reflow in nanoimprinting for nanobio-based sensing.

Micro- and nano-fabrication methods facilitate the use of nanostructures for the separation of collections of particles and nanobio-based optical and electrochemical sensing. We have presented an easy and simple nanopore size reduction method of a low-stressed silicon nitride (SiN) membrane nanosieve (100×100 µm2) using a nanoimprinting method based on a natural thermal reflow of the contact imprinting polymer, possibly maintaining compatibility with complementary metal-oxide semiconductor integrated circuit processes. The nanopore pattern size of this nanosieve membrane was precisely patterned by a nanoimprinting process using an electron beam patterned silicon master, to about 30-nm diameter. By employing mainly an electron beam resist reflow phenomena after a nanoimprinting process and anisotropic reactive ion etch, the etch holes' size was fabricated to be the same with nanopatterns on the polymer. The contact imprinting master can be used continually for the generation of nanopore patterns simply and easily. It can endure harsh conditions like high temperature up to 800°C, and it is inert to many aggressive and strong chemicals. Also, this would be a low-cost, simple, and easy fabrication method for the precise and reliable size-reduction control of nanopores for mass production of nanobio sensors or chips.

Microfabrication of SiN membrane nanosieve using anisotropic reactive ion etching (ARIE) with an Ar/CF4 gas flow.

We have designed, fabricated, and characterized a low-stressed silicon nitride (SiN) membrane nanosieve (100 microm x 100 microm) using an anisotropic reactive ion etching (ARIE) combining with gas mixture, thus maintaining compatibility with the complementary metal-oxide semiconductor integrated circuit (CMOS IC) processes. The holes pattern of this nanosieve membrane was precisely controlled under 30 nm diameter by the electron beam writing. By employing mainly anisotropic reactive ion etching plus diffusion to the depth direction, the etch holes size was controlled to be the same with patterns on the e-beam resist (ER). This nanosieve membrane has proper mechanical strength withstanding up to one bar of transmembrane pressure. And it can endure harsh treatments such as high temperature up to 800 degrees C. In addition, it is inert to a number of strong chemicals including the piranha (H2SO4 + H2O2) solution, highly-concentrated potassium hydroxide (KOH), hydrogen fluoride (HF), hydrogen chloride (HCI), and nitric acid (HNO3).