A High-Reliability RF MEMS Metal-Contact Switch Based on Al-Sc Alloy.

This paper presents a new metal-contact RF MEMS switch based on an Al-Sc alloy. The use of an Al-Sc alloy is intended to replace the traditional Au-Au contact, which can greatly improve the hardness of the contact, and thus improve the reliability of the switch. The multi-layer stack structure is adopted to achieve the low switch line resistance and hard contact surface. The polyimide sacrificial layer process is developed and optimized, and the RF switches are fabricated and tested for pull-in voltage, S-parameters, and switching time. The switch shows high isolation of more than 24 dB and a low insertion loss of less than 0.9 dB in the frequency range of 0.1-6 GHz.

Effects of Mask Material on Lateral Undercut of Silicon Dry Etching.

The silicon etching process is a core component of production in the semiconductor industry. Undercut is a nonideal effect in silicon dry etching. A reduced undercut is desired when preparing structures that demand a good sidewall morphology, while an enlarged undercut is conducive to the fabrication of microstructure tips. Undercut is related to not only the production parameters but also the mask materials. In this study, five mask materials-Cr, Al, ITO, SiNx, and SiO2-are chosen to compare the undercut effect caused by the isotropic etching process and the Bosch process. In the Bosch process, the SiNx mask causes the largest undercut, and the SiO2 mask causes the smallest undercut. In the isotropic process, the results are reversed. The effect of charges in the mask layer is found to produce this result, and the effect of electrons accumulating during the process is found to be negligible. The undercut effect can be enhanced or suppressed by selecting appropriate mask materials, which is helpful in the MEMS process. Finally, using an Al mask, a tapered silicon tip with a top diameter of 119.3 nm is fabricated using the isotropic etching process.

Design and Fabrication of a Novel Poly-Si Microhotplate with Heat Compensation Structure.

I Microhotplates are critical devices in various MEMS sensors that could provide appropriate operating temperatures. In this paper, a novel design of poly-Si membrane microhotplates with a heat compensation structure was reported. The main objective of this work was to design and fabricate the poly-Si microhotplate, and the thermal and electrical performance of the microhotplates were also investigated. The poly-Si resistive heater was deposited by LPCVD, and phosphorous doping was applied by in situ doping process to reduce the resistance of poly-Si. In order to obtain a uniform temperature distribution, a series of S-shaped compensation structures were fabricated at the edge of the resistive heater. LPCVD SiNx layers deposited on both sides of poly-Si were used as both the mechanical supporting layer and the electrical isolation layer. The Pt electrode was fabricated on the top of the microhotplate for temperature detection. The area of the heating membrane was 1 mm × 1 mm. Various parameters of the different size devices were simulated and measured, including temperature distribution, power consumption, thermal expansion and response time. The simulation and electrical-thermal measurement results were reported. For microhotplates with a heat compensation structure, the membrane temperature reached 811.7 °C when the applied voltage was 5.5 V at a heating power of 148.3 mW. A 3.8 V DC voltage was applied to measure the temperature distribution; the maximum temperature was 397.6 °C, and the area where the temperature reached 90% covered about 73.8% when the applied voltage was 3.8 V at a heating power of 70.8 mW. The heating response time was 17 ms while the microhotplate was heated to 400 °C from room temperature, and the cooling response time was 32 ms while the device was recovered to room temperature. This microhotplate has many advantages, such as uniform temperature distribution, low power consumption and fast response, which are suitable for MEMS gas sensors, humidity sensors, gas flow sensors, etc.

A Novel Packaged Ultra-High Q Silicon MEMS Butterfly Vibratory Gyroscope.

A novel three-dimensional (3D) wafer-level sandwich packaging technology is here applied in the dual mass MEMS butterfly vibratory gyroscope (BFVG) to achieve ultra-high Q factor. A GIS (glass in silicon) composite substrate with glass as the main body and low-resistance silicon column as the vertical lead is processed by glass reflow technology, which effectively avoids air leakage caused by thermal stress mismatch. Sputter getter material is used on the glass cap to further improve the vacuum degree. The Silicon-On-Insulator (SOI) gyroscope structure is sandwiched between the composite substrate and glass cap to realize vertical electrical interconnection by high-vacuum anodic bonding. The Q factors of drive and sense modes in BFVG measured by the self-developed double closed-loop circuit system are significantly improved to 8.628 times and 2.779 times higher than those of the traditional ceramic shell package. The experimental results of the processed gyroscope also demonstrate a high resolution of 0.1°/s, the scale factor of 1.302 mV/(°/s), and nonlinearity of 558 ppm in the full-scale range of ±1800°/s. By calculating the Allen variance, we obtained the angular random walk (ARW) of 1.281°/√h and low bias instability (BI) of 9.789°/h. The process error makes the actual drive and sense frequency of the gyroscope deviate by 8.989% and 5.367% compared with the simulation.

