Chemisorption of silicon tetrachloride on silicon nitride: a density functional theory study.

We studied the chemisorption of silicon tetrachloride (SiCl4) on the NH2/NH-terminated silicon nitride slab model using density functional theory (DFT) for atomic layer deposition (ALD) of silicon nitride. Initially, two reaction pathways were compared, forming HCl or NH3+Cl- as a byproduct. The NH3+Cl- complex formation was more exothermic than the HCl formation, with an activation energy of 0.26 eV. The -NH2* reaction sites are restored by desorption of HCl from the NH3+Cl- complexes at elevated temperatures of 205 °C or higher. Next, three sequential ligand exchange reactions forming Si-N bonds were modeled and simulated. The reaction energies became progressively less exothermic as the reaction progressed, from -1.31 eV to -0.30 eV to 0.98 eV, due to the stretching of Si-N bonds and the distortion of the N-Si-N bond angles. Also, the activation energies for the second and third reactions were 2.17 eV and 1.55 eV, respectively, significantly higher than the 0.26 eV of the first reaction, mainly due to the additional dissociation of the N-H bond. The third Si-N bond formation is unfavorable due to the endothermic reaction and higher activation energy. Therefore, the chemisorbed species would be -SiCl2* when the surface is exposed to SiCl4.

Selective etching mechanism of silicon oxide against silicon by hydrogen fluoride: a density functional theory study.

Selective etching of silicon oxide (SiO2) against silicon (Si) using anhydrous hydrogen fluoride (HF) vapor has been used for semiconductor device fabrication. We studied the underlying mechanism of the selective etching by density functional theory (DFT) calculation. We constructed surface slab models of SiO2 or Si with different degrees of fluorination and simulated the four steps of fluorination. The calculations show relatively low activation energies of 0.72-0.79 eV for the four steps of fluorination of SiO2, which are close to ∼0.69 eV observed in the experiment. The four-membered ring structure of -Si-O-H-F- in all transition states stabilized the system, resulting in relatively low activation energies. Thus, continuous etching of SiO2 by HF is plausible at near-room temperature. In contrast, the fluorinations of Si showed relatively high activation energies ranging from 1.22 to 1.56 eV due to the less stable transition state geometries. Thus, negligible etching of silicon by HF is expected by the near-room temperature process. Our calculation results explain well the experimental observation of the selective etching of SiO2 against Si by HF vapor.