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Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process.
Kim, Bong Hoon; Lee, Jungyup; Won, Sang Min; Xie, Zhaoqian; Chang, Jan-Kai; Yu, Yongjoon; Cho, Youn Kyoung; Jang, Hokyung; Jeong, Ji Yoon; Lee, Yechan; Ryu, Arin; Kim, Do Hoon; Lee, Kun Hyuck; Lee, Jong Yoon; Liu, Fei; Wang, Xueju; Huo, Qingze; Min, Seunghwan; Wu, Di; Ji, Bowen; Banks, Anthony; Kim, Jeonghyun; Oh, Nuri; Jin, Hyeong Min; Han, Seungyong; Kang, Daeshik; Lee, Chi Hwan; Song, Young Min; Zhang, Yihui; Huang, Yonggang; Jang, Kyung-In; Rogers, John A.
Afiliación
  • Kim BH; Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Neurological Surgery, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute & Feinberg Medical School, Center for Bio-Integrated Electronics , Northwestern University , E
  • Lee J; Frederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
  • Won SM; Frederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
  • Xie Z; Frederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
  • Chang JK; Department of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering , Northwestern University , Evanston , Illinois 60208 , United States.
  • Yu Y; AML, Department of Engineering Mechanics, Center for Mechanics and Materials , Tsinghua University , Beijing 100084 , China.
  • Cho YK; Frederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
  • Jang H; Frederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
  • Jeong JY; Frederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
  • Lee Y; Frederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
  • Ryu A; Frederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
  • Kim DH; Frederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
  • Lee KH; Frederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
  • Lee JY; Frederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
  • Liu F; Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Neurological Surgery, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute & Feinberg Medical School, Center for Bio-Integrated Electronics , Northwestern University , E
  • Wang X; Frederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
  • Huo Q; Center for Mechanics and Materials, Center for Flexible Electronics Technology, AML, Department of Engineering Mechanics , Tsinghua University , Beijing 100084 , China.
  • Min S; Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Neurological Surgery, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute & Feinberg Medical School, Center for Bio-Integrated Electronics , Northwestern University , E
  • Wu D; Department of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering , Northwestern University , Evanston , Illinois 60208 , United States.
  • Ji B; Frederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
  • Banks A; Department of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering , Northwestern University , Evanston , Illinois 60208 , United States.
  • Kim J; AML, Department of Engineering Mechanics, Center for Mechanics and Materials , Tsinghua University , Beijing 100084 , China.
  • Oh N; Department of Civil and Environmental Engineering, Mechanical Engineering, and Materials Science and Engineering , Northwestern University , Evanston , Illinois 60208 , United States.
  • Jin HM; Departments of Materials Science and Engineering, Biomedical Engineering, Chemistry, Neurological Surgery, Mechanical Engineering, Electrical Engineering and Computer Science, Simpson Querrey Institute & Feinberg Medical School, Center for Bio-Integrated Electronics , Northwestern University , E
  • Han S; Frederick Seitz Materials Research Laboratory , University of Illinois at Urbana-Champaign , Urbana , Illinois 61801 , United States.
  • Kang D; Department of Electronics Convergence Engineering , Kwangwoon University , Seoul 01897 , Republic of Korea.
  • Lee CH; Division of Materials Science and Engineering , Hanyang University , Seoul 04763 , Republic of Korea.
  • Song YM; Institute for Molecular Engineering , The University of Chicago , Chicago , Illinois 60637 , United States.
  • Zhang Y; Department of Mechanical Engineering , Ajou University , Suwon , 443-749 , Republic of Korea.
  • Huang Y; Department of Mechanical Engineering , Ajou University , Suwon , 443-749 , Republic of Korea.
  • Jang KI; Weldon School of Biomedical Engineering, School of Mechanical Engineering, The Center for Implantable Devices, and Birck Nanotechnology Center , Purdue University , West Lafayette , Indiana 47907 , United States.
  • Rogers JA; School of Electrical Engineering and Computer Science , Gwangju Institute of Science and Technology (GIST) , Gwangju 61005 , Republic of Korea.
ACS Nano ; 12(5): 4164-4171, 2018 05 22.
Article en En | MEDLINE | ID: mdl-29641889
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Texto completo: 1 Base de datos: MEDLINE Asunto principal: Silicio / Nanoestructuras / Electrónica Idioma: En Revista: ACS Nano Año: 2018 Tipo del documento: Article
Texto completo
Imprimir
XML
PubMed Links
Buscar en Google

Texto completo: 1 Base de datos: MEDLINE Asunto principal: Silicio / Nanoestructuras / Electrónica Idioma: En Revista: ACS Nano Año: 2018 Tipo del documento: Article