A High-Performance MEMS Accelerometer with an Improved TGV Process of Low Cost.

High-performance MEMS accelerometers usually use a pendulum structure with a larger mass. Although the performance of the device is guaranteed, the manufacturing cost is high. This paper proposes a method of fabricating high-performance MEMS accelerometers with a TGV process, which can reduce the manufacturing cost and ensure the low-noise characteristics of the device. The TGV processing relies on laser drilling, the metal filling in the hole is based on the casting mold and CMP, and the packaging adopts the three-layer anodic bonding process. Moreover, for the first time, the casting mold process is introduced to the preparation of MEMS devices. In terms of structural design, the stopper uses distributed comb electrodes for overload displacement suppression, and the gas released by the packaging method provides excellent mechanical damping characteristics. The prepared accelerometer has an anti-overload capability of 10,000 g, the noise density is less than 0.001°/√Hz, and it has ultra-high performance in tilt measurement.

A critical evaluation of the catalytic role of CO2 in propane dehydrogenation catalyzed by chromium oxide from a DFT-based microkinetic simulation.

Propane dehydrogenation under CO2 is an important catalytic route to obtain propene with a good balance between selectivity and stability. However, a precise description of the catalytic role of CO2 in propane dehydrogenation is still absent. In this work, we focus on the elucidation of the role of CO2 by using DFT-based microkinetic simulation. The influence of CO2 is categorized as direct and indirect effects. It was found that the chemisorbed CO2 can directly abstract hydrogen from propane and propyl with a comparable barrier to the counterpart at the surface oxygen site. On the other hand, the dissociation of CO2 yields active surface species of CO* and O* which are actively involved in the removal of surface hydroxyls. It is found that the TOFs of both propane conversion and propene formation are significantly increased with the presence of CO2, which is explained by the reduced apparent activation energy. The primary hydrogen abstraction is identified to be the most influential step from the DRC analysis. The main effects of CO2 are concluded to be removing hydrogen and restoring oxygen vacancies from reaction pathway analysis.

Revealing the role of HBr in propane dehydrogenation on CeO2(111) via DFT-based microkinetic simulation.

HBr, as a soft oxidant, has been demonstrated to have a good balance between stability and selectivity in catalytic propane dehydrogenation. However, the origin of enhancements induced by HBr (hydrobromic acid) remains elusive. In this study, DFT-based microkinetic simulations were performed to reveal the reaction pathway and performance of propane dehydrogenation catalyzed by CeO2 in the presence of HBr. Three scenarios were under the investigations, which are pristine, dissociated HBr, and Br assisted surface hydroxyl. The calculations indicated that HBr significantly enhanced the adsorption of propane and provided alternative pathways for propene formation. More significantly, the energy barrier of C-H bond activation in propane was reduced with the assistance of HBr. It was very interesting to find that the reactivity of surface hydroxyl remarkably increased for C-H bond activation in the presence of HBr. The positive role of HBr is clearly evident from the microkinetic simulation. The TOFs of both propane conversion and propene formation increased after the introduction of HBr, which correlates with the apparent decreased activation energy. The reaction rate has a first order dependence on C3H8 and zero order dependence on HBr. The current study lays out a solid basis for further optimization of the performance of propane dehydrogenation.

ZRO Drift Reduction of MEMS Gyroscopes via Internal and Packaging Stress Release.

Zero-rate output (ZRO) drift induces deteriorated micro-electromechanical system (MEMS) gyroscope performances, severely limiting its practical applications. Hence, it is vital to explore an effective method toward ZRO drift reduction. In this work, we conduct an elaborate investigation on the impacts of the internal and packaging stresses on the ZRO drift at the thermal start-up stage and propose a temperature-induced stress release method to reduce the duration and magnitude of ZRO drift. Self-developed high-Q dual-mass tuning fork gyroscopes (TFGs) are adopted to study the correlations between temperature, frequency, and ZRO drift. Furthermore, a rigorous finite element simulation model is built based on the actual device and packaging structure, revealing the temperature and stresses distribution inside TFGs. Meanwhile, the relationship between temperature and stresses are deeply explored. Moreover, we introduce a temperature-induced stress release process to generate thermal stresses and reduce the temperature-related device sensitivity. By this way, the ZRO drift duration is drastically reduced from ~2000 s to ~890 s, and the drift magnitude decreases from ~0.4 °/s to ~0.23 °/s. The optimized device achieves a small bias instability (BI) of 7.903 °/h and a low angle random walk (ARW) of 0.792 °/√ h, and its long-term bias performance is significantly improved.

