RESUMEN
Highly ordered polycrystalline indium gallium oxide (PC-IGO) film is obtained by the crystallization of room temperature sputtered amorphous IGO on a hot plate at 350 °C for 1 h and then annealed for 1 h in an N2 O environment. A high-density PC-IGO of ≈7.15 g cm-3 with reduced oxygen vacancy (≈14.83%) and hydroxyl (OH) related defects (≈10.96%) has been obtained by N2 O annealing. Self-aligned coplanar thin-film transistor (TFT) with the PC-IGO exhibits the average saturation mobility of 78.73 cm2 V-1 s-1 , threshold voltage of -1.07 V, subthreshold swing of 0.147 V dec-1 , and the on/off current ratio of over 108 . The TFTs show excellent stability under bias-temperature stress with a negligible threshold voltage shift (ΔVTH ) of + 0.1 and -0.1 V for the positive and negative bias stresses, respectively. The TFTs exhibit very stable environmental stability when the TFTs are stored under high humidity (85%) and a high temperature (85 °C) for 2 days. The ring oscillator and the gate driver mode of the PC-IGO TFTs exhibit the propagation delay of 7.44 ns/stage with rising/falling times of less than 0.7 µs, respectively. Therefore, the PC-IGO TFTs are suitable for large area, high-resolution active-matrix organic, and inorganic light-emitting diodes displays.
RESUMEN
Power devices (PD) are ubiquitous elements of the modern electronics industry that must satisfy the rigorous and diverse demands for robust power conversion systems that are essential for emerging technologies including Internet of Things (IoT), mobile electronics, and wearable devices. However, conventional PDs based on "bulk" and "single-crystal" semiconductors require high temperature (> 1000 °C) fabrication processing and a thick (typically a few tens to 100 µm) drift layer, thereby preventing their applications to compact devices, where PDs must be fabricated on a heat sensitive and flexible substrate. Here we report next-generation PDs based on "thin-films" of "amorphous" oxide semiconductors with the performance exceeding the silicon limit (a theoretical limit for a PD based on bulk single-crystal silicon). The breakthrough was achieved by the creation of an ideal Schottky interface without Fermi-level pinning at the interface, resulting in low specific on-resistance Ron,sp (< 1 × 10-4 Ω cm2) and high breakdown voltage VBD (~ 100 V). To demonstrate the unprecedented capability of the amorphous thin-film oxide power devices (ATOPs), we successfully fabricated a prototype on a flexible polyimide film, which is not compatible with the fabrication process of bulk single-crystal devices. The ATOP will play a central role in the development of next generation advanced technologies where devices require large area fabrication on flexible substrates and three-dimensional integration.
RESUMEN
Suppression of nucleation around a gold electrode during pentacene growth on a SiO2 channel is found by photoemission electron microscopy. Mass flow is driven by the difference between the molecular orientations on SiO2 and gold. The poor connectivity at the channel/electrode boundary causes degradation in the performance of a field-effect transistor, which is found to be improved by self-assembled monolayer treatment on the electrode (see figure; thickness in monolayers (ML)).
RESUMEN
A poly(3-dodecylthiophene-2,5-diyl) film having in-plane anisotropic molecular arrangement was successfully fabricated by transferring its Langmuir-Blodgett film onto a step-bunched Si(111) substrate. Polarized near-edge X-ray absorption fine structure measurements revealed that the polythiophene main chains are preferentially orientated along periodic facet/terrace nanostructures on the step-bunched substrate, whereas less anisotropy was found on a flat substrate. The step-bunched Si substrate has been proved to be effective for controlling the in-plane molecular arrangement in the polymer thin film.