Alternative Concepts for Extruded Power Cable Insulation: from Thermosets to Thermoplastics.

The most common type of insulation of extruded high-voltage power cables is composed of low-density polyethylene (LDPE), which must be crosslinked to adjust its thermomechanical properties. A major drawback is the need for hazardous curing agents and the release of harmful curing byproducts during cable production, while the thermoset nature complicates reprocessing of the insulation material. This perspective explores recent progress in the development of alternative concepts that allow to avoid byproducts through either click chemistry type curing of polyethylene-based copolymers or the use of polyolefin blends or copolymers, which entirely removes the need for crosslinking. Moreover, polypropylene-based thermoplastic formulations enable the design of insulation materials that can withstand higher cable operating temperatures and facilitate reprocessing by remelting once the cable reaches the end of its lifetime. Finally, polyethylene-based covalent and non-covalent adaptable networks are explored, which may allow to combine the advantages of thermoset and thermoplastic insulation materials in terms of thermomechanical properties and reprocessability.

Two-photon microscopy as a visual tool for polymer compatibilization monitoring: the PE-EVOH case.

In this study, we present two-photon microscopy (2PM) as an original technique to investigate the compatibilization between PE-HEMA and EVOH at the sub-micrometer level, both on the surface and in the bulk. 2PM is a nonlinear fluorescence imaging technique commonly exploited for thick biological tissue analysis. Here, we use 2PM to visualize polymer blending through 3D images of the obtained films. Compatibilization was performed in solution, upon functionalization of PE-HEMA with 1.4% molar of ODIN, a fluorescent molecule able to form multiple hydrogen bonds with EVOH and to act as a fluorescent probe. Different blends were synthesized, and the obtained films were analyzed by 2PM. For all compositions, it was demonstrated that ODIN is evenly distributed both on the surface and in the bulk. 2PM analysis of the thermally reprocessed specimen revealed that repeated reprocessing allows the reformation of ODIN dimers as the most stable H-bonding array in the solid state, partially reversing the compatibilization.