A Novel High-Q Dual-Mass MEMS Tuning Fork Gyroscope Based on 3D Wafer-Level Packaging.

Tuning fork gyroscopes (TFGs) are promising for potential high-precision applications. This work proposes and experimentally demonstrates a novel high-Q dual-mass tuning fork microelectromechanical system (MEMS) gyroscope utilizing three-dimensional (3D) packaging techniques. Except for two symmetrically decoupled proof masses (PM) with synchronization structures, a symmetrically decoupled lever structure is designed to force the antiparallel, antiphase drive mode motion and eliminate low frequency spurious modes. Thermoelastic damping (TED) and anchor loss are greatly reduced by the linearly coupled, momentum- and torque-balanced antiphase sense mode. Moreover, a novel 3D packaging technique is used to realize high Q-factors. A composite substrate encapsulation cap, fabricated by through-silicon-via (TSV) and glass-in-silicon (GIS) reflow processes, is anodically bonded to the wafer-scale sensing structures. A self-developed control circuit is adopted to realize loop control and characterize gyroscope performances. It is shown that a high-reliability electrical connection, together with a high air impermeability package, can be fulfilled with this 3D packaging technique. Furthermore, the Q-factors of the drive and sense modes reach up to 51,947 and 49,249, respectively. This TFG realizes a wide measurement range of ±1800 °/s and a high resolution of 0.1°/s with a scale factor nonlinearity of 720 ppm after automatic mode matching. In addition, long-term zero-rate output (ZRO) drift can be effectively suppressed by temperature compensation, inducing a small angle random walk (ARW) of 0.923°/√h and a low bias instability (BI) of 9.270°/h.

A Real-Time Circuit Phase Delay Correction System for MEMS Vibratory Gyroscopes.

With the development of the designing and manufacturing level for micro-electromechanical system (MEMS) gyroscopes, the control circuit system has become a key point to determine their internal performance. Nevertheless, the phase delay of electronic components may result in some serious hazards. This study described a real-time circuit phase delay correction system for MEMS vibratory gyroscopes. A detailed theoretical analysis was provided to clarify the influence of circuit phase delay on the in-phase and quadrature (IQ) coupling characteristics and the zero-rate output (ZRO) utilizing a force-to-rebalance (FTR) closed-loop detection and quadrature correction system. By deducing the relationship between the amplitude-frequency, the phase-frequency of the MEMS gyroscope, and the phase relationship of the whole control loop, a real-time correction system was proposed to automatically adjust the phase reference value of the phase-locked loop (PLL) and thus compensate for the real-time circuit phase delay. The experimental results showed that the correction system can accurately measure and compensate the circuit phase delay in real time. Furthermore, the unwanted IQ coupling can be eliminated and the ZRO was decreased by 755% to 0.095°/s. This correction system realized a small angle random walk of 0.978°/√h and a low bias instability of 9.458°/h together with a scale factor nonlinearity of 255 ppm at room temperature. The thermal drift of the ZRO was reduced to 0.0034°/s/°C at a temperature range from -20 to 70 °C.

A Novel Fabrication Method for a Capacitive MEMS Accelerometer Based on Glass-Silicon Composite Wafers.

In this paper, we report a novel teeter-totter type accelerometer based on glass-silicon composite wafers. Unlike the ordinary micro-electro-mechanical systems (MEMS) accelerometers, the entire structure of the accelerometer, includes the mass, the springs, and the composite wafer. The composite wafer is expected to serve as the electrical feedthrough and the fixed capacitance plate at the same time, to simplify the fabrication process, and to save on chip area. It is manufactured by filling melted borosilicate glass into an etched silicon wafer and polishing the wafer flat. A sensitivity of 51.622 mV/g in the range of ±5 g (g = 9.8 m/s2), a zero-bias stability under 0.2 mg, and the noise floor with 11.28 µg/√Hz were obtained, which meet the needs of most acceleration detecting applications. The micromachining solution is beneficial for vertical interconnection and miniaturization of MEMS devices.

Revealing the role of nitrogen dopants in tuning the electronic and optical properties of graphene quantum dots via a TD-DFT study.

