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Miniaturized electromechanical devices for the characterization of the biomechanics of deep tissue.
Song, Enming; Xie, Zhaoqian; Bai, Wubin; Luan, Haiwen; Ji, Bowen; Ning, Xin; Xia, Yu; Baek, Janice Mihyun; Lee, Yujin; Avila, Raudel; Chen, Huang-Yu; Kim, Jae-Hwan; Madhvapathy, Surabhi; Yao, Kuanming; Li, Dengfeng; Zhou, Jingkun; Han, Mengdi; Won, Sang Min; Zhang, Xinyuan; Myers, Daniel J; Mei, Yongfeng; Guo, Xu; Xu, Shuai; Chang, Jan-Kai; Yu, Xinge; Huang, Yonggang; Rogers, John A.
Afiliación
  • Song E; Institute of Optoelectronics, Fudan University, Shanghai, China.
  • Xie Z; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
  • Bai W; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.
  • Luan H; Ningbo Institute of Dalian University of Technology, Ningbo, China.
  • Ji B; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Ning X; Department of Applied Physical Sciences, University of North Carolina at Chapel Hill, Chapel Hill, NC, USA.
  • Xia Y; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Baek JM; Unmanned System Research Institute, Northwestern Polytechnical University, Xi'an, China.
  • Lee Y; Department of Aerospace Engineering, The Pennsylvania State University, University Park, PA, USA.
  • Avila R; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Chen HY; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Kim JH; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Madhvapathy S; Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA.
  • Yao K; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Li D; Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL, USA.
  • Zhou J; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Han M; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
  • Won SM; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
  • Zhang X; Department of Biomedical Engineering, City University of Hong Kong, Hong Kong, China.
  • Myers DJ; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Mei Y; Department of Electrical and Computer Engineering, Sungkyunkwan University, Suwon, Republic of Korea.
  • Guo X; Department of Materials Science, State Key Laboratory of ASIC and Systems, Fudan University, Shanghai, China.
  • Xu S; Querrey Simpson Institute for Bioelectronics, Northwestern University, Evanston, IL, USA.
  • Chang JK; Department of Dermatology, Feinberg School of Medicine, Northwestern University, Chicago, IL, USA.
  • Yu X; Department of Materials Science, State Key Laboratory of ASIC and Systems, Fudan University, Shanghai, China.
  • Huang Y; State Key Laboratory of Structural Analysis for Industrial Equipment, Department of Engineering Mechanics, Dalian University of Technology, Dalian, China.
  • Rogers JA; Ningbo Institute of Dalian University of Technology, Ningbo, China.
Nat Biomed Eng ; 5(7): 759-771, 2021 07.
Article en En | MEDLINE | ID: mdl-34045731
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Texto completo: 1 Base de datos: MEDLINE Asunto principal: Piel / Técnicas Electroquímicas Idioma: En Revista: Nat Biomed Eng Año: 2021 Tipo del documento: Article
Texto completo
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XML
PubMed Links
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Texto completo: 1 Base de datos: MEDLINE Asunto principal: Piel / Técnicas Electroquímicas Idioma: En Revista: Nat Biomed Eng Año: 2021 Tipo del documento: Article