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Low-defect-density WS2 by hydroxide vapor phase deposition.
Wan, Yi; Li, En; Yu, Zhihao; Huang, Jing-Kai; Li, Ming-Yang; Chou, Ang-Sheng; Lee, Yi-Te; Lee, Chien-Ju; Hsu, Hung-Chang; Zhan, Qin; Aljarb, Areej; Fu, Jui-Han; Chiu, Shao-Pin; Wang, Xinran; Lin, Juhn-Jong; Chiu, Ya-Ping; Chang, Wen-Hao; Wang, Han; Shi, Yumeng; Lin, Nian; Cheng, Yingchun; Tung, Vincent; Li, Lain-Jong.
Afiliación
  • Wan Y; Physical Sciences and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal, Kingdom of Saudi Arabia.
  • Li E; Department of Mechanical Engineering, The University of Hong Kong, Hong Kong, China.
  • Yu Z; Department of Physics, The Hong Kong University of Science and Technology, Hong Kong, China.
  • Huang JK; Corporate Research, Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu, Taiwan.
  • Li MY; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Chou AS; School of Materials Science and Engineering, University of New South Wales, Sydney, NSW, Australia.
  • Lee YT; Corporate Research, Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu, Taiwan.
  • Lee CJ; Corporate Research, Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu, Taiwan.
  • Hsu HC; Department of Electrophysics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan.
  • Zhan Q; Department of Electrophysics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan.
  • Aljarb A; Department of Physics, National Taiwan University, Taipei, Taiwan.
  • Fu JH; Key Laboratory of Flexible Electronics & Institute of Advanced Materials, Nanjing Tech University, Nanjing, China.
  • Chiu SP; Department of Physics, King Abdulaziz University (KAAU), Jeddah, Saudi Arabia.
  • Wang X; Physical Sciences and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal, Kingdom of Saudi Arabia.
  • Lin JJ; Department of Chemical System and Engineering, School of Engineering, The University of Tokyo, Tokyo, Japan.
  • Chiu YP; Department of Electrophysics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan.
  • Chang WH; National Laboratory of Solid State Microstructures, School of Electronic Science and Engineering and Collaborative Innovation Center of Advanced Microstructures, Nanjing University, Nanjing, China.
  • Wang H; Department of Electrophysics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan.
  • Shi Y; Department of Physics, National Taiwan University, Taipei, Taiwan.
  • Lin N; Department of Electrophysics, National Yang Ming Chiao Tung University, Hsinchu, Taiwan.
  • Cheng Y; Research Center for Applied Sciences, Academia Sinica, Taipei, Taiwan.
  • Tung V; Corporate Research, Taiwan Semiconductor Manufacturing Company (TSMC), Hsinchu, Taiwan.
  • Li LJ; School of Electronics and Information Engineering, Shenzhen University, Shenzhen, China.
Nat Commun ; 13(1): 4149, 2022 Jul 18.
Article en En | MEDLINE | ID: mdl-35851038
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Texto completo: 1 Base de datos: MEDLINE Idioma: En Revista: Nat Commun Asunto de la revista: BIOLOGIA / CIENCIA Año: 2022 Tipo del documento: Article
Texto completo
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XML
PubMed Links
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Texto completo: 1 Base de datos: MEDLINE Idioma: En Revista: Nat Commun Asunto de la revista: BIOLOGIA / CIENCIA Año: 2022 Tipo del documento: Article