Graphene quantum dots (GQDs) have been suggested to have a wide range of applications due to their unique electronic and optical properties. Moreover, heteroatom doping has become a viable way to fine-tune the properties of GQDs. However, the working principle of the doping strategy is still not conclusive. In this study, the effects of size, configuration of the nitrogen dopant, and N/C ratio on the electronic and optical properties of GQDs have been carefully examined. First, the variation of the adsorption wavelength of pristine GQDs was evaluated for which a linear relation is established against different diameters. Moreover, it is found that both the configuration and content of nitrogen dopants have a significant impact on the adsorption wavelength and band gap of GQDs. In particular, different nitrogen species could have exactly opposite effects on the adsorption behavior. The origin of the nitrogen doping effect is calibrated from orbital localization, charge analysis, natural transition orbitals, and atomic contribution towards excitation. It is noted that nitrogen doping can simultaneously reduce both light adsorption energy and emission energy compared with the pristine one. This study provides an insightful explanation for the electronic and optical properties of GQDs and consolidates the theory base of the doping strategy.

The Characteristics and Locking Process of Nonlinear MEMS Gyroscopes.

With the miniaturization of micro-electro-mechanical system (MEMS) gyroscopes, it is necessary to study their nonlinearity. The phase-frequency characteristics, which affect the start-up time, are crucial for guaranteeing the gyroscopes' applicability. Nevertheless, although the amplitude-frequency (A-f) effect, one of the most obvious problems in nonlinearity, has been well studied, the phase response of nonlinear gyroscopes is rarely mentioned. In this work, an elaborate study on the characteristics and locking process of nonlinear MEMS gyroscopes is reported. We solved the dynamic equation using the harmonic balance method and simulated the phase-locked loop (PLL) actuation process with an iterative calculation method. It was shown that there existed an apparent overhanging and multi-valued phenomenon in both the amplitude-frequency and phase-frequency curves of nonlinear gyroscopes. Meanwhile, it was ascertained by our simulations that the locking time of PLL was retarded by the nonlinearity under certain conditions. Moreover, experiments demonstrating the effect of nonlinearity were aggravated by the high quality factor of the drive mode due to the instability of the vibration amplitude. A nonlinear PLL (NPLL) containing an integrator was designed to accelerate the locking process. The results show that the start-up time was reduced by an order of magnitude when the appropriate integral coefficient was used.

A Novel Piezoresistive MEMS Pressure Sensors Based on Temporary Bonding Technology.

A miniature piezoresistive pressure sensor fabricated by temporary bonding technology was reported in this paper. The sensing membrane was formed on the device layer of an SOI (Silicon-On-Insulator) wafer, which was bonded to borosilicate glass (Borofloat 33, BF33) wafer for supporting before releasing with Cu-Cu bonding after boron doping and electrode patterning. The handle layer was bonded to another BF33 wafer after thinning and etching. Finally, the substrate BF33 wafer was thinned by chemical mechanical polishing (CMP) to reduce the total device thickness. The copper temporary bonding layer was removed by acid solution after dicing to release the sensing membrane. The chip area of the fabricated pressure sensor was of 1600 µm × 650 µm × 104 µm, and the size of a sensing membrane was of 100 µm × 100 µm × 2 µm. A higher sensitivity of 36 µV/(V∙kPa) in the range of 0-180 kPa was obtained. By further reducing the width, the fabricated miniature pressure sensor could be easily mounted in a medical catheter for the blood pressure measurement.

A Resonant Z-Axis Aluminum Nitride Thin-Film Piezoelectric MEMS Accelerometer.

In this paper, we report a novel aluminum nitride (AlN) thin-film piezoelectric resonant accelerometer. Different from the ordinary MEMS (micro-electro-mechanical systems) resonant accelerometers, the entire structure of the accelerometer, including the mass and the springs, is excited to resonate in-plane, and the resonance frequency is sensitive to the out-plane acceleration. The structure is centrosymmetrical with serpentine electrodes laid on supporting beams for driving and sensing. The stiffness of the supporting beams changes when an out-plane inertial force is applied on the structure. Therefore, the resonance frequency of the accelerometer will also change under the inertial force. The working principle is analyzed and the properties are simulated in the paper. The proposed AlN accelerometer is fabricated by the MEMS technology, and the structure is released by an ICP isotropic etching. The resonance frequency is 24.66 kHz at a static state. The quality factor is 1868. The relative sensitivity of this accelerometer, defined as the shift in the resonance frequency per gravity unit (1 g = 9.8 m/s2) is 346 ppm/g. The linearity of the accelerometer is 0.9988. The temperature coefficient of frequency (TCF) of this accelerometer is -2.628 Hz/°C (i.e., -106 ppm/°C), tested from -40 °C to 85 °C.

Research on the Protrusions Near Silicon-Glass Interface during Cavity Fabrication.

Taking advantage of good hermeticity, tiny parasitic capacitance, batch mode fabrication, and compatibility with multiple bonding techniques, the glass-silicon composite substrate manufactured by the glass reflow process has great potential to achieve 3D wafer-level packaging for high performance. However, the difference in etching characteristics between silicon and glass inevitably leads to the formation of the undesired micro-protrusions near the silicon-glass interface when preparing a shallow cavity etched around a few microns in the composite substrate. The micro-protrusions have a comparable height with the depth of the cavity, which increases the risks of damages to sensitive structures and may even trigger electrical breakdown, resulting in thorough device failure. In this paper, we studied the characteristics of the chemical composition and etching mechanisms at the interface carefully and proposed the corresponding optimized solutions that utilized plasma accumulation at the interface to accelerate etching and bridge the gap in etching rates between different chemical compositions. Finally, a smooth transition of 131.1 nm was achieved at the interface, obtaining an ideal etching cavity surface and experimentally demonstrating the feasibility of our proposal. The micromachining solution is beneficial for improving the yield and structural design flexibility of higher performance micro-electromechanical systems (MEMS) devices.

A Decoupling Design with T-Shape Structure for the Aluminum Nitride Gyroscope.

This paper reports a novel design for the decoupling of microelectromechanical systems (MEMS) gyroscopes. The MEMS gyroscope is based on piezoelectric aluminum nitride (AlN) film, and the main structure is a mass hung by T-shape beams. A pair of parallel drive electrodes are symmetrically placed on the surface of the vertical bar for driving the oscillating mass. A serpentine sense electrode is placed on the lateral bar. When the gyroscope is oscillating in drive mode, charges with equal quantity and opposite sign will be polarized and distributed symmetrically along the lateral bar. These charges neutralize each other at the sense electrode. Therefore, no coupling signals can be detected from the sense electrode. This design can realize the decoupling between the drive mode and sense mode. In this work, the T-shape decoupled structure was designed as the key component of an AlN piezoelectric gyroscope and the whole structure was simulated by COMSOL Multiphysics 5.2a. The working principle of the decoupling is described in detail. Electrical properties were characterized by the dynamic signal analyzer. According to the test results, the drive mode and the sense mode are decoupled. The coefficient of orthogonal coupling is 1.55%.

Halogenation of graphene triggered by heteroatom doping.

Halogenation is one of the most important ways to tailor the properties of graphene. We demonstrate for the first time that boron and nitrogen doping can effectively tune the interactions between halogen diatomic molecules and graphene from first principles calculations. Boron and nitrogen doping disrupt the regular pi-electron pattern and create spin density and orbital polarization. More interesting, nitrogen and boron doping not only significantly increases the binding energies of Cl2, Br2, and I2 but also induces the spontaneous dissociation of F2. The tunable effects from nitrogen and boron doping can adjust the interactions in a wide range. Overall, it is suggested that doping can be a very promising method for the facile halogenation of graphene.

Design and Simulation of A Novel Piezoelectric AlN-Si Cantilever Gyroscope.

A novel design of piezoelectric aluminum nitride (AlN)-Si composite cantilever gyroscope is proposed in this paper. The cantilever is stimulated to oscillate in plane by two inverse voltages which are applied on the two paralleled drive electrodes, respectively. The whole working principles are deduced, which based on the piezoelectric equation and elastic vibration equation. In this work, a cantilever gyroscope has been simulated and optimized by COMSOL Multiphysics 5.2a. The drive mode frequency is 87.422 kHz, and the sense mode frequency is 87.414 kHz. The theoretical sensitivity of this gyroscope is 0.145 pm/◦/s. This gyroscope has a small size and simple structure. It will be a better choice for the consumer electronics.

PSPICE Hybrid Modeling and Simulation of Capacitive Micro-Gyroscopes.

With an aim to reduce the cost of prototype development, this paper establishes a PSPICE hybrid model for the simulation of capacitive microelectromechanical systems (MEMS) gyroscopes. This is achieved by modeling gyroscopes in different modules, then connecting them in accordance with the corresponding principle diagram. Systematic simulations of this model are implemented along with a consideration of details of MEMS gyroscopes, including a capacitance model without approximation, mechanical thermal noise, and the effect of ambient temperature. The temperature compensation scheme and optimization of interface circuits are achieved based on the hybrid closed-loop simulation of MEMS gyroscopes. The simulation results show that the final output voltage is proportional to the angular rate input, which verifies the validity of this model.